JPS5329087A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5329087A JPS5329087A JP10316076A JP10316076A JPS5329087A JP S5329087 A JPS5329087 A JP S5329087A JP 10316076 A JP10316076 A JP 10316076A JP 10316076 A JP10316076 A JP 10316076A JP S5329087 A JPS5329087 A JP S5329087A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- wiring
- burying
- ics
- stepping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To facilitate the wiring formation of second and third layers and enhance the reliability of ICs by burying the wiring of a first layer within a semiconductor substrate thereby eliminating stepping.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10316076A JPS5329087A (en) | 1976-08-31 | 1976-08-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10316076A JPS5329087A (en) | 1976-08-31 | 1976-08-31 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5329087A true JPS5329087A (en) | 1978-03-17 |
Family
ID=14346741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10316076A Pending JPS5329087A (en) | 1976-08-31 | 1976-08-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5329087A (en) |
-
1976
- 1976-08-31 JP JP10316076A patent/JPS5329087A/en active Pending
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