JPH07505187A - 銅の電解析出のための酸性めっき浴及び当該浴の使用法 - Google Patents
銅の電解析出のための酸性めっき浴及び当該浴の使用法Info
- Publication number
- JPH07505187A JPH07505187A JP5503171A JP50317193A JPH07505187A JP H07505187 A JPH07505187 A JP H07505187A JP 5503171 A JP5503171 A JP 5503171A JP 50317193 A JP50317193 A JP 50317193A JP H07505187 A JPH07505187 A JP H07505187A
- Authority
- JP
- Japan
- Prior art keywords
- phenazonium
- acidic water
- poly
- methyl
- ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002378 acidificating effect Effects 0.000 title claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 13
- 239000010949 copper Substances 0.000 title claims description 13
- 229910052802 copper Inorganic materials 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 3
- 230000008021 deposition Effects 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 239000002904 solvent Substances 0.000 claims description 36
- -1 Polypropylene-dimethyl Polymers 0.000 claims description 22
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 14
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 11
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 11
- 239000002202 Polyethylene glycol Substances 0.000 claims description 10
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 10
- 229920001223 polyethylene glycol Polymers 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 159000000000 sodium salts Chemical class 0.000 claims description 7
- 150000001983 dialkylethers Chemical class 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 5
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229920001281 polyalkylene Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 3
- 229920002125 Sokalan® Polymers 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000004584 polyacrylic acid Substances 0.000 claims description 3
- CQNZIRSBRGJNTO-UHFFFAOYSA-N 1,3-thiazolidine-2-thiol Chemical compound SC1NCCS1 CQNZIRSBRGJNTO-UHFFFAOYSA-N 0.000 claims description 2
- BVPHXTUEZOQIBS-UHFFFAOYSA-N 6-methyl-1h-pyrimidine-2-thione Chemical compound CC1=CC=NC(S)=N1 BVPHXTUEZOQIBS-UHFFFAOYSA-N 0.000 claims description 2
- YIDHJKMWDMLJKK-UHFFFAOYSA-N C(#N)CC(=O)NC(=S)N.C(C)NC(=S)N.FC(C(=O)NC(=S)N)(F)F.C(C)(=O)NC(=S)N Chemical compound C(#N)CC(=O)NC(=S)N.C(C)NC(=S)N.FC(C(=O)NC(=S)N)(F)F.C(C)(=O)NC(=S)N YIDHJKMWDMLJKK-UHFFFAOYSA-N 0.000 claims description 2
- PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 150000002466 imines Chemical class 0.000 claims description 2
- 229920000333 poly(propyleneimine) Polymers 0.000 claims description 2
- 229920001748 polybutylene Polymers 0.000 claims description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 2
- 150000003585 thioureas Chemical class 0.000 claims 2
- 229920002873 Polyethylenimine Polymers 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 claims 1
- IOGYHRRCLCUDCC-UHFFFAOYSA-L disodium hydroxy-dioxido-sulfanylidene-lambda5-phosphane Chemical compound P(=S)([O-])([O-])O.[Na+].[Na+] IOGYHRRCLCUDCC-UHFFFAOYSA-L 0.000 claims 1
- ACLZYRNSDLQOIA-UHFFFAOYSA-N o-tolylthiourea Chemical compound CC1=CC=CC=C1NC(N)=S ACLZYRNSDLQOIA-UHFFFAOYSA-N 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 claims 1
- 150000003672 ureas Chemical class 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 description 15
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000005868 electrolysis reaction Methods 0.000 description 9
