JPH09107168A - 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器 - Google Patents

配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器

Info

Publication number
JPH09107168A
JPH09107168A JP8059862A JP5986296A JPH09107168A JP H09107168 A JPH09107168 A JP H09107168A JP 8059862 A JP8059862 A JP 8059862A JP 5986296 A JP5986296 A JP 5986296A JP H09107168 A JPH09107168 A JP H09107168A
Authority
JP
Japan
Prior art keywords
wiring board
laser
laser beam
processing method
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8059862A
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuki Kurosawa
満樹 黒澤
Tsukasa Fukushima
司 福島
Masanori Mizuno
正紀 水野
Yoshimizu Takeno
祥瑞 竹野
Masaharu Moriyasu
雅治 森安
Masayuki Kaneko
雅之 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8059862A priority Critical patent/JPH09107168A/ja
Priority to US08/690,140 priority patent/US20030146196A1/en
Priority to TW085109427A priority patent/TW312082B/zh
Priority to CN96111476A priority patent/CN1098022C/zh
Priority to KR1019960032874A priority patent/KR100199955B1/ko
Publication of JPH09107168A publication Critical patent/JPH09107168A/ja
Priority to US09/994,719 priority patent/US6972392B2/en
Priority to US11/087,568 priority patent/US20050184035A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
JP8059862A 1995-08-07 1996-03-15 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器 Pending JPH09107168A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP8059862A JPH09107168A (ja) 1995-08-07 1996-03-15 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器
US08/690,140 US20030146196A1 (en) 1995-08-07 1996-07-31 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
TW085109427A TW312082B (enExample) 1995-08-07 1996-08-05
CN96111476A CN1098022C (zh) 1995-08-07 1996-08-07 电路底板激光加工法及其加工装置和二氧化碳激光振荡器
KR1019960032874A KR100199955B1 (ko) 1995-08-07 1996-08-07 배선기판의 레이저가공방법, 배선기판의 레이저가공장치 및 배선기판 가공용의 탄산가스 레이저발진기
US09/994,719 US6972392B2 (en) 1995-08-07 2001-11-28 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
US11/087,568 US20050184035A1 (en) 1995-08-07 2005-03-24 Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP20119495 1995-08-07
JP7-201194 1995-08-07
JP8059862A JPH09107168A (ja) 1995-08-07 1996-03-15 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器

Publications (1)

Publication Number Publication Date
JPH09107168A true JPH09107168A (ja) 1997-04-22

Family

ID=26400942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8059862A Pending JPH09107168A (ja) 1995-08-07 1996-03-15 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器

Country Status (5)

Country Link
US (1) US20030146196A1 (enExample)
JP (1) JPH09107168A (enExample)
KR (1) KR100199955B1 (enExample)
CN (1) CN1098022C (enExample)
TW (1) TW312082B (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048088A (ja) * 2001-07-31 2003-02-18 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工機
WO2003084012A1 (fr) * 2002-04-02 2003-10-09 Mitsubishi Denki Kabushiki Kaisha Procede et systeme d'usinage laser
US6705914B2 (en) 2000-04-18 2004-03-16 Matsushita Electric Industrial Co., Ltd. Method of forming spherical electrode surface for high intensity discharge lamp
US6911623B2 (en) 2001-04-05 2005-06-28 Mitsubishi Denki Kabushiki Kaisha Carbon dioxide gas laser machining method of multilayer material
JP2007118079A (ja) * 2005-09-30 2007-05-17 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
JP2008526276A (ja) * 2004-12-30 2008-07-24 ミラー，アール．ジェイ．ドウェイン 直接駆動アブレーションのためのｉｒ波長範囲でのインパルス熱蓄積によるレーザ選択的切断
JP2008212999A (ja) * 2007-03-06 2008-09-18 Disco Abrasive Syst Ltd レーザー加工装置
CN101969746A (zh) * 2010-11-04 2011-02-09 沪士电子股份有限公司 印刷电路板镂空区局部除电镀铜的方法
JP2011101904A (ja) * 2005-09-30 2011-05-26 Hitachi Via Mechanics Ltd レーザ加工方法
JP2013028828A (ja) * 2011-07-27 2013-02-07 Furukawa Electric Co Ltd:The レーザ加工用銅板
JP2015006677A (ja) * 2013-06-25 2015-01-15 ビアメカニクス株式会社 レーザ穴明け加工方法
JP2016055303A (ja) * 2014-09-08 2016-04-21 パナソニックＩｐマネジメント株式会社 コンフォーマルマスク材料のレーザ加工方法
CN117464170A (zh) * 2023-12-27 2024-01-30 武汉铱科赛科技有限公司 一种层间电连激光加工方法、设备、装置及系统

