JPWO2006103948A1 - フリップチップ実装方法およびバンプ形成方法 - Google Patents
フリップチップ実装方法およびバンプ形成方法 Download PDFInfo
- Publication number
- JPWO2006103948A1 JPWO2006103948A1 JP2007510386A JP2007510386A JPWO2006103948A1 JP WO2006103948 A1 JPWO2006103948 A1 JP WO2006103948A1 JP 2007510386 A JP2007510386 A JP 2007510386A JP 2007510386 A JP2007510386 A JP 2007510386A JP WO2006103948 A1 JPWO2006103948 A1 JP WO2006103948A1
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- resin
- circuit board
- solder powder
- terminals
- generating agent
- Prior art date
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- Granted
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 294
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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Abstract
Description
アンダーフィルと呼ばれる樹脂を、半導体チップと回路基板との間に注入する工程をさらに必要とする。
12 電極端子
13,14 樹脂
15 対流添加剤
16 はんだ粉
17 溶融したはんだ粉
18 接続体
19 バンプ
20 導体チップ
21 インターポーザ
21 回路基板
22 接続体
30,30a,30b 気泡
31 基板
32 電極
35 アンダーフィル材
40 平板
41 凸部
42 金属
45 外部端子
50 フリップチップ実装装置(バンプ形成装置)
51 保持手段
52 供給手段
53 加熱手段
54 第1の加熱手段
55 第2の加熱手段
100 フリップチップ実装体
図2(a)〜(d)、及び図3(a)〜(c)は、本発明の第1の実施形態におけるフリップチップ実装方法の基本的な工程を示した工程断面図である。
第1の実施形態で説明したフリップチップ実装方法は、樹脂中に含有する気泡発生剤から気泡を発生させ、当該気泡が成長することで、樹脂が端子間に自己集合し、さらに当該樹脂中に含有するはんだ粉を溶融させることによって、端子間に接続体を自己整合的に形成することを特徴とするもので、この技術は、バンプ形成方法にも適用することができる。
アンダーフィルと呼ばれる樹脂を、半導体チップと回路基板との間に注入する工程をさらに必要とする。
図2(a)〜(d)、及び図3(a)〜(c)は、本発明の第1の実施形態におけるフリップチップ実装方法の基本的な工程を示した工程断面図である。
第1の実施形態で説明したフリップチップ実装方法は、樹脂中に含有する気泡発生剤から気泡を発生させ、当該気泡が成長することで、樹脂が端子間に自己集合し、さらに当該樹脂中に含有するはんだ粉を溶融させることによって、端子間に接続体を自己整合的に形成することを特徴とするもので、この技術は、バンプ形成方法にも適用することができる。
12 電極端子
13,14 樹脂
15 対流添加剤
16 はんだ粉
17 溶融したはんだ粉
18 接続体
19 バンプ
20 半導体チップ
21 インターポーザ
21 回路基板
22 接続体
30,30a,30b 気泡
31 基板
32 電極
35 アンダーフィル材
40 平板
41 凸部
42 金属
45 外部端子
50 フリップチップ実装装置(バンプ形成装置)
51 保持手段
52 供給手段
53 加熱手段
54 第1の加熱手段
55 第2の加熱手段
100 フリップチップ実装体
Claims (36)
- 複数の接続端子を有する回路基板に対向させて、複数の電極端子を有する半導体チップを配置し、前記回路基板の接続端子と前記半導体チップの電極端子とを電気的に接続するフリップチップ実装方法において、
前記回路基板と前記半導体チップとの隙間に、はんだ粉と気泡発生剤を含有した樹脂を供給する第1の工程と、
前記樹脂を加熱して、前記樹脂中に含有する前記気泡発生剤から気泡を発生させる第2の工程と、
前記樹脂を加熱して、前記樹脂中に含有する前記はんだ粉を溶融する第3の工程と
を含み、
前記第2の工程において、前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記回路基板の接続端子と前記半導体チップの電極端子との間に自己集合し、
前記第3の工程において、前記端子間に自己集合した前記樹脂中に含有するはんだ粉が溶融することによって、前記端子間に接続体を形成することを特徴とするフリップチップ実装方法。 - 前記第3の工程の後、前記端子間にある前記樹脂を硬化させる工程をさらに含むことを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第2の工程における加熱温度は、前記第3の工程における加熱温度よりも低い温度で実行されることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記気泡発生剤は、前記樹脂が加熱されたときに沸騰する材料からなることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記気泡発生剤の沸点は、前記はんだ粉の融点よりも低いことを特徴とする、請求項4に記載のフリップチップ実装方法。
