JPS5365088A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5365088A JPS5365088A JP14085476A JP14085476A JPS5365088A JP S5365088 A JPS5365088 A JP S5365088A JP 14085476 A JP14085476 A JP 14085476A JP 14085476 A JP14085476 A JP 14085476A JP S5365088 A JPS5365088 A JP S5365088A
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor device
- layer
- wiring paths
- layer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000002253 acid Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000012299 nitrogen atmosphere Substances 0.000 abstract 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085476A JPS5365088A (en) | 1976-11-22 | 1976-11-22 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085476A JPS5365088A (en) | 1976-11-22 | 1976-11-22 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5365088A true JPS5365088A (en) | 1978-06-10 |
| JPS5742220B2 JPS5742220B2 (enExample) | 1982-09-07 |
Family
ID=15278274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14085476A Granted JPS5365088A (en) | 1976-11-22 | 1976-11-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5365088A (enExample) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524454A (en) * | 1978-08-08 | 1980-02-21 | Nec Corp | Insulating gate type field effect transistor |
| JPS5530876A (en) * | 1978-08-28 | 1980-03-04 | Fuji Electric Co Ltd | Semiconductor device |
| JPS5633899A (en) * | 1979-08-29 | 1981-04-04 | Cho Lsi Gijutsu Kenkyu Kumiai | Method of forming multilayer wire |
| JPS56130948A (en) * | 1980-03-18 | 1981-10-14 | Nec Corp | Semiconductor device |
| JPS5720452A (en) * | 1980-07-11 | 1982-02-02 | Matsushita Electric Ind Co Ltd | Forming method for multilayer wiring |
| JPS5748249A (en) * | 1980-09-08 | 1982-03-19 | Nec Corp | Semiconductor device |
| JPS57149751A (en) * | 1981-03-11 | 1982-09-16 | Nec Corp | Semiconductor device |
| JPS57208161A (en) * | 1981-06-18 | 1982-12-21 | Fujitsu Ltd | Semiconductor device |
| JPS57208160A (en) * | 1981-06-18 | 1982-12-21 | Fujitsu Ltd | Semiconductor device |
| JPS58500680A (ja) * | 1981-05-04 | 1983-04-28 | モトロ−ラ・インコ−ポレ−テツド | 低抵抗合成金属導体を具えた半導体デバイスおよびその製造方法 |
| JPS6037745A (ja) * | 1983-08-10 | 1985-02-27 | Seiko Epson Corp | 半導体装置 |
| JPS6154648A (ja) * | 1984-08-24 | 1986-03-18 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS61152042A (ja) * | 1984-12-20 | 1986-07-10 | エツセ・ジ・エツセ・ミクロエレツトロニーカ・エツセ・ピ・ア | 半導体素子の金属化パターンおよびその方法 |
| JPS61159750A (ja) * | 1984-12-31 | 1986-07-19 | Sony Corp | 半導体装置及びその製造方法 |
| JPS61183942A (ja) * | 1985-02-08 | 1986-08-16 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6260240A (ja) * | 1985-09-10 | 1987-03-16 | Matsushita Electric Ind Co Ltd | 多層配線 |
| JPS62118546A (ja) * | 1985-11-19 | 1987-05-29 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS63198357A (ja) * | 1987-02-13 | 1988-08-17 | Nec Corp | 半導体装置 |
| JPS6465856A (en) * | 1987-09-05 | 1989-03-13 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
-
1976
- 1976-11-22 JP JP14085476A patent/JPS5365088A/ja active Granted
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524454A (en) * | 1978-08-08 | 1980-02-21 | Nec Corp | Insulating gate type field effect transistor |
| JPS5530876A (en) * | 1978-08-28 | 1980-03-04 | Fuji Electric Co Ltd | Semiconductor device |
| JPS5633899A (en) * | 1979-08-29 | 1981-04-04 | Cho Lsi Gijutsu Kenkyu Kumiai | Method of forming multilayer wire |
| JPS56130948A (en) * | 1980-03-18 | 1981-10-14 | Nec Corp | Semiconductor device |
| JPS5720452A (en) * | 1980-07-11 | 1982-02-02 | Matsushita Electric Ind Co Ltd | Forming method for multilayer wiring |
| JPS5748249A (en) * | 1980-09-08 | 1982-03-19 | Nec Corp | Semiconductor device |
| JPS57149751A (en) * | 1981-03-11 | 1982-09-16 | Nec Corp | Semiconductor device |
| JPS58500680A (ja) * | 1981-05-04 | 1983-04-28 | モトロ−ラ・インコ−ポレ−テツド | 低抵抗合成金属導体を具えた半導体デバイスおよびその製造方法 |
| JPS57208160A (en) * | 1981-06-18 | 1982-12-21 | Fujitsu Ltd | Semiconductor device |
| JPS57208161A (en) * | 1981-06-18 | 1982-12-21 | Fujitsu Ltd | Semiconductor device |
| JPS6037745A (ja) * | 1983-08-10 | 1985-02-27 | Seiko Epson Corp | 半導体装置 |
| JPS6154648A (ja) * | 1984-08-24 | 1986-03-18 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS61152042A (ja) * | 1984-12-20 | 1986-07-10 | エツセ・ジ・エツセ・ミクロエレツトロニーカ・エツセ・ピ・ア | 半導体素子の金属化パターンおよびその方法 |
| JPS61159750A (ja) * | 1984-12-31 | 1986-07-19 | Sony Corp | 半導体装置及びその製造方法 |
| JPS61183942A (ja) * | 1985-02-08 | 1986-08-16 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6260240A (ja) * | 1985-09-10 | 1987-03-16 | Matsushita Electric Ind Co Ltd | 多層配線 |
| JPS62118546A (ja) * | 1985-11-19 | 1987-05-29 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS63198357A (ja) * | 1987-02-13 | 1988-08-17 | Nec Corp | 半導体装置 |
| JPS6465856A (en) * | 1987-09-05 | 1989-03-13 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5742220B2 (enExample) | 1982-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5365088A (en) | Semiconductor device | |
| JPS5331964A (en) | Production of semiconductor substrates | |
| JPS5420671A (en) | Production of semiconductor devices | |
| JPS5236985A (en) | Method of connecting semiconductor devices etc. | |
| JPS5323564A (en) | Bump type semiconductor device | |
| JPS5227391A (en) | Contact forming method of semiconductor device | |
| JPS52102691A (en) | Formation of wiring on insulating layer having steps | |
| JPS5268388A (en) | Semiconductor integrated circuit | |
| JPS5331966A (en) | Production of semiconductor device | |
| JPS533066A (en) | Electrode formation method | |
| JPS5320875A (en) | Semiconductor integrated circuit device | |
| JPS5421290A (en) | Integrated circuit device and its manufacture | |
| JPS5317286A (en) | Production of semiconductor device | |
| JPS53130979A (en) | Manufacture for semiconductor device | |
| JPS537174A (en) | Production of semiconductor device | |
| JPS53117970A (en) | Resin seal type semiconductor device | |
| JPS5356981A (en) | Production of semiconductor device | |
| JPS5329087A (en) | Semiconductor device | |
| JPS52114287A (en) | Semiconductor device having multilayer wiring structure | |
| JPS52125285A (en) | Semiconductor device | |
| JPS53124090A (en) | Semiconductor device | |
| JPS5275280A (en) | Semiconductor device | |
| JPS5416989A (en) | Semiconductor device | |
| JPS52149987A (en) | Production of semiconductor device | |
| JPS5474369A (en) | Semiconductor device |