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861364B1 (en) * 1999-11-30 2005-03-01 Canon Kabushiki Kaisha Laser etching method and apparatus therefor
US6281471B1 (en) * 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US7671295B2 (en) 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP4634692B2 (ja) * 2001-01-31 2011-02-16 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ処理方法
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
DE60313900T2 (de) 2002-03-12 2008-01-17 Hamamatsu Photonics K.K., Hamamatsu Methode zur Trennung von Substraten
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
TW200617794A (en) * 2004-09-14 2006-06-01 Oji Paper Co Tape with built-in IC chip, production method thereof, and sheet with built-in IC chip
JP5553397B2 (ja) * 2007-07-19 2014-07-16 日東電工株式会社 レーザー加工方法
CN102439211B (zh) * 2009-01-28 2016-04-13 阿尔巴尼国际公司 用于生产非织造布的工业织物及其制造方法
CN102317028A (zh) * 2009-02-13 2012-01-11 录象射流技术公司 激光器参数调整
US8529991B2 (en) * 2009-07-31 2013-09-10 Raytheon Canada Limited Method and apparatus for cutting a part without damaging a coating thereon
KR20130130769A (ko) * 2011-01-05 2013-12-02 가부시키가이샤 유키기쥬츠소고 빔 가공 장치
CN103857207B (zh) * 2012-11-30 2017-03-01 碁鼎科技秦皇岛有限公司 电路板及其制作方法
JP2014120568A (ja) * 2012-12-14 2014-06-30 Showa Denko Packaging Co Ltd 配線基板の表裏導通方法
CN103909351A (zh) * 2013-01-04 2014-07-09 欣兴电子股份有限公司 线路板以及此线路板的激光钻孔方法
CN103286456B (zh) * 2013-05-07 2015-07-01 大族激光科技产业集团股份有限公司 激光切割装置及切割方法
CN103747636A (zh) * 2013-12-24 2014-04-23 广州兴森快捷电路科技有限公司 镀金线路板引线回蚀的方法
CN106199830A (zh) * 2015-05-08 2016-12-07 中兴通讯股份有限公司 光波导的制备方法及装置
CN105578771A (zh) * 2015-12-31 2016-05-11 广州兴森快捷电路科技有限公司 电路板内槽的加工方法
JP2020109820A (ja) * 2019-01-01 2020-07-16 大船企業日本株式会社 プリント基板のレーザ加工方法およびプリント基板のレーザ加工機
CN112444162B (zh) * 2019-09-02 2023-10-13 西安尚道电子科技有限公司 一种导电布精度靶板制造方法
US20220316069A1 (en) * 2019-09-13 2022-10-06 Zefa Co., Ltd. Molded circuit component and electronic device
CN113099615B (zh) * 2021-04-01 2022-09-06 深圳市祺利电子有限公司 一种大尺寸线路板钻孔定位方法
CN112992880B (zh) * 2021-04-25 2023-08-15 江西沃格光电股份有限公司 一种Mini-LED背光板通孔的形成方法及电子设备
CN114152614A (zh) * 2021-12-24 2022-03-08 深圳技师学院（深圳高级技工学校） 一种覆盖膜激光切割碳化程度的测量方法
CN119511056B (zh) * 2024-10-18 2025-08-05 武汉铱科赛科技有限公司 一种盲孔可靠性测试方法、设备、装置及系统
CN119589111A (zh) * 2024-10-30 2025-03-11 杭州银湖激光科技有限公司 一种金刚石的激光切割装置及切割方法
CN120404231B (zh) * 2025-07-02 2025-09-05 乐捷家居股份有限公司 一种家具材料检测取样装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705914B2 (en) 2000-04-18 2004-03-16 Matsushita Electric Industrial Co., Ltd. Method of forming spherical electrode surface for high intensity discharge lamp
US6911623B2 (en) 2001-04-05 2005-06-28 Mitsubishi Denki Kabushiki Kaisha Carbon dioxide gas laser machining method of multilayer material
JP2003048088A (ja) * 2001-07-31 2003-02-18 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工機
WO2003084012A1 (fr) * 2002-04-02 2003-10-09 Mitsubishi Denki Kabushiki Kaisha Procede et systeme d'usinage laser
JP2014061391A (ja) * 2004-12-30 2014-04-10 Attodyne Inc 直接駆動アブレーションのためのｉｒ波長範囲でのインパルス熱蓄積によるレーザ選択的切断
JP2008526276A (ja) * 2004-12-30 2008-07-24 ミラー，アール．ジェイ．ドウェイン 直接駆動アブレーションのためのｉｒ波長範囲でのインパルス熱蓄積によるレーザ選択的切断
JP2007118079A (ja) * 2005-09-30 2007-05-17 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
JP2011101904A (ja) * 2005-09-30 2011-05-26 Hitachi Via Mechanics Ltd レーザ加工方法
US8319147B2 (en) 2005-09-30 2012-11-27 Hitachi Via Mechanics, Ltd. Laser machining method and laser machining apparatus
JP2008212999A (ja) * 2007-03-06 2008-09-18 Disco Abrasive Syst Ltd レーザー加工装置
US8779325B2 (en) 2007-03-06 2014-07-15 Disco Corporation Laser beam processing machine
CN101969746A (zh) * 2010-11-04 2011-02-09 沪士电子股份有限公司 印刷电路板镂空区局部除电镀铜的方法
CN101969746B (zh) 2010-11-04 2012-05-09 沪士电子股份有限公司 印刷电路板镂空区局部除电镀铜的方法
JP2013028828A (ja) * 2011-07-27 2013-02-07 Furukawa Electric Co Ltd:The レーザ加工用銅板
JP2015006677A (ja) * 2013-06-25 2015-01-15 ビアメカニクス株式会社 レーザ穴明け加工方法
JP2016055303A (ja) * 2014-09-08 2016-04-21 パナソニックＩｐマネジメント株式会社 コンフォーマルマスク材料のレーザ加工方法
CN117464170A (zh) * 2023-12-27 2024-01-30 武汉铱科赛科技有限公司 一种层间电连激光加工方法、设备、装置及系统
CN117464170B (zh) * 2023-12-27 2024-04-02 武汉铱科赛科技有限公司 一种层间电连激光加工方法、设备、装置及系统

Also Published As

Publication number Publication date
CN1142743A (zh) 1997-02-12
TW312082B (enExample) 1997-08-01
KR100199955B1 (ko) 1999-06-15
US20030146196A1 (en) 2003-08-07
KR970013540A (ko) 1997-03-29
CN1098022C (zh) 2003-01-01

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