JPH0558660B2 - - Google Patents

Info

Publication number
JPH0558660B2
JPH0558660B2 JP1140476A JP14047689A JPH0558660B2 JP H0558660 B2 JPH0558660 B2 JP H0558660B2 JP 1140476 A JP1140476 A JP 1140476A JP 14047689 A JP14047689 A JP 14047689A JP H0558660 B2 JPH0558660 B2 JP H0558660B2
Authority
JP
Japan
Prior art keywords
semiconductor element
conductor wiring
ring
pressurizing body
pressurizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1140476A
Other languages
English (en)
Japanese (ja)
Other versions
JPH034546A (ja
Inventor
Tomohiko Suzuki
Izumi Okamoto
Masayoshi Mihata
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1140476A priority Critical patent/JPH034546A/ja
Publication of JPH034546A publication Critical patent/JPH034546A/ja
Publication of JPH0558660B2 publication Critical patent/JPH0558660B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83859—Localised curing of parts of the layer connector

Landscapes

  • Electronic Switches (AREA)
  • Wire Bonding (AREA)
JP1140476A 1989-06-01 1989-06-01 半導体実装装置 Granted JPH034546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1140476A JPH034546A (ja) 1989-06-01 1989-06-01 半導体実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1140476A JPH034546A (ja) 1989-06-01 1989-06-01 半導体実装装置

Publications (2)

Publication Number Publication Date
JPH034546A JPH034546A (ja) 1991-01-10
JPH0558660B2 true JPH0558660B2 (enrdf_load_html_response) 1993-08-27

Family

ID=15269495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1140476A Granted JPH034546A (ja) 1989-06-01 1989-06-01 半導体実装装置

Country Status (1)

Country Link
JP (1) JPH034546A (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2547895B2 (ja) * 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
JP2662131B2 (ja) * 1991-12-26 1997-10-08 松下電器産業株式会社 ボンディング装置
AU5565699A (en) * 1998-08-21 2000-03-14 Eveready Battery Company Inc. Battery having printed label
JP3603890B2 (ja) 2002-03-06 2004-12-22 セイコーエプソン株式会社 電子デバイス及びその製造方法並びに電子機器
JP4902229B2 (ja) * 2006-03-07 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
JP2010178667A (ja) * 2009-02-05 2010-08-19 Nissin Frozen Foods Co Ltd 凍結調味液パック並びに凍結調味液パックを含む冷凍麺及びその製造方法

Also Published As

Publication number Publication date
JPH034546A (ja) 1991-01-10

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