JPWO2021131905A1 - - Google Patents

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Publication number
JPWO2021131905A1
JPWO2021131905A1 JP2021567304A JP2021567304A JPWO2021131905A1 JP WO2021131905 A1 JPWO2021131905 A1 JP WO2021131905A1 JP 2021567304 A JP2021567304 A JP 2021567304A JP 2021567304 A JP2021567304 A JP 2021567304A JP WO2021131905 A1 JPWO2021131905 A1 JP WO2021131905A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567304A
Other languages
Japanese (ja)
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JP7661892B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131905A1 publication Critical patent/JPWO2021131905A1/ja
Priority to JP2025060971A priority Critical patent/JP2025092692A/ja
Application granted granted Critical
Publication of JP7661892B2 publication Critical patent/JP7661892B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2021567304A 2019-12-27 2020-12-15 はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法 Active JP7661892B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025060971A JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238418 2019-12-27
JP2019238418 2019-12-27
PCT/JP2020/046763 WO2021131905A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025060971A Division JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021131905A1 true JPWO2021131905A1 (https=) 2021-07-01
JP7661892B2 JP7661892B2 (ja) 2025-04-15

Family

ID=76576072

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021567304A Active JP7661892B2 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法
JP2025060971A Pending JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025060971A Pending JP2025092692A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Country Status (6)

Country Link
US (2) US12246398B2 (https=)
EP (1) EP4084051A4 (https=)
JP (2) JP7661892B2 (https=)
KR (2) KR102924379B1 (https=)
CN (1) CN115053330A (https=)
WO (1) WO2021131905A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7661892B2 (ja) * 2019-12-27 2025-04-15 株式会社レゾナック はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法
JP7765730B2 (ja) * 2021-12-08 2025-11-07 富士電機株式会社 シート状はんだ
JP2023111125A (ja) * 2022-01-31 2023-08-10 株式会社レゾナック はんだバンプ付き電極基板の製造方法
JP7819555B2 (ja) * 2022-03-29 2026-02-25 株式会社レゾナック はんだバンプ形成用部材
US20250357548A1 (en) 2022-09-26 2025-11-20 Lg Energy Solution, Ltd. Battery Cell and Joining Device for Manufacturing the Same

Citations (7)

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JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JPH05235061A (ja) * 1991-08-28 1993-09-10 Hitachi Ltd 電子回路接合装置と方法およびハンダボ−ルと位置合わせマ−ク
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JPH1079404A (ja) * 1996-09-03 1998-03-24 Ngk Spark Plug Co Ltd 半田バンプを有する配線基板及びその製造方法
JP2005175336A (ja) * 2003-12-15 2005-06-30 Toray Eng Co Ltd 半田バンプの形成方法及びその装置
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
JP2016131242A (ja) * 2015-01-13 2016-07-21 デクセリアルズ株式会社 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体

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US6025258A (en) * 1994-01-20 2000-02-15 Fujitsu Limited Method for fabricating solder bumps by forming solder balls with a solder ball forming member
US5643831A (en) * 1994-01-20 1997-07-01 Fujitsu Limited Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
TW250620B (en) 1994-05-31 1995-07-01 At & T Corp Method for interconnecting an electronic device using a transferable soldercarrying medium
KR100192766B1 (ko) * 1995-07-05 1999-06-15 황인길 솔더볼을 입출력 단자로 사용하는 볼그리드 어레이 반도체 패키지의 솔더볼 평탄화 방법 및 그 기판구조
JP2798011B2 (ja) * 1995-07-10 1998-09-17 日本電気株式会社 半田ボール
JPH1013007A (ja) * 1996-03-29 1998-01-16 Ngk Spark Plug Co Ltd 半田バンプを有する配線基板及びその製造方法及び平坦化治具
US6656750B1 (en) * 1999-04-29 2003-12-02 International Business Machines Corporation Method for testing chips on flat solder bumps
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JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
JPWO2006043377A1 (ja) 2004-10-19 2008-05-22 千住金属工業株式会社 はんだバンプ形成用シートとその製造方法
JP4729963B2 (ja) * 2005-04-15 2011-07-20 パナソニック株式会社 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法
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TWI462676B (zh) 2009-02-13 2014-11-21 千住金屬工業股份有限公司 The solder bumps for the circuit substrate are formed using the transfer sheet
TWI612591B (zh) * 2011-10-26 2018-01-21 日立化成股份有限公司 迴焊薄膜、焊料凸塊形成方法、焊料接合的形成方法及半導體裝置
JP5889160B2 (ja) * 2012-10-17 2016-03-22 三菱電機株式会社 電子機器の製造方法
JP6009350B2 (ja) * 2012-12-28 2016-10-19 花王株式会社 電子部品が接合した回路基板の製造方法
GB2523983A (en) * 2013-12-17 2015-09-16 Conpart As Bonded assemblies with pre-deposited polymer balls on demarcated areas and methods of forming such bonded assemblies
CN104465424A (zh) * 2014-12-12 2015-03-25 南通富士通微电子股份有限公司 一种金属凸点制作方法
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
KR102745675B1 (ko) 2017-12-22 2024-12-23 세키스이가가쿠 고교가부시키가이샤 땜납 입자, 도전 재료, 땜납 입자의 보관 방법, 도전 재료의 보관 방법, 도전 재료의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
KR20250046348A (ko) * 2018-06-26 2025-04-02 가부시끼가이샤 레조낙 땜납 입자 및 땜납 입자의 제조 방법
JPWO2020004512A1 (ja) * 2018-06-26 2021-08-02 昭和電工マテリアルズ株式会社 はんだペースト
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CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
JP7661892B2 (ja) * 2019-12-27 2025-04-15 株式会社レゾナック はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JPH05235061A (ja) * 1991-08-28 1993-09-10 Hitachi Ltd 電子回路接合装置と方法およびハンダボ−ルと位置合わせマ−ク
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JPH1079404A (ja) * 1996-09-03 1998-03-24 Ngk Spark Plug Co Ltd 半田バンプを有する配線基板及びその製造方法
JP2005175336A (ja) * 2003-12-15 2005-06-30 Toray Eng Co Ltd 半田バンプの形成方法及びその装置
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
JP2016131242A (ja) * 2015-01-13 2016-07-21 デクセリアルズ株式会社 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体

Also Published As

Publication number Publication date
JP2025092692A (ja) 2025-06-19
CN115053330A (zh) 2022-09-13
KR20260037110A (ko) 2026-03-17
EP4084051A4 (en) 2023-08-02
EP4084051A1 (en) 2022-11-02
WO2021131905A1 (ja) 2021-07-01
JP7661892B2 (ja) 2025-04-15
US20230042727A1 (en) 2023-02-09
US20250205799A1 (en) 2025-06-26
KR102924379B1 (ko) 2026-02-05
KR20220121832A (ko) 2022-09-01
US12246398B2 (en) 2025-03-11

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