KR0168889B1 - 세정액, 세정방법 및 세정장치 - Google Patents
세정액, 세정방법 및 세정장치 Download PDFInfo
- Publication number
- KR0168889B1 KR0168889B1 KR1019940012269A KR19940012269A KR0168889B1 KR 0168889 B1 KR0168889 B1 KR 0168889B1 KR 1019940012269 A KR1019940012269 A KR 1019940012269A KR 19940012269 A KR19940012269 A KR 19940012269A KR 0168889 B1 KR0168889 B1 KR 0168889B1
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- flux
- cleaning
- solvent
- washing
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 124
- 238000000034 method Methods 0.000 title claims description 38
- 239000012530 fluid Substances 0.000 title 1
- 230000004907 flux Effects 0.000 claims abstract description 111
- 239000007788 liquid Substances 0.000 claims abstract description 94
- 238000005406 washing Methods 0.000 claims abstract description 70
- 239000002253 acid Substances 0.000 claims abstract description 69
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000002904 solvent Substances 0.000 claims abstract description 39
- 239000008096 xylene Substances 0.000 claims abstract description 36
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000003960 organic solvent Substances 0.000 claims abstract description 35
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 18
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000460 chlorine Substances 0.000 claims abstract description 16
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 16
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical compound CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims abstract description 13
- 150000007524 organic acids Chemical class 0.000 claims abstract description 9
- 239000005711 Benzoic acid Substances 0.000 claims abstract description 8
- 235000010233 benzoic acid Nutrition 0.000 claims abstract description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 235000005985 organic acids Nutrition 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 52
- -1 methyl β-methoxyisobutyrate Chemical compound 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 25
- 229910052799 carbon Inorganic materials 0.000 claims description 25
- 235000011054 acetic acid Nutrition 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 19
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 15
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 11
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 10
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- 239000003849 aromatic solvent Substances 0.000 claims description 8
- 150000002576 ketones Chemical class 0.000 claims description 8
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- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 claims description 6
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 claims description 6
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 claims description 6
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- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 6
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- 239000002699 waste material Substances 0.000 claims 1
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- 239000003112 inhibitor Substances 0.000 abstract description 2
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- 239000007789 gas Substances 0.000 description 17
