KR100282749B1 - 이방 전기전도성 조성물 - Google Patents

이방 전기전도성 조성물 Download PDF

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Publication number
KR100282749B1
KR100282749B1 KR1019980706118A KR19980706118A KR100282749B1 KR 100282749 B1 KR100282749 B1 KR 100282749B1 KR 1019980706118 A KR1019980706118 A KR 1019980706118A KR 19980706118 A KR19980706118 A KR 19980706118A KR 100282749 B1 KR100282749 B1 KR 100282749B1
Authority
KR
South Korea
Prior art keywords
anisotropic electroconductive
copper
film
resin
anisotropic
Prior art date
Application number
KR1019980706118A
Other languages
English (en)
Korean (ko)
Other versions
KR19990082387A (ko
Inventor
아끼노리 요꼬야마
또루 모리
Original Assignee
야마모토 카즈모토
아사히 가세이 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마모토 카즈모토, 아사히 가세이 고교 가부시키가이샤 filed Critical 야마모토 카즈모토
Publication of KR19990082387A publication Critical patent/KR19990082387A/ko
Application granted granted Critical
Publication of KR100282749B1 publication Critical patent/KR100282749B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
KR1019980706118A 1996-02-08 1997-02-07 이방 전기전도성 조성물 KR100282749B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2276796 1996-02-08
JP96-22767 1996-02-08
JP15977096 1996-06-20
JP96-159770 1996-06-20
PCT/JP1997/000318 WO1997029490A1 (fr) 1996-02-08 1997-02-07 Composition anisotrope conductrice

Publications (2)

Publication Number Publication Date
KR19990082387A KR19990082387A (ko) 1999-11-25
KR100282749B1 true KR100282749B1 (ko) 2001-02-15

Family

ID=26360031

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980706118A KR100282749B1 (ko) 1996-02-08 1997-02-07 이방 전기전도성 조성물

Country Status (8)

Country Link
US (1) US6190578B1 (de)
EP (1) EP0880146B1 (de)
JP (1) JP4079281B2 (de)
KR (1) KR100282749B1 (de)
CN (1) CN1096686C (de)
DE (1) DE69721231T2 (de)
TW (1) TW392179B (de)
WO (1) WO1997029490A1 (de)

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US7632559B2 (en) * 1998-11-05 2009-12-15 Sika Technology Ag Sound deadening and structural reinforcement compositions and methods of using the same
JP3660175B2 (ja) * 1998-11-25 2005-06-15 セイコーエプソン株式会社 実装構造体及び液晶装置の製造方法
KR100484246B1 (ko) * 2001-12-17 2005-04-20 (주)그린폴 폐전선 피복물을 이용한 전기전도성 조성물
JP4389148B2 (ja) 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
US20040043139A1 (en) * 2002-09-04 2004-03-04 Daniels John James Printer and method for manufacturing electronic circuits and displays
JP3917539B2 (ja) * 2003-02-27 2007-05-23 株式会社神戸製鋼所 粉末冶金用バインダー、粉末冶金用混合粉末およびその製造方法
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US6874573B2 (en) * 2003-07-31 2005-04-05 National Starch And Chemical Investment Holding Corporation Thermal interface material
JP3711992B2 (ja) * 2003-10-15 2005-11-02 住友電気工業株式会社 顆粒状の金属粉末
US20050226900A1 (en) * 2004-04-13 2005-10-13 Winton Brooks Clint D Skin and hair treatment composition and process for using same resulting in controllably-releasable fragrance and/or malodour counteractant evolution
JP4587449B2 (ja) * 2004-04-28 2010-11-24 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜担持テープ
KR100654529B1 (ko) * 2005-02-23 2006-12-05 제일모직주식회사 이방 도전성 접착용 조성물
CA2666404A1 (en) * 2006-10-10 2008-04-17 Hitachi Chemical Company, Ltd. Connected structure and method for manufacture thereof
WO2009022574A1 (ja) * 2007-08-10 2009-02-19 Asahi Kasei E-Materials Corporation 接着剤及び接合体
US8293144B2 (en) * 2007-10-24 2012-10-23 Dowa Electronics Materials Co., Ltd. Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
CN101835866B (zh) 2007-11-29 2013-01-02 日立化成工业株式会社 电路部件连接用粘接剂以及半导体装置
US20110038124A1 (en) * 2008-04-21 2011-02-17 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US7857997B2 (en) * 2008-05-28 2010-12-28 Bemis Company, Inc. Conductive ink formulations
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
US20100078788A1 (en) * 2008-09-26 2010-04-01 Amir Wagiman Package-on-package assembly and method
US20110048062A1 (en) * 2009-03-25 2011-03-03 Thomas Gielda Portable Cooling Unit
JP4934166B2 (ja) * 2009-05-25 2012-05-16 住友電気工業株式会社 電極の接着剤接続構造、電子機器およびその組立方法
US20120305295A1 (en) * 2010-02-03 2012-12-06 Showa Denko K.K. Thermosetting composition
JP5415334B2 (ja) * 2010-03-26 2014-02-12 ナミックス株式会社 先供給型液状半導体封止樹脂組成物
JP6334842B2 (ja) * 2012-12-20 2018-05-30 旭化成株式会社 導電性ポリアセタール樹脂組成物のペレット及びその製造方法
JP6664147B2 (ja) * 2013-04-02 2020-03-13 国立大学法人大阪大学 異方性導電フィルム及び異方性導電接続体
WO2016017618A1 (ja) * 2014-07-29 2016-02-04 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
EP3093852B1 (de) * 2015-05-13 2017-12-27 Heraeus Deutschland GmbH & Co. KG Verwendung einer elektrisch leitfähigen zusammensetzung
EP3093319A1 (de) * 2015-05-13 2016-11-16 Heraeus Deutschland GmbH & Co. KG Elektrisch leitfähige zusammensetzung
CN105295760A (zh) * 2015-10-23 2016-02-03 浙江欧仁新材料有限公司 一种各向异性导电双面胶
US20190077072A1 (en) * 2017-09-11 2019-03-14 Duke University Three-dimensional (3d) printing and injection molding conductive filaments and methods of producing and using the same
CA3039936C (en) * 2017-09-29 2021-05-25 Jx Nippon Mining & Metals Corporation Metal powder for additive manufacturing metal laminate and metal additive manufactured object manufactured using said metal powder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773730A (ja) * 1993-06-29 1995-03-17 Asahi Chem Ind Co Ltd 導電性粉末