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 239000011780 sodium chloride Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- APWIQNJBGHKQRN-UHFFFAOYSA-N imidazolidine-2-thiol Chemical compound SC1NCCN1 APWIQNJBGHKQRN-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000002459 sustained effect Effects 0.000 description 3
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- RYYWUUFWQRZTIU-UHFFFAOYSA-N Thiophosphoric acid Chemical class OP(O)(S)=O RYYWUUFWQRZTIU-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229920000159 gelatin Polymers 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 235000019322 gelatine Nutrition 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- MWXMWLZIZRDIBL-UHFFFAOYSA-N 5-phenyl-4a,10-dihydro-4h-phenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC=CC=C2[NH2+]C2=CC(N)=CCC2N1C1=CC=CC=C1 MWXMWLZIZRDIBL-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241000594009 Phoxinus phoxinus Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- DCHNLPQEUKEYLN-UHFFFAOYSA-N [Mo].[CH2]CCCCCCC Chemical compound [Mo].[CH2]CCCCCCC DCHNLPQEUKEYLN-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229940100198 alkylating agent Drugs 0.000 description 1
- 239000002168 alkylating agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 229920003176 water-insoluble polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (18)
- 1.一般式 ▲数式、化学式、表等があります▲ のポリアルキレングリコールジアルキルエーテル(ここでn=8〜800、m= 0〜50、R1は低級アルキルC1〜C4で、R2は脂肪鎖又は芳香族残基、及 びaは1乃至2を意味する)を含有する、光沢があって平滑にされた銅被覆の電 気分解のための酸性の含水溶剤。
- 2.0.005〜30g/リットルの濃度のポリアルキレングリコールジアルキ ルエーテル又はその混合物を含有するクレーム1の酸性の含水溶剤。
- 3.ジメチル−ポリエチレングリコールエーテルジ−第3ブチル−ポリエチレン グリコールエーテルステアリル−モノメチル−ポリエチレングリコールエーテル ノニルフェニル−モノメチル−ポリエチレングリコールエーテルポリエチレン− ポリプロピレン−ジメチルエーテルオクチル−モノメチル−ポリアルキレンエー テルジメチル−ビス(ポリアルキレングリコール)オクチレンエーテル及び/又 は β−ナフトール−モノメチル−ポリエチレングリコールエーテルを含有するクレ ーム1及び2の酸性の含水溶剤。
- 4.追加的にチオ化合物又は多数のチオ化合物の混合物を含有するクレーム1〜 3の酸性の含水溶剤。
- 5.3−メルカプトプロパン−1−スルフォン酸、ナトリウム塩チオ燐酸−O− エチル−ビス−(ω−スルフォプロピル)−エステル、ニナトリウム塩 チオ燐酸−トリス−(ω−スルフォプロピル)−エステル、三ナトリウム塩 チオグリコール酸 エチレンジチオジプロピルスルフォン酸、ナトリウム塩ビス−(ω−スルフォプ ロピル)−二硫化物、二ナトリウム塩ビス−(ω−スルフォプロピル)−硫化物 、二ナトリウム塩O−エチル−ジチオ炭酸−S−(ω−スルフォプロピル)−エ ステル、カリウム塩 3(ベンゾチアソリル−2−チオ)−プロピルスルフォン酸、ナトリウム塩 ビス−(ω−スルフォハイドロキシプロピル)−二硫化物、二ナトリウム塩 ビス−(ω−スルフォブチル)−二硫化物、二ナトリウム塩ビス−(p−スルフ ォフェニル)−二硫化物、二ナトリウム塩メチル−(ω−スルフォプロピル)− 二硫化物、二ナトリウム塩及び/又は メチル−(ω−スルフォプロピル)−三硫化物、二ナトリウム塩を含有するクレ ーム4の酸性の含水溶剤。
- 6.0.0005〜0.4g/リットルの濃度のチオ化合物を含有するクレーム 4及び5の酸性の含水溶剤。
- 7.少なくとも1種のポリマーのフェナゾニウム化合物での追加的成分を特徴と するクレーム1〜6の酸性の含水溶剤。
- 8.ポリ(6−メチル−7−ジメチルアミノ−5−フェニル−硫酸フェナゾニウ ム)ポリ(2−メチル−7−ジェチルアミノ−5−フェニル−塩化フェナゾニウ ム)ポリ(2−メチル−7−ジメチルアミノ−5−フェニル−硫酸フェナゾニウ ム)ポリ(5−メチル−7−ジメチルアミノ−酢酸フェナゾニウム)ポリ(2− メチル−7−アニリノ−5−フェニル−硫酸フェナゾニウム)ポリ(2−メチル −7−ジメチルアミノ−硫酸フェナゾニウム)ポリ(7−メチルアミノ−5−フ ェニル−酢酸フェナゾニウム)ポリ(7−エチルアミノ−2,5−ジフェニル− 塩化フェナゾニウム)ポリ(2,8−ジメチル−7−ジエチルアミノ−5−p− トリル−塩化フェナゾニウム)ポリ(2,5,8−トリフェニル−7−ジメチル アミノ−硫酸フェナゾニウム)ポリ(2,8−ジメチル−7−アミノ−5−フェ ニル−硫酸フェナゾニウム)及び/又は ポリ(7−ジメチルアミノ−5−フェニル−塩化フェナゾニウム)を含有するク レーム7の酸性の含水溶剤。
- 9.0.0001〜0.5g/リットルの濃度のポリマーのフエナゾニウム化合 物を含有する、クレーム7及び8の酸性の含水溶剤。
- 10.少なくとも1種のチオ尿素誘導体での追加的成分を特徴とするクレーム1 〜6の酸性の含水溶剤。
- 11.N−アセチルチオ尿素 N−トリフルオロアセチルチオ尿素 N−エチルチオ尿素 N−シアノアセチルチオ尿素 N−アリルチオ尿素 o−トリルチオ尿素 N,N′−ブチレンチオ尿素 チアゾリジンチオール(2) 4−チアゾリンチオール(2) イミダゾリジンチオール(2)(N,N′−エチレンチオ尿素)4−メチル−2 −ピリミジンチオール及び/又は2−チオウラシル を含有する、クレーム10の酸性の含水溶剤。
- 12.0.0001〜0.5g/リットルの濃度のチオ尿素誘導体を含有する、 クレーム10及び11の酸性の含水溶剤。
- 13.少なくとも1種のポリマーの尿素化合物の追加的成分を特徴とするクレー ム1〜6の酸性の含水溶剤。
- 14.ポリエチレンイミン ポリエチレンイミド ポリアクリル酸アミド ポリプロピレンイミン ポリブチレンイミン N−メチルポリエチレンイミン N−アセチルポリエチレンイミン及び/又はN−ブチルポリエチレンイミン を含有する、クレーム13の酸性の含有溶剤。
- 15.0.0001〜0.5g/リットルの濃度のポリマーの尿素化合物を含有 する、クレーム13及び14の酸性の含水溶剤。
- 16.クレーム1〜3に従うポリアルキレングリコールジアルキルエーテル及び クレーム4〜6に従うチオ化合物での成分を特徴とする酸性の含水溶剤。
