JPS6465856A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPS6465856A JPS6465856A JP22122687A JP22122687A JPS6465856A JP S6465856 A JPS6465856 A JP S6465856A JP 22122687 A JP22122687 A JP 22122687A JP 22122687 A JP22122687 A JP 22122687A JP S6465856 A JPS6465856 A JP S6465856A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- twofold
- aluminum
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To protect a upper wiring against exfoliation and a disconnection trouble by a method wherein the upper wiring of a twofold layer consisting of a titanium and an aluminum film is provided onto a lower wiring of a twofold layer composed of an aluminum and a titanium nitride film through the intermediary of an interlaminar insulating film and a through-hole. CONSTITUTION:An element 11 is built in a silicon substrate 1, an insulating film 2 is formed, and then an electrode contact hole 3 is provided. Next, a lower wiring 4 of a twofold layer consisting of aluminum layer 41 and a titanium nitride layer 42 is provided. Then, an interlaminar insulating film 5 is formed on the wiring 4, a through-hole 6 is provided to the film 5, and a upper wiring of a twofold layer composed of an aluminum layer 8 and a titanium layer 9 is formed through the intermediary of the through-hole 6 so as to construct a multi-layered wiring. By these processes, a upper wiring can be protected against exfoliation and a disconnection trouble.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22122687A JPS6465856A (en) | 1987-09-05 | 1987-09-05 | Semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22122687A JPS6465856A (en) | 1987-09-05 | 1987-09-05 | Semiconductor device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6465856A true JPS6465856A (en) | 1989-03-13 |
Family
ID=16763444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22122687A Pending JPS6465856A (en) | 1987-09-05 | 1987-09-05 | Semiconductor device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6465856A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5365088A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | Semiconductor device |
-
1987
- 1987-09-05 JP JP22122687A patent/JPS6465856A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5365088A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | Semiconductor device |
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