JPWO2015146161A1 - 半導体基板の熱処理方法、半導体基板の製造方法、熱処理装置、及び基板処理システム - Google Patents
半導体基板の熱処理方法、半導体基板の製造方法、熱処理装置、及び基板処理システム Download PDFInfo
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Abstract
Description
まず、本発明の一実施形態による熱処理装置100について図1乃至図6を用いて説明する。図1は、半導体基板の搬入時又は搬出時の状態の熱処理装置100を示している。図2は、半導体基板の熱処理時の状態の熱処理装置100を示している。図3は、半導体基板の冷却時の状態の熱処理装置100を示している。また、図4は、図1における基板ホルダユニットA及びその周辺を拡大して示している。図5は、図2における基板ホルダユニットA及びその周辺を拡大して示している。図6は、加熱ユニットBの具体的構成の一例を示している。
上記本実施形態による熱処理装置100は、複数の処理装置のチャンバが接続されて構成されるマルチチャンバ型の基板処理システムに組み込んで用いることが可能である。以下、本実施形態による熱処理装置100が組み込まれたマルチチャンバ型の基板処理システムの一例について図7を用いて説明する。図7は、本実施形態による熱処理装置100が組み込まれたマルチチャンバ型の基板処理システムの一例を示している。
次に、上記図7に示す基板処理システムにおける熱処理装置100を用いた本実施形態による半導体基板の熱処理方法について図8A及び図8Bを用いて説明する。図8Aは、本実施形態による半導体基板の熱処理方法の事前準備を示すフローチャートである。図8Bは、本実施形態による半導体基板の熱処理方法を示すフローチャートである。
上述した本実施形態による半導体基板の熱処理方法は、半導体基板を用いて半導体装置を製造する際の不純物の活性化アニールに適用することができる。以下、本実施形態による熱処理方法を適用して製造される半導体装置の具体例について説明する。
第1の実施例では、SiC基板として、エピタキシャル成長したSiC結晶層を表面層として有し、SiC結晶層内に不純物添加領域が形成されたものを用意した。このSiC基板の表面には、ロータリーマグネトロンカソード(RMC)を備えた静止対向型のスパッタ装置を用い、直径12.5インチのカーボンターゲットにて、膜厚400nmのカーボン膜を成膜した。カーボン膜の成膜条件としては、ターゲット温度を室温、スパッタ圧力を0.2Pa、ターゲット/基板間距離を150mm、ターゲットに印加するDCパワー4.5kW(約64mW/mm2)にそれぞれ設定した。こうして、熱処理に供する半導体基板として、表面にカーボン膜が形成されたSiC基板を用意した。
第2の実施例では、熱処理に供する半導体基板として、第1の実施例と同様にして、表面にカーボン膜が形成されたSiC基板を用意した。
第3の実施例では、熱処理に供する半導体基板として、第1の実施例と同様にして、表面にカーボン膜が形成されたSiC基板を用意した。
第4の実施例では、熱処理に供する半導体基板として、第1の実施例と同様にして、表面にカーボン膜が形成されたSiC基板を用意した。
第5の実施例では、SiC基板として、エピタキシャル成長したSiC結晶層を表面層として有し、SiC結晶層内に不純物添加領域が形成されたものを用意した。
Claims (12)
- 表面にキャップ膜が形成された半導体基板の熱処理を行う半導体基板の熱処理方法であって、
分子流領域の圧力を超える圧力でガスが封止された状態の処理室内において、前記半導体基板の前記熱処理を行うことを特徴とする半導体基板の熱処理方法。 - 前記半導体基板に対向して放熱により前記半導体基板を加熱する基板対向面を有する加熱手段を用い、前記半導体基板が前記処理室内に搬送されて載置された第1の状態よりも前記半導体基板と前記基板対向面とを近接させた第2の状態で、前記半導体基板の前記熱処理を行うことを特徴とする請求項1記載の半導体基板の熱処理方法。
- 前記半導体基板の前記熱処理には、前記半導体基板に対向して放熱により前記半導体基板を加熱する基板対向面を有する被加熱部と、前記被加熱部を含む加熱容器と、前記加熱容器内に収容された加熱機構とを有する加熱手段を用い、
前記被加熱部の内壁面及び外壁面の少なくとも一方の少なくとも一部には、耐熱性のコーティング膜が形成されていることを特徴とする請求項1記載の半導体基板の熱処理方法。 - 前記熱処理における前記半導体基板の熱処理温度が1500℃以上であり、1750℃以下である場合には、前記処理室内に封止された前記ガスの圧力を10kPa以上に設定し、
前記熱処理における前記半導体基板の熱処理温度が1750℃よりも高く、2000℃以下である場合には、前記処理室内に封止された前記ガスの圧力を50kPa以上に設定することを特徴とする請求項1記載の半導体基板の熱処理方法。 - 前記キャップ膜は、スパッタターゲットに40mW/mm2以上の電力を印加したスパッタ法により成膜され、柱状の結晶構造を有するものであることを特徴とする請求項1記載の半導体基板の熱処理方法。
- 前記半導体基板がSiC基板であり、前記キャップ膜がカーボン膜であることを特徴とする請求項1記載の半導体基板の熱処理方法。
- 半導体基板の表面にキャップ膜を形成するステップと、
請求項1記載の半導体基板の熱処理方法により、前記キャップ膜が形成された前記半導体基板に対して前記熱処理を行うステップと
を有することを特徴とする半導体基板の製造方法。 - 表面にキャップ膜が形成された半導体基板の熱処理を行うための処理室と、
前記処理室内に設けられた加熱手段と、
分子流領域の圧力を超える圧力でガスが封止された状態の前記処理室内において、前記加熱手段により前記半導体基板の前記熱処理を実行する制御装置と
を有することを特徴とする熱処理装置。 - 前記加熱手段は、前記半導体基板に対向して放熱により前記半導体基板を加熱する基板対向面を有し、
前記制御装置は、前記半導体基板が前記処理室内に搬送されて載置された第1の状態よりも前記半導体基板と前記基板対向面とを近接させた第2の状態で、前記半導体基板の前記熱処理を実行することを特徴とする請求項8記載の熱処理装置。 - 前記加熱手段は、前記半導体基板に対向して放熱により前記半導体基板を加熱する基板対向面を有する被加熱部と、前記被加熱部を含む加熱容器と、前記加熱容器内に収容された加熱機構とを有し、
前記被加熱部の内壁面及び外壁面の少なくとも一方の少なくとも一部には、耐熱性のコーティング膜が形成されていることを特徴とする請求項8記載の熱処理装置。 - 請求項8記載の熱処理装置と、
前記キャップ膜を成膜するキャップ膜成膜装置と、
前記半導体基板を前記熱処理装置と前記キャップ膜成膜装置との間で搬送する搬送手段を有する基板搬送室と、
を備えることを特徴とする基板処理システム。 - 前記半導体基板を前記熱処理装置と前記キャップ膜成膜装置との間で搬送するときの搬送圧力は、
前記キャップ膜を成膜するときの前記キャップ膜成膜装置内の圧力より高く、前記半導体基板を熱処理するときの前記熱処理装置内の圧力以下であることを特徴とする請求項11記載の基板処理システム。
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