JPS5360586A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5360586A
JPS5360586A JP13572576A JP13572576A JPS5360586A JP S5360586 A JPS5360586 A JP S5360586A JP 13572576 A JP13572576 A JP 13572576A JP 13572576 A JP13572576 A JP 13572576A JP S5360586 A JPS5360586 A JP S5360586A
Authority
JP
Japan
Prior art keywords
insulation film
layer wiring
semiconductor device
parts
burying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13572576A
Other languages
Japanese (ja)
Other versions
JPS6118341B2 (en
Inventor
Ryoji Abe
Makoto Serigano
Yorihiro Uchiyama
Kuniaki Makabe
Akira Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13572576A priority Critical patent/JPS5360586A/en
Publication of JPS5360586A publication Critical patent/JPS5360586A/en
Publication of JPS6118341B2 publication Critical patent/JPS6118341B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To obtain multilayer wirings free from any fear for disconnection by burying the lateral stepping parts of the first insulation film covering first layer wiring with polyimide resin to make said parts mild and forming second layer wiring through a second insulation film over this.
COPYRIGHT: (C)1978,JPO&Japio
JP13572576A 1976-11-11 1976-11-11 Semiconductor device Granted JPS5360586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13572576A JPS5360586A (en) 1976-11-11 1976-11-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13572576A JPS5360586A (en) 1976-11-11 1976-11-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5360586A true JPS5360586A (en) 1978-05-31
JPS6118341B2 JPS6118341B2 (en) 1986-05-12

Family

ID=15158412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13572576A Granted JPS5360586A (en) 1976-11-11 1976-11-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5360586A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922332A (en) * 1982-07-28 1984-02-04 Matsushita Electronics Corp Semiconductor device
JPH0393253A (en) * 1989-08-31 1991-04-18 Delco Electron Corp Integrated circuit and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922332A (en) * 1982-07-28 1984-02-04 Matsushita Electronics Corp Semiconductor device
JPH0393253A (en) * 1989-08-31 1991-04-18 Delco Electron Corp Integrated circuit and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6118341B2 (en) 1986-05-12

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