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JPS6155809A (ja) 1984-08-27 1986-03-20 日立化成工業株式会社 導電性接着フイルム巻重体
JPH0793053B2 (ja) * 1987-08-31 1995-10-09 日立化成工業株式会社 ポリイミドフィルム状成形物
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
CA2058414C (en) * 1990-03-19 1995-11-14 Akinori Yokoyama High temperature baking paste
JP2663309B2 (ja) 1991-01-16 1997-10-15 株式会社小糸製作所 前照灯の照射軸傾動装置
JPH0540402A (ja) 1991-08-06 1993-02-19 Canon Inc 現像装置
JPH0697573A (ja) 1992-09-14 1994-04-08 Hitachi Ltd 半導体レーザ及びその製造方法
JP3578484B2 (ja) 1993-06-29 2004-10-20 旭化成エレクトロニクス株式会社 異方導電接続用組成物
JP3132700B2 (ja) 1993-08-25 2001-02-05 日本電信電話株式会社 情報予約蓄積方式
JPH0716784A (ja) 1993-07-06 1995-01-20 Asahi Chem Ind Co Ltd Ｉｃチップの基板電極接続用導電性粉末及びペースト
JPH0793053A (ja) 1993-09-28 1995-04-07 Omron Corp Ｐｏｓシステム用制御ボード
JPH07118618A (ja) 1993-10-22 1995-05-09 Three Bond Co Ltd ファインピッチ用異方導電性接着剤
JP3391870B2 (ja) 1993-12-17 2003-03-31 住友ベークライト株式会社 異方導電フィルム
JP3364695B2 (ja) 1993-12-28 2003-01-08 ソニーケミカル株式会社 回路接続部の再生方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773730A (ja) * 1993-06-29 1995-03-17 Asahi Chem Ind Co Ltd 導電性粉末

Also Published As

Publication number Publication date
WO1997029490A1 (fr) 1997-08-14
DE69721231T2 (de) 2004-03-25
CN1210614A (zh) 1999-03-10
EP0880146B1 (de) 2003-04-23
JP4079281B2 (ja) 2008-04-23
KR19990082387A (ko) 1999-11-25
CN1096686C (zh) 2002-12-18
TW392179B (en) 2000-06-01
DE69721231D1 (de) 2003-05-28
EP0880146A1 (de) 1998-11-25
US6190578B1 (en) 2001-02-20
EP0880146A4 (de) 1999-04-14

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