DE69425764D1 - Mittel zum Entfernen von Flussmittel und Einrichtung zum Reinigen - Google Patents
Mittel zum Entfernen von Flussmittel und Einrichtung zum ReinigenInfo
- Publication number
- DE69425764D1 DE69425764D1 DE69425764T DE69425764T DE69425764D1 DE 69425764 D1 DE69425764 D1 DE 69425764D1 DE 69425764 T DE69425764 T DE 69425764T DE 69425764 T DE69425764 T DE 69425764T DE 69425764 D1 DE69425764 D1 DE 69425764D1
- Authority
- DE
- Germany
- Prior art keywords
- flux removal
- cleaning
- cleaning means
- removal means
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title 1
- 230000004907 flux Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
- C11D7/262—Alcohols; Phenols fatty or with at least 8 carbon atoms in the alkyl or alkenyl chain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3227—Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/04—Apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13073693 | 1993-06-01 | ||
JP04741494A JP3390245B2 (ja) | 1993-06-01 | 1994-03-17 | 洗浄液及び洗浄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69425764D1 true DE69425764D1 (de) | 2000-10-05 |
DE69425764T2 DE69425764T2 (de) | 2000-12-28 |
Family
ID=26387570
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69425764T Expired - Lifetime DE69425764T2 (de) | 1993-06-01 | 1994-05-31 | Mittel zum Entfernen von Flussmittel und Einrichtung zum Reinigen |
DE69408724T Expired - Lifetime DE69408724T2 (de) | 1993-06-01 | 1994-05-31 | Mittel zum Entfernen von Flussmittel und Reinigungsverfahren |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69408724T Expired - Lifetime DE69408724T2 (de) | 1993-06-01 | 1994-05-31 | Mittel zum Entfernen von Flussmittel und Reinigungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (3) | US5695571A (de) |
EP (2) | EP0627500B1 (de) |
JP (1) | JP3390245B2 (de) |
KR (1) | KR0168889B1 (de) |
DE (2) | DE69425764T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3390245B2 (ja) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | 洗浄液及び洗浄方法 |
KR100387930B1 (ko) * | 1998-12-29 | 2003-09-19 | 주식회사 포스코 | 도금용침적롤의드로스세정액조성물 |
GB2349984A (en) | 1999-03-04 | 2000-11-15 | Ibm | Decontamination of electronic cards from copper salts |
JP4516176B2 (ja) * | 1999-04-20 | 2010-08-04 | 関東化学株式会社 | 電子材料用基板洗浄液 |
JP2001332575A (ja) * | 2000-05-19 | 2001-11-30 | Sony Corp | フラックス洗浄方法及び半導体装置の製造方法 |
US6776852B2 (en) * | 2002-01-14 | 2004-08-17 | International Business Machines Corporation | Process of removing holefill residue from a metallic surface of an electronic substrate |
US7144802B2 (en) * | 2003-04-01 | 2006-12-05 | Texas Instruments Incorporated | Vapor deposition of benzotriazole (BTA) for protecting copper interconnects |
US20040229762A1 (en) * | 2003-05-13 | 2004-11-18 | Rohm And Haas Electronic Materials, L.L.C. | Polymer remover |
CA2511212A1 (en) * | 2004-07-02 | 2006-01-02 | Henkel Kommanditgesellschaft Auf Aktien | Surface conditioner for powder coating systems |
JP4236198B2 (ja) * | 2004-12-28 | 2009-03-11 | 東京応化工業株式会社 | リソグラフィー用洗浄液及びそれを用いた半導体基材形成方法 |
JP4557742B2 (ja) * | 2005-02-15 | 2010-10-06 | 三洋電機株式会社 | 溶剤回収機能付き蒸留装置 |