- 前記気泡発生剤は、沸点の異なる2種類以上の材料からなることを特徴とする、請求項4に記載のフリップチップ実装方法。
- 前記気泡発生剤は、前記樹脂が加熱されたときに、前記気泡発生剤が熱分解することにより気泡を発生する材料からなることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記気泡発生剤は、結晶水を含む化合物からなり、前記樹脂が加熱されたとき分解されて水蒸気を発生することを特徴とする、請求項7に記載のフリップチップ実装方法。
- 前記第2の工程、及び前記第3の工程は、前記樹脂の加熱温度を連続的に上昇させながら実行されることを特徴とする、請求項3に記載のフリップチップ実装方法。
- 前記第2の工程は、前記回路基板と前記半導体チップとの隙間の間隔を変動させながら実行されることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第2の工程は、前記回路基板と前記半導体チップとの隙間の間隔を広げながら実行されることを特徴とする、請求項10に記載のフリップチップ実装方法。
- 前記第3の工程は、前記回路基板と前記半導体チップの隙間の間隔を変動させながら実行されることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第3の工程は、前記回路基板と前記半導体チップとの隙間の間隔を狭くしながら実行されることを特徴とする、請求項12に記載のフリップチップ実装方法。
- 前記第1の工程は、前記回路基板上に、前記はんだ粉と気泡発生剤を含有した樹脂を供給した後、該樹脂表面に前記半導体チップを配設することにより実行されることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第3の工程は、前記樹脂中に含有する前記はんだ粉の表面を溶融する工程を含み、
前記第3の工程において形成された接続体は、前記はんだ粉同士の界面が金属結合された状態にあることを特徴とする、請求項1に記載のフリップチップ実装方法。 - 前記複数の電極端子を有する半導体チップは、半導体ベアチップが前記複数の電極端子を有するインターポーザに搭載された構成になっていることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第3の工程の後、前記回路基板と前記半導体チップとの隙間にアンダーフィル材を供給し、然る後、該アンダーフィル材を硬化させる工程をさらに含むことを特徴とする、請求項1に記載のフリップチップ実装方法。
- 複数の電極を有する基板のバンプ形成方法において、
前記基板に対向させて平板を配設し、該平板と前記基板との隙間に、はんだ粉と気泡発生剤を含有した樹脂を供給する第1の工程と、
前記樹脂を加熱して、前記樹脂中に含有する前記気泡発生剤から気泡を発生させる第2の工程と、
前記樹脂を加熱して、前記樹脂中に含有する前記はんだ粉を溶融する第3の工程と
を含み、
前記第2の工程において、前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記基板の電極上に自己集合し、
前記第3の工程において、前記電極上に自己集合した前記樹脂中に含有するはんだ粉が溶融することによって、前記電極上にバンプを形成することを特徴とするバンプ形成方法。 - 前記第3の工程における加熱温度は、前記第2の工程における加熱温度よりも高い温度で実行されることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記気泡発生剤は、前記樹脂が加熱されたときに沸騰する材料からなることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記気泡発生剤の沸点は、前記はんだ粉の融点よりも低いことを特徴とする、請求項20に記載のバンプ形成方法。
- 前記気泡発生剤は、前記樹脂が加熱されたときに、前記気泡発生剤が熱分解することにより気体を発生する材料からなることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記第2の工程は、前記基板と前記平板との隙間の間隔を変動させながら実行されることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記第3の工程は、前記基板と前記平板との隙間の間隔を変動させながら実行されることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記第1の工程は、前記基板上に、前記はんだ粉と気泡発生剤を含有した樹脂を供給した後、該樹脂表面に平板を配設することにより実行されることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記平板の前記基板に対向する平面上に、前記基板に形成された複数の電極と対向する位置に、前記電極と略同一形状の凸部が形成されていることを特徴とする、請求項18に記載のバンプ形成方法。
- 前記凸部の少なくとも表面は、金属で形成されていることを特徴とする、請求項26に記載のバンプ形成方法。
- 前記第3の工程の後、前記樹脂及び前記平板を除去する工程をさらに含むことを特徴とする、請求項18に記載のバンプ形成方法。
- 前記第3の工程は、前記樹脂中に含有する前記はんだ粉の表面を溶融する工程を含み、
