MX2021005299A - Ba?o de cobre satinado y metodo de deposito de una capa de cobre satinado. - Google Patents

Ba?o de cobre satinado y metodo de deposito de una capa de cobre satinado.

Info

Publication number
MX2021005299A
MX2021005299A MX2021005299A MX2021005299A MX2021005299A MX 2021005299 A MX2021005299 A MX 2021005299A MX 2021005299 A MX2021005299 A MX 2021005299A MX 2021005299 A MX2021005299 A MX 2021005299A MX 2021005299 A MX2021005299 A MX 2021005299A
Authority
MX
Mexico
Prior art keywords
satin
satin copper
depositing
bath
additive
Prior art date
Application number
MX2021005299A
Other languages
English (en)
Inventor
George Bokisa
Claire Theuret
Original Assignee
Coventya Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Inc filed Critical Coventya Inc
Publication of MX2021005299A publication Critical patent/MX2021005299A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Un baño de galvanoplastia de cobre ácido acuoso que produce un depósito satinado incluye una fuente de iones de cobre, un ácido, un aditivo satinado, y opcionalmente uno o más aditivos de baño de galvanoplastia de cobre ácido, en donde el aditivo satinado incluye un copolímero de bloque con la estructura de RO(EO)m(PO)nH.
MX2021005299A 2018-11-07 2019-11-01 Ba?o de cobre satinado y metodo de deposito de una capa de cobre satinado. MX2021005299A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862756787P 2018-11-07 2018-11-07
PCT/US2019/059496 WO2020096906A1 (en) 2018-11-07 2019-11-01 Satin copper bath and method of depositing a satin copper layer

Publications (1)

Publication Number Publication Date
MX2021005299A true MX2021005299A (es) 2021-09-14

Family

ID=70612131

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021005299A MX2021005299A (es) 2018-11-07 2019-11-01 Ba?o de cobre satinado y metodo de deposito de una capa de cobre satinado.

Country Status (7)

Country Link
US (1) US11555252B2 (es)
EP (1) EP3877571A4 (es)
KR (1) KR20210094558A (es)
CN (1) CN113166962A (es)
CA (1) CA3119028A1 (es)
MX (1) MX2021005299A (es)
WO (1) WO2020096906A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112030199B (zh) * 2020-08-27 2021-11-12 江苏艾森半导体材料股份有限公司 一种用于先进封装的高速电镀铜添加剂及电镀液
CN113430595A (zh) * 2021-06-24 2021-09-24 惠州市安泰普表面处理科技有限公司 一种在黄铜铸件表面镀铜的方法

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FR2510145B1 (fr) 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
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US4673467A (en) 1986-09-02 1987-06-16 Cbs Inc. Method of manufacturing fine-grained copper substrate for optical information carrier
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US4948474A (en) 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
DE3741459C1 (de) 1987-12-08 1989-04-13 Blasberg Oberflaechentech Verfahren zur Herstellung durchkontaktierter Leiterplatten
DE3817722A1 (de) 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
US5068013A (en) 1988-08-23 1991-11-26 Shipley Company Inc. Electroplating composition and process
US4897165A (en) 1988-08-23 1990-01-30 Shipley Company Inc. Electroplating composition and process for plating through holes in printed circuit boards
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
US4990224A (en) 1988-12-21 1991-02-05 International Business Machines Corporation Copper plating bath and process for difficult to plate metals
US4954226A (en) 1988-12-21 1990-09-04 International Business Machines Corporation Additive plating bath and process
US5403465A (en) 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
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EP0469724B1 (en) 1990-08-03 1995-06-07 Mcgean-Rohco, Inc. Copper plating of gravure rolls
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DE4126502C1 (es) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
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JP2001107287A (ja) * 1999-10-07 2001-04-17 Ebara Udylite Kk Ｓｎ−Ｃｕ合金めっき浴
EP1148156A3 (en) * 2000-04-11 2004-02-04 Shipley Company LLC Copper Electroplating
US20030155247A1 (en) * 2002-02-19 2003-08-21 Shipley Company, L.L.C. Process for electroplating silicon wafers
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Also Published As

Publication number Publication date
CN113166962A (zh) 2021-07-23
CA3119028A1 (en) 2020-05-14
EP3877571A1 (en) 2021-09-15
EP3877571A4 (en) 2022-08-17
WO2020096906A1 (en) 2020-05-14
KR20210094558A (ko) 2021-07-29
US11555252B2 (en) 2023-01-17
US20210404083A1 (en) 2021-12-30

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