JP4835191B2 (ja) * | 2005-02-18 | 2011-12-14 | 東洋インキScホールディングス株式会社 | 顔料分散型着色樹脂組成物用洗浄液 |
WO2014160962A2 (en) | 2013-03-29 | 2014-10-02 | Life Technologies Corporation | Method for treating a semiconductor device |
US7767025B2 (en) * | 2007-09-30 | 2010-08-03 | Intel Corporation | Nozzle array configuration to facilitate deflux process improvement in chip attach process |
DE102009055610A1 (de) * | 2009-11-25 | 2011-05-26 | Behr Gmbh & Co. Kg | Verfahren zur quantitativen Bestimmung von Lötmittelresten |
US8444868B2 (en) * | 2010-01-28 | 2013-05-21 | International Business Machines Corporation | Method for removing copper oxide layer |
US8128755B2 (en) * | 2010-03-03 | 2012-03-06 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Cleaning solvent and cleaning method for metallic compound |
EP2630206A1 (de) * | 2010-12-17 | 2013-08-28 | Dow Global Technologies LLC | Abisolierende formulierungen mit einer sauren mikroemulsion |
WO2012099126A1 (ja) * | 2011-01-18 | 2012-07-26 | 電気化学工業株式会社 | 超音波洗浄方法及び装置 |
US20140048103A1 (en) * | 2012-08-20 | 2014-02-20 | Kyle J. Doyel | Method and apparatus for continuous separation of cleaning solvent from rinse fluid in a dual-solvent vapor degreasing system |
JP2015207712A (ja) | 2014-04-22 | 2015-11-19 | 三菱電機株式会社 | 洗浄液、洗浄設備、および実装基板の洗浄方法 |
US9555451B2 (en) | 2015-03-26 | 2017-01-31 | Life Technologies Corporation | Method for treating a semiconductor device |
DE102016118247A1 (de) * | 2016-09-27 | 2018-03-29 | Endress + Hauser Gmbh + Co. Kg | Leiterplatte und Verfahren zur Herstellung der Leiterplatte |
CN114080570A (zh) * | 2019-07-08 | 2022-02-22 | 默克专利股份有限公司 | 用于移除边缘保护层及残余金属硬掩模组分的冲洗剂及其使用方法 |
WO2022055302A1 (ko) * | 2020-09-10 | 2022-03-17 | 주식회사 카텍에이치 | 열경화성 수지 고형물의 분해 및 세정 방법 및 장치 |
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-
1994
- 1994-03-17 JP JP04741494A patent/JP3390245B2/ja not_active Expired - Lifetime
- 1994-05-31 DE DE69425764T patent/DE69425764T2/de not_active Expired - Lifetime
- 1994-05-31 DE DE69408724T patent/DE69408724T2/de not_active Expired - Lifetime
- 1994-05-31 EP EP94108380A patent/EP0627500B1/de not_active Expired - Lifetime
- 1994-05-31 EP EP97201909A patent/EP0811705B1/de not_active Expired - Lifetime
- 1994-06-01 KR KR1019940012269A patent/KR0168889B1/ko not_active IP Right Cessation
- 1994-06-01 US US08/252,174 patent/US5695571A/en not_active Expired - Lifetime
-
1997
- 1997-05-30 US US08/865,125 patent/US6140286A/en not_active Expired - Lifetime
- 1997-12-08 US US08/987,134 patent/US6050479A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69425764T2 (de) | 2000-12-28 |
EP0811705A1 (de) | 1997-12-10 |
EP0627500B1 (de) | 1998-03-04 |
JPH0748599A (ja) | 1995-02-21 |
KR950002541A (ko) | 1995-01-04 |
KR0168889B1 (ko) | 1999-01-15 |
JP3390245B2 (ja) | 2003-03-24 |
EP0811705B1 (de) | 2000-08-30 |
US5695571A (en) | 1997-12-09 |
DE69408724T2 (de) | 1998-06-25 |
US6050479A (en) | 2000-04-18 |
US6140286A (en) | 2000-10-31 |
DE69408724D1 (de) | 1998-04-09 |
EP0627500A1 (de) | 1994-12-07 |
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