前記第3の工程において形成されたバンプは、前記はんだ粉同士の界面が金属結合された状態にあることを特徴とする、請求項18に記載のバンプ形成方法。 - 複数の接続端子を有する回路基板に対向させて、複数の電極端子を有する半導体チップが配置され、前記回路基板の接続端子と前記半導体チップの電極端子とが電気的に接続されたフリップチップ実装体において、
前記接続端子と前記電極端子は、前記回路基板と前記半導体チップとの隙間に供給されたはんだ粉及び気泡発生剤を含有する樹脂が、前記接続端子と前記電極端子との間に自己集合し、該自己集合した前記樹脂中のはんだ粉が溶融して、前記接続端子と前記電極端子との間に形成された接続体を介して電気的に接続されていることを特徴とするフリップチップ実装体。 - 前記回路基板は、複数の外部端子を有するインターポーザで構成され、前記フリップチップ実装体は、前記半導体チップが前記インターポーザに搭載されたCSPまたはBGAの構成をなすことを特徴とする、請求項30に記載のフリップチップ実装体。
- 前記フリップチップ実装体は、前記回路基板と前記半導体チップとの隙間に供給された樹脂で固定されていることを特徴とする、請求項30に記載のフリップチップ実装体。
- 半導体チップを回路基板にフリップチップ実装するフリップチップ実装装置であって、
前記半導体チップ及び前記回路基板を、一定の隙間をもって互いに対向させて保持する保持手段と、
前記半導体チップと前記回路基板との隙間に、はんだ粉と気泡発生剤を含有した樹脂を供給する供給手段と、
前記樹脂を加熱する加熱手段と
を備え、
前記加熱手段は、前記樹脂中に含有する前記気泡発生剤から気泡を発生させる温度に制御する第1の加熱手段と、前記樹脂中に含有する前記はんだ粉を溶融させる温度に制御する第2の加熱手段を有していることを特徴とする、フリップチップ実装装置。 - 前記第1の加熱手段で加熱された前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記回路基板の接続端子と前記半導体チップの電極端子との間に自己集合し、
前記第2の加熱手段で、前記端子間に自己集合した前記樹脂中に含有するはんだ粉が溶融することによって、前記端子間に接続体を形成することを特徴とする、請求項33に記載のフリップチップ実装装置。 - 基板に形成された複数の電極上にバンプを形成するバンプ形成装置であって、
前記基板に対して一定の隙間をもって対向する位置に平板を保持する保持手段と、
前記基板と前記平板との隙間に、はんだ粉と気泡発生剤を含有した樹脂を供給する供給手段と、
前記樹脂を加熱する加熱手段と
を備え、
前記加熱手段は、前記樹脂中に含有する前記気泡発生剤から気泡を発生させる加熱温度に制御する第1の加熱手段と、前記樹脂中に含有する前記はんだ粉を溶融させる加熱温度に制御する第2の加熱手段を有していることを特徴とする、バンプ形成装置。 - 前記第1の加熱手段で加熱された前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記基板の電極上に自己集合し、
前記第2の加熱手段で、前記電極上に自己集合した前記樹脂中に含有するはんだ粉を溶融させることによって、前記電極上にバンプを形成することを特徴とする、請求項35に記載のバンプ形成装置。
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JP7070373B2 (ja) * | 2018-11-28 | 2022-05-18 | 三菱電機株式会社 | 半導体装置の製造方法、半導体装置、電力変換装置 |
JP2021057292A (ja) * | 2019-10-01 | 2021-04-08 | 積水化学工業株式会社 | 接続構造体及び接続構造体の製造方法 |
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CN113579442B (zh) * | 2021-09-27 | 2022-02-08 | 新恒汇电子股份有限公司 | 双界面模块电学连接材料及其制备方法和应用 |
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JP3955302B2 (ja) * | 2004-09-15 | 2007-08-08 | 松下電器産業株式会社 | フリップチップ実装体の製造方法 |
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CN100495676C (zh) * | 2005-03-29 | 2009-06-03 | 松下电器产业株式会社 | 倒装芯片封装方法及其衬底间连接方法 |
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KR101109221B1 (ko) | 2012-01-30 |
JP2008172215A (ja) | 2008-07-24 |
WO2006103948A1 (ja) | 2006-10-05 |
KR20070114743A (ko) | 2007-12-04 |
JP4480757B2 (ja) | 2010-06-16 |
US20090117688A1 (en) | 2009-05-07 |
EP1865549A4 (en) | 2012-07-11 |
US20080284046A1 (en) | 2008-11-20 |
US7531387B1 (en) | 2009-05-12 |
JP4084834B2 (ja) | 2008-04-30 |
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