JPH10247725A5 - - Google Patents

Info

Publication number
JPH10247725A5
JPH10247725A5 JP1997050312A JP5031297A JPH10247725A5 JP H10247725 A5 JPH10247725 A5 JP H10247725A5 JP 1997050312 A JP1997050312 A JP 1997050312A JP 5031297 A JP5031297 A JP 5031297A JP H10247725 A5 JPH10247725 A5 JP H10247725A5
Authority
JP
Japan
Prior art keywords
layer
impurity
conductive layer
oxide film
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997050312A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10247725A (ja
Filing date
Publication date
Priority claimed from JP9050312A external-priority patent/JPH10247725A/ja
Priority to JP9050312A priority Critical patent/JPH10247725A/ja
Application filed filed Critical
Priority to TW086108609A priority patent/TW344899B/zh
Priority to KR1019970040214A priority patent/KR19980079317A/ko
Priority to FR9712478A priority patent/FR2760566B1/fr
Priority to DE19745249A priority patent/DE19745249A1/de
Priority to CNB971222606A priority patent/CN1162912C/zh
Priority to FR9808607A priority patent/FR2766617B1/fr
Publication of JPH10247725A publication Critical patent/JPH10247725A/ja
Priority to US09/366,732 priority patent/US6492690B2/en
Publication of JPH10247725A5 publication Critical patent/JPH10247725A5/ja
Pending legal-status Critical Current

Links

JP9050312A 1997-03-05 1997-03-05 半導体装置およびその製造方法 Pending JPH10247725A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP9050312A JPH10247725A (ja) 1997-03-05 1997-03-05 半導体装置およびその製造方法
TW086108609A TW344899B (en) 1997-03-05 1997-06-19 Semiconductor device and process for producing the same
KR1019970040214A KR19980079317A (ko) 1997-03-05 1997-08-22 반도체 장치 및 그 제조방법
FR9712478A FR2760566B1 (fr) 1997-03-05 1997-10-07 Dispositif a semiconducteurs ayant plusieurs types de transistors formes dans une puce et procede pour sa fabrication
DE19745249A DE19745249A1 (de) 1997-03-05 1997-10-13 Halbleiterbauelement und Herstellungsverfahren dafür
CNB971222606A CN1162912C (zh) 1997-03-05 1997-11-12 半导体装置及其制造方法
FR9808607A FR2766617B1 (fr) 1997-03-05 1998-07-06 Dispositif a semiconducteurs ayant plusieurs types de transistors formes dans une puce et procede pour sa fabrication
US09/366,732 US6492690B2 (en) 1997-03-05 1999-08-04 Semiconductor device having control electrodes with different impurity concentrations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9050312A JPH10247725A (ja) 1997-03-05 1997-03-05 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPH10247725A JPH10247725A (ja) 1998-09-14
JPH10247725A5 true JPH10247725A5 (enExample) 2004-12-02

Family

ID=12855386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9050312A Pending JPH10247725A (ja) 1997-03-05 1997-03-05 半導体装置およびその製造方法

Country Status (7)

Country Link
US (1) US6492690B2 (enExample)
JP (1) JPH10247725A (enExample)
KR (1) KR19980079317A (enExample)
CN (1) CN1162912C (enExample)
DE (1) DE19745249A1 (enExample)
FR (2) FR2760566B1 (enExample)
TW (1) TW344899B (enExample)

