JP7661892B2 - はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法 - Google Patents

はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法 Download PDF

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Publication number
JP7661892B2
JP7661892B2 JP2021567304A JP2021567304A JP7661892B2 JP 7661892 B2 JP7661892 B2 JP 7661892B2 JP 2021567304 A JP2021567304 A JP 2021567304A JP 2021567304 A JP2021567304 A JP 2021567304A JP 7661892 B2 JP7661892 B2 JP 7661892B2
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JP
Japan
Prior art keywords
solder
solder particles
substrate
particles
bumps
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021567304A
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English (en)
Japanese (ja)
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JPWO2021131905A1 (https=
Inventor
邦彦 赤井
勝将 宮地
純一 欠畑
芳則 江尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021131905A1 publication Critical patent/JPWO2021131905A1/ja
Priority to JP2025060971A priority Critical patent/JP2025092692A/ja
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Publication of JP7661892B2 publication Critical patent/JP7661892B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2021567304A 2019-12-27 2020-12-15 はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法 Active JP7661892B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025060971A JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238418 2019-12-27
JP2019238418 2019-12-27
PCT/JP2020/046763 WO2021131905A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Related Child Applications (1)

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JP2025060971A Division JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

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JPWO2021131905A1 JPWO2021131905A1 (https=) 2021-07-01
JP7661892B2 true JP7661892B2 (ja) 2025-04-15

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JP2025060971A Pending JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

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Country Status (6)

Country Link
US (2) US12246398B2 (https=)
EP (1) EP4084051A4 (https=)
JP (2) JP7661892B2 (https=)
KR (2) KR20260037110A (https=)
CN (1) CN115053330A (https=)
WO (1) WO2021131905A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025092692A (ja) * 2019-12-27 2025-06-19 株式会社レゾナック はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

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Publication number Priority date Publication date Assignee Title
JP7765730B2 (ja) * 2021-12-08 2025-11-07 富士電機株式会社 シート状はんだ
JP2023111125A (ja) * 2022-01-31 2023-08-10 株式会社レゾナック はんだバンプ付き電極基板の製造方法
JP7819555B2 (ja) * 2022-03-29 2026-02-25 株式会社レゾナック はんだバンプ形成用部材
CN119384768A (zh) 2022-09-26 2025-01-28 株式会社 Lg新能源 电池单体和制造该电池单体的接合装置

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* Cited by examiner, † Cited by third party
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JP2025092692A (ja) * 2019-12-27 2025-06-19 株式会社レゾナック はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Also Published As

Publication number Publication date
CN115053330A (zh) 2022-09-13
EP4084051A4 (en) 2023-08-02
JPWO2021131905A1 (https=) 2021-07-01
US20230042727A1 (en) 2023-02-09
US12246398B2 (en) 2025-03-11
KR20220121832A (ko) 2022-09-01
WO2021131905A1 (ja) 2021-07-01
KR102924379B1 (ko) 2026-02-05
KR20260037110A (ko) 2026-03-17
JP2025092692A (ja) 2025-06-19
US20250205799A1 (en) 2025-06-26
EP4084051A1 (en) 2022-11-02

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