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- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 8
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 8
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 7
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- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 7
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Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
- C11D7/262—Alcohols; Phenols fatty or with at least 8 carbon atoms in the alkyl or alkenyl chain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3227—Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/04—Apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13073693 | 1993-06-01 | ||
| JP93-130736 | 1993-06-01 | ||
| JP04741494A JP3390245B2 (ja) | 1993-06-01 | 1994-03-17 | 洗浄液及び洗浄方法 |
| JP94-47414 | 1994-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950002541A KR950002541A (ko) | 1995-01-04 |
| KR0168889B1 true KR0168889B1 (ko) | 1999-01-15 |
Family
ID=26387570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940012269A KR0168889B1 (ko) | 1993-06-01 | 1994-06-01 | 세정액, 세정방법 및 세정장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US5695571A (de) |
| EP (2) | EP0627500B1 (de) |
| JP (1) | JP3390245B2 (de) |
| KR (1) | KR0168889B1 (de) |
| DE (2) | DE69425764T2 (de) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3390245B2 (ja) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | 洗浄液及び洗浄方法 |
| KR100387930B1 (ko) * | 1998-12-29 | 2003-09-19 | 주식회사 포스코 | 도금용침적롤의드로스세정액조성물 |
| GB2349984A (en) | 1999-03-04 | 2000-11-15 | Ibm | Decontamination of electronic cards from copper salts |
| JP4516176B2 (ja) * | 1999-04-20 | 2010-08-04 | 関東化学株式会社 | 電子材料用基板洗浄液 |
| JP2001332575A (ja) * | 2000-05-19 | 2001-11-30 | Sony Corp | フラックス洗浄方法及び半導体装置の製造方法 |
| US6776852B2 (en) * | 2002-01-14 | 2004-08-17 | International Business Machines Corporation | Process of removing holefill residue from a metallic surface of an electronic substrate |
| US7144802B2 (en) * | 2003-04-01 | 2006-12-05 | Texas Instruments Incorporated | Vapor deposition of benzotriazole (BTA) for protecting copper interconnects |
| US20040229762A1 (en) * | 2003-05-13 | 2004-11-18 | Rohm And Haas Electronic Materials, L.L.C. | Polymer remover |
| CA2511212A1 (en) * | 2004-07-02 | 2006-01-02 | Henkel Kommanditgesellschaft Auf Aktien | Surface conditioner for powder coating systems |
| JP4236198B2 (ja) * | 2004-12-28 | 2009-03-11 | 東京応化工業株式会社 | リソグラフィー用洗浄液及びそれを用いた半導体基材形成方法 |
| JP4557742B2 (ja) * | 2005-02-15 | 2010-10-06 | 三洋電機株式会社 | 溶剤回収機能付き蒸留装置 |
| JP4835191B2 (ja) * | 2005-02-18 | 2011-12-14 | 東洋インキＳｃホールディングス株式会社 | 顔料分散型着色樹脂組成物用洗浄液 |
| WO2014160962A2 (en) | 2013-03-29 | 2014-10-02 | Life Technologies Corporation | Method for treating a semiconductor device |
| US7767025B2 (en) * | 2007-09-30 | 2010-08-03 | Intel Corporation | Nozzle array configuration to facilitate deflux process improvement in chip attach process |
| DE102009055610A1 (de) * | 2009-11-25 | 2011-05-26 | Behr Gmbh & Co. Kg | Verfahren zur quantitativen Bestimmung von Lötmittelresten |
| US8444868B2 (en) * | 2010-01-28 | 2013-05-21 | International Business Machines Corporation | Method for removing copper oxide layer |
