JPS5319774A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5319774A
JPS5319774A JP9369676A JP9369676A JPS5319774A JP S5319774 A JPS5319774 A JP S5319774A JP 9369676 A JP9369676 A JP 9369676A JP 9369676 A JP9369676 A JP 9369676A JP S5319774 A JPS5319774 A JP S5319774A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
layer wiring
wiring film
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9369676A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP9369676A priority Critical patent/JPS5319774A/en
Publication of JPS5319774A publication Critical patent/JPS5319774A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To reduce the size of elements by using aluminum as a first layer wiring film and polycrystalline silicon as a second layer wiring film thereby obtaining highly reliable ohmic contacts and making contact holes smaller.
COPYRIGHT: (C)1978,JPO&Japio
JP9369676A 1976-08-06 1976-08-06 Semiconductor integrated circuit Pending JPS5319774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9369676A JPS5319774A (en) 1976-08-06 1976-08-06 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9369676A JPS5319774A (en) 1976-08-06 1976-08-06 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5319774A true JPS5319774A (en) 1978-02-23

Family

ID=14089555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9369676A Pending JPS5319774A (en) 1976-08-06 1976-08-06 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5319774A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270254A (en) * 1991-03-27 1993-12-14 Sgs-Thomson Microelectronics, Inc. Integrated circuit metallization with zero contact enclosure requirements and method of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270254A (en) * 1991-03-27 1993-12-14 Sgs-Thomson Microelectronics, Inc. Integrated circuit metallization with zero contact enclosure requirements and method of making the same
US5371410A (en) * 1991-03-27 1994-12-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit metallization with zero contact enclosure requirements

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