JPS58212152A - ガラス封止半導体装置の製造方法 - Google Patents

ガラス封止半導体装置の製造方法

Info

Publication number
JPS58212152A
JPS58212152A JP58090678A JP9067883A JPS58212152A JP S58212152 A JPS58212152 A JP S58212152A JP 58090678 A JP58090678 A JP 58090678A JP 9067883 A JP9067883 A JP 9067883A JP S58212152 A JPS58212152 A JP S58212152A
Authority
JP
Japan
Prior art keywords
glass
leads
lead
frame
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58090678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS624857B2 (enrdf_load_stackoverflow
Inventor
Seishiro Owaki
征四郎 大脇
Michio Tanimoto
道夫 谷本
Motoharu Ogawa
小川　基春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58090678A priority Critical patent/JPS58212152A/ja
Publication of JPS58212152A publication Critical patent/JPS58212152A/ja
Publication of JPS624857B2 publication Critical patent/JPS624857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58090678A 1983-05-25 1983-05-25 ガラス封止半導体装置の製造方法 Granted JPS58212152A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58090678A JPS58212152A (ja) 1983-05-25 1983-05-25 ガラス封止半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58090678A JPS58212152A (ja) 1983-05-25 1983-05-25 ガラス封止半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP50076565A Division JPS5841660B2 (ja) 1975-06-24 1975-06-24 ガラスフウシハンドウタイソウチノセイゾウホウホウオヨビ ソノホウホウニオイテモチイルリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58212152A true JPS58212152A (ja) 1983-12-09
JPS624857B2 JPS624857B2 (enrdf_load_stackoverflow) 1987-02-02

Family

ID=14005191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58090678A Granted JPS58212152A (ja) 1983-05-25 1983-05-25 ガラス封止半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58212152A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS613434A (ja) * 1984-06-15 1986-01-09 Ricoh Co Ltd 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS613434A (ja) * 1984-06-15 1986-01-09 Ricoh Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS624857B2 (enrdf_load_stackoverflow) 1987-02-02

Similar Documents

Publication Publication Date Title
JP4145322B2 (ja) 半導体装置の製造方法
CN103681379A (zh) 半导体装置的制造方法和半导体装置
JPH06204371A (ja) 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
KR0185790B1 (ko) 반도체 장치의 제조방법
JPS58212152A (ja) ガラス封止半導体装置の製造方法
JPH0438859A (ja) 電子部品組立構造及びその組立方法
JPS5841660B2 (ja) ガラスフウシハンドウタイソウチノセイゾウホウホウオヨビ ソノホウホウニオイテモチイルリ−ドフレ−ム
JPS5910229A (ja) 半導体装置およびその製造方法
JPH0730042A (ja) 半導体装置用リードフレーム、それを用いた半導体装置及びその製造方法
JPS5956752A (ja) 電子部品の製造方法
JP2589520B2 (ja) 樹脂封止型半導体装置の製造方法
JP2503646B2 (ja) リ―ドフレ―ムおよび半導体集積回路装置
JPS63209152A (ja) リ−ドフレ−ム
JPH03114247A (ja) パッケージ型半導体装置
JP2702182B2 (ja) 半導体装置およびその製造方法
JP3545584B2 (ja) 半導体装置の製造方法
JP4569048B2 (ja) 面実装型半導体パッケージおよびその製造方法
JPH0831556B2 (ja) 半導体装置用リードフレーム
JPH0794674A (ja) 半導体装置およびその製造方法
JPH0290558A (ja) リードフレーム
JPH01123443A (ja) 半導体装置
JPS60258942A (ja) 集積回路装置
JPS6155778B2 (enrdf_load_stackoverflow)
JPS6221254A (ja) 電子装置
JPS60177656A (ja) 半導体装置