| US8128755B2 (en) * | 2010-03-03 | 2012-03-06 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Cleaning solvent and cleaning method for metallic compound |
| EP2630206A1 (de) * | 2010-12-17 | 2013-08-28 | Dow Global Technologies LLC | Abisolierende formulierungen mit einer sauren mikroemulsion |
| WO2012099126A1 (ja) * | 2011-01-18 | 2012-07-26 | 電気化学工業株式会社 | 超音波洗浄方法及び装置 |
| US20140048103A1 (en) * | 2012-08-20 | 2014-02-20 | Kyle J. Doyel | Method and apparatus for continuous separation of cleaning solvent from rinse fluid in a dual-solvent vapor degreasing system |
| JP2015207712A (ja) | 2014-04-22 | 2015-11-19 | 三菱電機株式会社 | 洗浄液、洗浄設備、および実装基板の洗浄方法 |
| US9555451B2 (en) | 2015-03-26 | 2017-01-31 | Life Technologies Corporation | Method for treating a semiconductor device |
| DE102016118247A1 (de) * | 2016-09-27 | 2018-03-29 | Endress + Hauser Gmbh + Co. Kg | Leiterplatte und Verfahren zur Herstellung der Leiterplatte |
| CN114080570A (zh) * | 2019-07-08 | 2022-02-22 | 默克专利股份有限公司 | 用于移除边缘保护层及残余金属硬掩模组分的冲洗剂及其使用方法 |
| WO2022055302A1 (ko) * | 2020-09-10 | 2022-03-17 | 주식회사 카텍에이치 | 열경화성 수지 고형물의 분해 및 세정 방법 및 장치 |
Family Cites Families (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2528230A (en) * | 1949-02-26 | 1950-10-31 | Robert J King Company Inc | Liquid cleaner |
| FR1081438A (fr) * | 1953-07-20 | 1954-12-20 | Produit décapant pour l'enlèvement de peinture à l'huile et de vernis sur le bois, le métal, le tissu ou le verre | |
| DK128856A (de) * | 1969-08-06 | |||
| US3886099A (en) * | 1972-03-13 | 1975-05-27 | Griffin Bros Inc | Water soluble flux remover |
| ES442315A1 (es) * | 1974-11-04 | 1977-04-01 | Standard Electrica Sa | Un metodo para desprender de un substrato una pelicula re- sistente expuesta de fotopolimero. |
| US3994751A (en) * | 1975-10-28 | 1976-11-30 | The United States Of America As Represented By The Secretary Of The Navy | Solvent-based activator for ensuring paint adhesion to titanium and stainless steel |
| US4153545A (en) * | 1977-08-18 | 1979-05-08 | Ppg Industries, Inc. | Method for cleaning membrane filter |
| US4249107A (en) * | 1977-12-29 | 1981-02-03 | Gte Laboratories Incorporated | Cathode ray tube having amorphous resistive film on internal surfaces and method of forming the film |
| DE2847691C2 (de) * | 1978-11-03 | 1986-05-22 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Waschflüssigkeit zur Reinigung von Oberflächen gedruckter Schaltungen |
| JPS5789487A (en) * | 1980-11-25 | 1982-06-03 | Ibm | Removal of grease |
| DE3145815C2 (de) * | 1981-11-19 | 1984-08-09 | AGA Gas GmbH, 2102 Hamburg | Verfahren zum Entfernen von ablösungsfähigen Materialschichten von beschichteten Gegenständen, |
| US4483783A (en) * | 1982-04-15 | 1984-11-20 | United Industries Corporation | Solvent preparation |
| GB8409055D0 (en) * | 1984-04-07 | 1984-05-16 | Procter & Gamble | Cleaning compositions |
| US4710232A (en) * | 1984-06-01 | 1987-12-01 | Tahbaz John A | Process for cleaning metal articles |
| JPS61238298A (ja) * | 1985-04-17 | 1986-10-23 | 今井 守 | フトンのクリ−ニング方法 |
| US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
| US4604144A (en) * | 1985-09-11 | 1986-08-05 | At&T Technologies, Inc. | Process for cleaning a circuit board |
| JPS62227593A (ja) * | 1986-03-28 | 1987-10-06 | Harima Chem Inc | 有機半田 |
| JP2604593B2 (ja) * | 1986-05-19 | 1997-04-30 | ハリマ化成 株式会社 | 金属表面に半田被膜を形成する方法 |