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JP4199338B2 (ja) 1998-10-02 2008-12-17 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
US7220281B2 (en) 1999-08-18 2007-05-22 Intrinsic Therapeutics, Inc. Implant for reinforcing and annulus fibrosis
KR100513445B1 (ko) * 1999-09-10 2005-09-07 삼성전자주식회사 반도체 장치의 제조방법
JP2001110908A (ja) * 1999-10-06 2001-04-20 Nec Corp 半導体装置及びその製造方法
JP4823408B2 (ja) 2000-06-08 2011-11-24 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
US6833329B1 (en) 2000-06-22 2004-12-21 Micron Technology, Inc. Methods of forming oxide regions over semiconductor substrates
US6649543B1 (en) 2000-06-22 2003-11-18 Micron Technology, Inc. Methods of forming silicon nitride, methods of forming transistor devices, and transistor devices
US6956757B2 (en) 2000-06-22 2005-10-18 Contour Semiconductor, Inc. Low cost high density rectifier matrix memory
US6686298B1 (en) 2000-06-22 2004-02-03 Micron Technology, Inc. Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates
US6660657B1 (en) 2000-08-07 2003-12-09 Micron Technology, Inc. Methods of incorporating nitrogen into silicon-oxide-containing layers
JP2002368144A (ja) * 2001-06-13 2002-12-20 Hitachi Ltd 不揮発性半導体記憶装置およびその製造方法
US6878585B2 (en) 2001-08-29 2005-04-12 Micron Technology, Inc. Methods of forming capacitors
US6723599B2 (en) 2001-12-03 2004-04-20 Micron Technology, Inc. Methods of forming capacitors and methods of forming capacitor dielectric layers
DE10209334A1 (de) * 2002-03-02 2003-10-09 Infineon Technologies Ag Füllverfahren für Mulden auf einer Halbleiterscheibe
US7112857B2 (en) * 2004-07-06 2006-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Devices with different electrical gate dielectric thicknesses but with substantially similar physical configurations
JP2006049365A (ja) * 2004-07-30 2006-02-16 Nec Electronics Corp 半導体装置
JP2006059880A (ja) * 2004-08-17 2006-03-02 Fujitsu Ltd 半導体装置及びその製造方法
KR100680488B1 (ko) * 2005-01-13 2007-02-08 주식회사 하이닉스반도체 플래쉬 메모리 소자의 제조방법
US20060237778A1 (en) * 2005-04-22 2006-10-26 Mu-Yi Liu Non-volatile semiconductor memory cell and method of manufacturing the same
US7485528B2 (en) * 2006-07-14 2009-02-03 Micron Technology, Inc. Method of forming memory devices by performing halogen ion implantation and diffusion processes
US8159895B2 (en) 2006-08-17 2012-04-17 Broadcom Corporation Method and system for split threshold voltage programmable bitcells
JP4421629B2 (ja) * 2007-04-25 2010-02-24 株式会社東芝 半導体装置の製造方法
US7718496B2 (en) * 2007-10-30 2010-05-18 International Business Machines Corporation Techniques for enabling multiple Vt devices using high-K metal gate stacks
US7933133B2 (en) * 2007-11-05 2011-04-26 Contour Semiconductor, Inc. Low cost, high-density rectifier matrix memory
WO2011074407A1 (en) 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5778900B2 (ja) * 2010-08-20 2015-09-16 富士通セミコンダクター株式会社 半導体装置の製造方法
US9224475B2 (en) * 2012-08-23 2015-12-29 Sandisk Technologies Inc. Structures and methods for making NAND flash memory
JP5564588B2 (ja) * 2013-02-07 2014-07-30 ルネサスエレクトロニクス株式会社 半導体装置
US9443862B1 (en) 2015-07-24 2016-09-13 Sandisk Technologies Llc Select gates with select gate dielectric first
US9613971B2 (en) 2015-07-24 2017-04-04 Sandisk Technologies Llc Select gates with central open areas
CN107026192B (zh) * 2016-02-02 2020-05-29 中芯国际集成电路制造(上海)有限公司 半导体装置的制造方法
CN114005746B (zh) * 2021-10-29 2025-08-29 上海华力微电子有限公司 一种高压器件的栅氧层及其制造方法
CN116779615B (zh) * 2023-08-23 2023-11-07 合肥晶合集成电路股份有限公司 一种集成半导体器件及其制作方法

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US4249968A (en) * 1978-12-29 1981-02-10 International Business Machines Corporation Method of manufacturing a metal-insulator-semiconductor utilizing a multiple stage deposition of polycrystalline layers
JPS56120166A (en) * 1980-02-27 1981-09-21 Hitachi Ltd Semiconductor ic device and manufacture thereof
US4745079A (en) * 1987-03-30 1988-05-17 Motorola, Inc. Method for fabricating MOS transistors having gates with different work functions
US4912676A (en) * 1988-08-09 1990-03-27 Texas Instruments, Incorporated Erasable programmable memory
US4914046A (en) * 1989-02-03 1990-04-03 Motorola, Inc. Polycrystalline silicon device electrode and method
US5021356A (en) 1989-08-24 1991-06-04 Delco Electronics Corporation Method of making MOSFET depletion device
DE69006978T2 (de) * 1989-08-24 1994-06-09 Delco Electronics Corp MOSFET-Verarmungsanordnung.
JP2978345B2 (ja) * 1992-11-26 1999-11-15 三菱電機株式会社 半導体装置の製造方法
US5340764A (en) * 1993-02-19 1994-08-23 Atmel Corporation Integration of high performance submicron CMOS and dual-poly non-volatile memory devices using a third polysilicon layer
JPH06342881A (ja) 1993-06-02 1994-12-13 Toshiba Corp 半導体装置およびその製造方法
EP0639856A1 (en) * 1993-08-20 1995-02-22 Texas Instruments Incorporated Method of doping a polysilicon layer and semiconductor device obtained
JPH07263680A (ja) * 1994-03-24 1995-10-13 Hitachi Ltd 半導体装置の製造方法
JP3444687B2 (ja) * 1995-03-13 2003-09-08 三菱電機株式会社 不揮発性半導体記憶装置
US5480830A (en) * 1995-04-04 1996-01-02 Taiwan Semiconductor Manufacturing Company Ltd. Method of making depleted gate transistor for high voltage operation
JP3243151B2 (ja) * 1995-06-01 2002-01-07 東芝マイクロエレクトロニクス株式会社 半導体装置の製造方法
DE69528971D1 (de) 1995-06-30 2003-01-09 St Microelectronics Srl Herstellungsverfahren eines Schaltkreises, der nichtflüchtige Speicherzellen und Randtransistoren von mindestens zwei unterschiedlichen Typen enthält, und entsprechender IC
US5753958A (en) * 1995-10-16 1998-05-19 Sun Microsystems, Inc. Back-biasing in asymmetric MOS devices
US5767558A (en) * 1996-05-10 1998-06-16 Integrated Device Technology, Inc. Structures for preventing gate oxide degradation

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