- 17.プリント回路の条導体の強化のためのクレーム1〜16の少なくとも1項 に記載の溶剤の使用法。
- 18.光沢があって平滑な銅被覆の製造のためのクレーム1〜16の少なくとも 1項に記載の溶剤の使用法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4126502A DE4126502C1 (ja) | 1991-08-07 | 1991-08-07 | |
DE4126502.5 | 1991-08-07 | ||
PCT/DE1992/000605 WO1993003204A1 (de) | 1991-08-07 | 1992-07-22 | Saures bad zur galvanischen abscheidung von kupfer und dessen verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07505187A true JPH07505187A (ja) | 1995-06-08 |
JP3121346B2 JP3121346B2 (ja) | 2000-12-25 |
Family
ID=6438067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP05503171A Expired - Lifetime JP3121346B2 (ja) | 1991-08-07 | 1992-07-22 | 銅の電解析出のための酸性めっき浴及び当該浴の使用法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5433840A (ja) |
EP (1) | EP0598763B1 (ja) |
JP (1) | JP3121346B2 (ja) |
AT (1) | ATE131546T1 (ja) |
CA (1) | CA2115062C (ja) |
DE (2) | DE4126502C1 (ja) |
ES (1) | ES2082486T3 (ja) |
WO (1) | WO1993003204A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000014306A1 (en) * | 1998-09-03 | 2000-03-16 | Ebara Corporation | Method for plating substrate and apparatus |
JP2003183875A (ja) * | 2001-10-02 | 2003-07-03 | Shipley Co Llc | 基体上に金属層を堆積させるためのメッキ浴および方法 |
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AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
DE3722778A1 (de) * | 1987-07-09 | 1989-03-09 | Raschig Ag | Polyalkylenglykol-naphthyl-3-sulfopropyl- diether und deren salze, verfahren zur herstellung dieser verbindungen und ihre verwendung als netzmittel in der galvanotechnik |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
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- 1991-08-07 DE DE4126502A patent/DE4126502C1/de not_active Expired - Fee Related
-
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- 1992-07-22 WO PCT/DE1992/000605 patent/WO1993003204A1/de active IP Right Grant
- 1992-07-22 JP JP05503171A patent/JP3121346B2/ja not_active Expired - Lifetime
- 1992-07-22 EP EP92916259A patent/EP0598763B1/de not_active Expired - Lifetime
- 1992-07-22 DE DE59204703T patent/DE59204703D1/de not_active Expired - Lifetime
- 1992-07-22 AT AT92916259T patent/ATE131546T1/de active
- 1992-07-22 ES ES92916259T patent/ES2082486T3/es not_active Expired - Lifetime
- 1992-07-22 CA CA002115062A patent/CA2115062C/en not_active Expired - Fee Related
- 1992-07-22 US US08/193,016 patent/US5433840A/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000014306A1 (en) * | 1998-09-03 | 2000-03-16 | Ebara Corporation | Method for plating substrate and apparatus |
JP2003183875A (ja) * | 2001-10-02 | 2003-07-03 | Shipley Co Llc | 基体上に金属層を堆積させるためのメッキ浴および方法 |
JP4651906B2 (ja) * | 2001-10-02 | 2011-03-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 基体上に金属層を堆積させるためのメッキ浴および方法 |
JP2016503461A (ja) * | 2012-11-26 | 2016-02-04 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 銅めっき浴組成物 |
JP2017503929A (ja) * | 2013-11-25 | 2017-02-02 | エンソン インコーポレイテッド | 銅の電析 |
JP2017066514A (ja) * | 2015-09-29 | 2017-04-06 | 三菱マテリアル株式会社 | 高純度銅電解精錬用添加剤と高純度銅製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE4126502C1 (ja) | 1993-02-11 |
EP0598763B1 (de) | 1995-12-13 |
JP3121346B2 (ja) | 2000-12-25 |
WO1993003204A1 (de) | 1993-02-18 |
US5433840A (en) | 1995-07-18 |
ES2082486T3 (es) | 1996-03-16 |
ATE131546T1 (de) | 1995-12-15 |
DE59204703D1 (de) | 1996-01-25 |
CA2115062C (en) | 2005-11-22 |
CA2115062A1 (en) | 1993-02-18 |
EP0598763A1 (de) | 1994-06-01 |
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