| JPS62281396A (ja) * | 1986-05-30 | 1987-12-07 | 古河電気工業株式会社 | 導電ペ−スト回路のメタライズ法 |
| US4683075A (en) * | 1986-07-23 | 1987-07-28 | Allied Corporation | Azeotrope-like compositions of trichlorotrifluoroethane, methanol, nitromethane, acetone, and methyl acetate |
| JPS6334933A (ja) * | 1986-07-30 | 1988-02-15 | Furukawa Electric Co Ltd:The | リ−ドへのバンプ形成方法 |
| JPS6335780A (ja) * | 1986-07-30 | 1988-02-16 | Furukawa Electric Co Ltd:The | 貴金属メツキ方法 |
| JPS6356353A (ja) * | 1986-08-26 | 1988-03-10 | Matsushita Electric Works Ltd | 半田フラツクス残渣の除去法 |
| US4738732A (en) * | 1987-02-04 | 1988-04-19 | Hughes Aircraft Co. | Self cleaning liquid solder flux |
| JPH0666539B2 (ja) * | 1987-03-12 | 1994-08-24 | 古河電気工業株式会社 | 半田付け方法 |
| JP2618398B2 (ja) * | 1987-07-06 | 1997-06-11 | 古河電気工業株式会社 | 無電解半田めっき方法 |
| JPH0821769B2 (ja) * | 1987-07-13 | 1996-03-04 | 古河電気工業株式会社 | 電子部品の半田付け方法 |
| JPH0747233B2 (ja) * | 1987-09-14 | 1995-05-24 | 古河電気工業株式会社 | 半田析出用組成物および半田析出方法 |
| JPH088162B2 (ja) * | 1988-07-22 | 1996-01-29 | 松下電器産業株式会社 | サーマルヘッドおよびその製造法 |
| US5120371A (en) * | 1990-11-29 | 1992-06-09 | Petroferm Inc. | Process of cleaning soldering flux and/or adhesive tape with terpenet and monobasic ester |
| US4830772A (en) * | 1988-06-10 | 1989-05-16 | Hoechst Celanese Corporation | Stripper composition for removal of protective coatings |
| US4867800B1 (en) * | 1988-07-21 | 1995-02-14 | Du Pont | Cleaning composition of terpene compound and dibasic ester |
| JPH02114531A (ja) * | 1988-10-24 | 1990-04-26 | Fujitsu Ltd | 半導体装置の製造方法 |
| US4983224A (en) * | 1988-10-28 | 1991-01-08 | Rd Chemical Company | Cleaning compositions and methods for removing soldering flux |
| JPH02155201A (ja) * | 1988-12-07 | 1990-06-14 | Matsushita Electric Ind Co Ltd | サーマルヘッド |
| US5026753A (en) * | 1989-02-22 | 1991-06-25 | Union Camp Corporation | Resinous binders comprising a metal rosin resinate and a carboxylated polystyrene resin |
| US5026754A (en) * | 1989-04-18 | 1991-06-25 | Union Camp Corporation | Resinous binders comprising a metal rosin resinate and a pendant tertiary amine polymer |
| EP0412475B1 (de) * | 1989-08-07 | 1993-11-10 | E.I. Du Pont De Nemours And Company | Reinigungsmittel auf der Basis eines dibasischen Esters und eines Kohlenwasserstofflösungsmittels und Reinigungsverfahren |
| US5062988A (en) * | 1989-08-07 | 1991-11-05 | E. I. Du Pont De Nemours And Company | Cleaning composition of dibasic ester, hydrocarbon solvent and compatibilizing component |
| JPH03146597A (ja) * | 1989-11-01 | 1991-06-21 | Henkel Hakusui Kk | プリント基板の洗浄用組成物 |
| JP2789046B2 (ja) * | 1989-11-08 | 1998-08-20 | 荒川化学工業株式会社 | ロジン系ハンダフラックスの洗浄剤 |
| JP2797567B2 (ja) * | 1989-12-15 | 1998-09-17 | 松下電器産業株式会社 | 電極パターンの形成法 |
| FR2658532B1 (fr) * | 1990-02-20 | 1992-05-15 | Atochem | Application des (perfluoroalkyl)-ethylenes comme agents de nettoyage ou de sechage, et compositions utilisables a cet effet. |
| US5452840A (en) * | 1990-05-15 | 1995-09-26 | Hughes Aircraft Company | Water-soluble soldering flux |
| US5085365B1 (en) * | 1990-05-15 | 1995-08-08 | Hughes Aircraft Co | Water soluble soldering flux |
| JPH0468090A (ja) * | 1990-07-09 | 1992-03-03 | Asahi Chem Ind Co Ltd | 脱脂用洗浄剤 |
| DE69110359T2 (de) * | 1990-07-10 | 1996-03-21 | Kao Corp | Zusammensetzung zur Reinigung von elektronischen und Präzisionsteilen und Reinigungsverfahren. |
| US5304253A (en) * | 1990-09-12 | 1994-04-19 | Baxter International Inc. | Method for cleaning with a volatile solvent |
| US5082497A (en) * | 1990-09-24 | 1992-01-21 | Westvaco Corporation | Solution rosin resinate for publication gravure inks |
| CA2094153A1 (en) * | 1990-10-17 | 1992-04-18 | Gerald J. Ferber | Method and composition for cleaning articles |
| EP0482890B1 (de) * | 1990-10-23 | 1995-03-15 | Tokyo Special Wire Netting Co. Ltd. | Reinigungsapparat |
| JPH04178267A (ja) * | 1990-11-13 | 1992-06-25 | Furukawa Electric Co Ltd:The | 回路基板への半田層形成ライン |
| US5080722A (en) * | 1991-02-26 | 1992-01-14 | At&T Bell Laboratories | Method for cleaning electrical connectors |
| JPH04357899A (ja) * | 1991-06-04 | 1992-12-10 | Furukawa Electric Co Ltd:The | 予備半田層付き回路基板の製造方法 |
| WO1992022678A1 (en) * | 1991-06-14 | 1992-12-23 | Petroferm Inc. | A composition and a process for removing rosin solder flux with terpene and hydrocarbons |
| US5196136A (en) * | 1991-06-20 | 1993-03-23 | E. I. Du Pont De Nemours And Company | Cleaning composition of hydrocarbon component, surfactant and multibasic ester additive |
| JP2871899B2 (ja) * | 1991-06-21 | 1999-03-17 | 古河電気工業株式会社 | クリーム半田 |
| US5221362A (en) * | 1991-08-23 | 1993-06-22 | E. I. Du Pont De Nemours And Company | Non-halogenated aqueous cleaning systems |
| US5125560A (en) * | 1991-11-04 | 1992-06-30 | At&T Bell Laboratories | Method of soldering including removal of flux residue |
| JP2652298B2 (ja) * | 1992-04-30 | 1997-09-10 | 花王株式会社 | 精密部品又は治工具類用洗浄剤組成物 |
| JP3390245B2 (ja) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | 洗浄液及び洗浄方法 |
| US5612303B1 (en) * | 1993-06-15 | 2000-07-18 | Nitto Chemical Industry Co Ltd | Solvent composition |
| CA2147178C (en) * | 1993-08-16 | 2004-01-27 | Satoshi Ide | Cleaning solvent composition and a method for cleaning or drying articles |
| JPH08231989A (ja) * | 1995-02-23 | 1996-09-10 | Kurita Water Ind Ltd | 洗浄剤組成物及び洗浄方法 |
-
1994
- 1994-03-17 JP JP04741494A patent/JP3390245B2/ja not_active Expired - Lifetime
- 1994-05-31 DE DE69425764T patent/DE69425764T2/de not_active Expired - Lifetime
- 1994-05-31 DE DE69408724T patent/DE69408724T2/de not_active Expired - Lifetime
- 1994-05-31 EP EP94108380A patent/EP0627500B1/de not_active Expired - Lifetime
- 1994-05-31 EP EP97201909A patent/EP0811705B1/de not_active Expired - Lifetime
- 1994-06-01 KR KR1019940012269A patent/KR0168889B1/ko not_active IP Right Cessation
- 1994-06-01 US US08/252,174 patent/US5695571A/en not_active Expired - Lifetime
-
1997
- 1997-05-30 US US08/865,125 patent/US6140286A/en not_active Expired - Lifetime
- 1997-12-08 US US08/987,134 patent/US6050479A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69425764T2 (de) | 2000-12-28 |
| EP0811705A1 (de) | 1997-12-10 |
| EP0627500B1 (de) | 1998-03-04 |
| JPH0748599A (ja) | 1995-02-21 |
| KR950002541A (ko) | 1995-01-04 |
| JP3390245B2 (ja) | 2003-03-24 |
| EP0811705B1 (de) | 2000-08-30 |
| US5695571A (en) | 1997-12-09 |
| DE69408724T2 (de) | 1998-06-25 |
| US6050479A (en) | 2000-04-18 |
| US6140286A (en) | 2000-10-31 |
| DE69408724D1 (de) | 1998-04-09 |
| DE69425764D1 (de) | 2000-10-05 |
| EP0627500A1 (de) | 1994-12-07 |
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