JP7354464B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP7354464B2
JP7354464B2 JP2022557331A JP2022557331A JP7354464B2 JP 7354464 B2 JP7354464 B2 JP 7354464B2 JP 2022557331 A JP2022557331 A JP 2022557331A JP 2022557331 A JP2022557331 A JP 2022557331A JP 7354464 B2 JP7354464 B2 JP 7354464B2
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conductive
semiconductor
semiconductor elements
input terminal
conductive member
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Japanese (ja)
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JPWO2022080122A1 (https=
Inventor
健二 林
昂平 谷川
諒介 福田
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Rohm Co Ltd
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Rohm Co Ltd
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Publication of JPWO2022080122A1 publication Critical patent/JPWO2022080122A1/ja
Priority to JP2023127195A priority Critical patent/JP7354475B1/ja
Priority to JP2023152332A priority patent/JP7382534B1/ja
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Publication of JP7354464B2 publication Critical patent/JP7354464B2/ja
Priority to JP2023189566A priority patent/JP7645340B2/ja
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    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
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  • Inverter Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2022557331A 2020-10-14 2021-09-27 半導体モジュール Active JP7354464B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023127195A JP7354475B1 (ja) 2020-10-14 2023-08-03 半導体モジュール
JP2023152332A JP7382534B1 (ja) 2020-10-14 2023-09-20 半導体モジュール
JP2023189566A JP7645340B2 (ja) 2020-10-14 2023-11-06 半導体モジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020173339 2020-10-14
JP2020173339 2020-10-14
PCT/JP2021/035261 WO2022080122A1 (ja) 2020-10-14 2021-09-27 半導体モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023127195A Division JP7354475B1 (ja) 2020-10-14 2023-08-03 半導体モジュール

Publications (2)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185834A (ja) 2014-03-26 2015-10-22 株式会社デンソー 半導体装置
JP2020072106A (ja) 2018-10-29 2020-05-07 ローム株式会社 半導体装置

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927563A (ja) 1982-08-07 1984-02-14 Mitsubishi Electric Corp 半導体装置
JPH0540903A (ja) * 1991-08-07 1993-02-19 Canon Inc 磁界発生装置
JP2993278B2 (ja) 1992-06-26 1999-12-20 富士電機株式会社 半導体装置
US5408141A (en) 1993-01-04 1995-04-18 Texas Instruments Incorporated Sensed current driving device
US5544412A (en) 1994-05-24 1996-08-13 Motorola, Inc. Method for coupling a power lead to a bond pad in an electronic module
US5532512A (en) 1994-10-03 1996-07-02 General Electric Company Direct stacked and flip chip power semiconductor device structures
JPH09148523A (ja) 1995-11-21 1997-06-06 Toshiba Corp 半導体装置
JPH104167A (ja) 1996-06-18 1998-01-06 Toshiba Corp 半導体装置
JP3491481B2 (ja) 1996-08-20 2004-01-26 株式会社日立製作所 半導体装置とその製造方法
TW408453B (en) 1997-12-08 2000-10-11 Toshiba Kk Package for semiconductor power device and method for assembling the same
JP3547333B2 (ja) 1999-02-22 2004-07-28 株式会社日立産機システム 電力変換装置
JP4220094B2 (ja) 1999-04-05 2009-02-04 三菱電機株式会社 パワー半導体モジュール
JP3630070B2 (ja) 2000-03-30 2005-03-16 株式会社デンソー 半導体チップおよび半導体装置
US6703703B2 (en) 2000-01-12 2004-03-09 International Rectifier Corporation Low cost power semiconductor module without substrate
JP4465906B2 (ja) * 2001-04-18 2010-05-26 株式会社日立製作所 パワー半導体モジュール
JP4177571B2 (ja) 2001-09-20 2008-11-05 三菱電機株式会社 半導体装置
DE10231091A1 (de) 2002-07-10 2004-01-22 Robert Bosch Gmbh Aktivgleichrichter-Modul für Drehstromgeneratoren von Fahrzeugen
JP2004107728A (ja) 2002-09-18 2004-04-08 Ebara Corp 接合材料及び接合方法
US6992283B2 (en) 2003-06-06 2006-01-31 Micromass Uk Limited Mass spectrometer
JP2005136264A (ja) 2003-10-31 2005-05-26 Mitsubishi Electric Corp 電力用半導体装置及び電力用半導体モジュール
JP4004460B2 (ja) 2003-12-16 2007-11-07 三菱電機株式会社 半導体装置
JP4196001B2 (ja) 2004-02-17 2008-12-17 パナソニック株式会社 半導体パワーモジュール
JP2006108247A (ja) 2004-10-01 2006-04-20 Ryosan Co Ltd 液冷ヒートシンク
JP2006190972A (ja) 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
US7262444B2 (en) 2005-08-17 2007-08-28 General Electric Company Power semiconductor packaging method and structure
JP4429251B2 (ja) 2005-10-17 2010-03-10 三菱電機株式会社 電力変換装置
JP4450230B2 (ja) 2005-12-26 2010-04-14 株式会社デンソー 半導体装置
US8680666B2 (en) 2006-05-24 2014-03-25 International Rectifier Corporation Bond wireless power module with double-sided single device cooling and immersion bath cooling
CN101819965B (zh) 2006-06-09 2013-01-16 本田技研工业株式会社 半导体装置
JP5076440B2 (ja) 2006-10-16 2012-11-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP5252819B2 (ja) 2007-03-26 2013-07-31 三菱電機株式会社 半導体装置およびその製造方法
US7759777B2 (en) 2007-04-16 2010-07-20 Infineon Technologies Ag Semiconductor module
JP4250191B2 (ja) * 2007-11-05 2009-04-08 株式会社ルネサステクノロジ Ｄｃ／ｄｃコンバータ用半導体装置
JP4924411B2 (ja) 2007-12-27 2012-04-25 三菱電機株式会社 電力半導体装置
EP2340560B1 (en) 2008-01-25 2013-07-10 Letrika Lab d.o.o. Power switching module
JP4683059B2 (ja) * 2008-02-21 2011-05-11 富士電機システムズ株式会社 樹脂封止型半導体装置の設置方法
JP2009200416A (ja) 2008-02-25 2009-09-03 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP4576448B2 (ja) 2008-07-18 2010-11-10 三菱電機株式会社 電力用半導体装置
JP4988665B2 (ja) * 2008-08-06 2012-08-01 日立オートモティブシステムズ株式会社 半導体装置および半導体装置を用いた電力変換装置
JP4634498B2 (ja) * 2008-11-28 2011-02-16 三菱電機株式会社 電力用半導体モジュール
JP4766162B2 (ja) 2009-08-06 2011-09-07 オムロン株式会社 パワーモジュール
JP2011086889A (ja) 2009-10-19 2011-04-28 Renesas Electronics Corp 半導体装置およびその製造方法
CN102802846B (zh) 2010-03-15 2017-05-24 同和电子科技有限公司 接合材料及使用其的接合方法
JP5319601B2 (ja) 2010-05-10 2013-10-16 株式会社東芝 半導体装置及び電力用半導体装置
JP5253455B2 (ja) 2010-06-01 2013-07-31 三菱電機株式会社 パワー半導体装置
JP5858914B2 (ja) 2010-08-04 2016-02-10 ローム株式会社 パワーモジュールおよび出力回路
JP5601376B2 (ja) 2010-12-01 2014-10-08 株式会社安川電機 電力変換装置
JP5464159B2 (ja) 2011-03-08 2014-04-09 三菱電機株式会社 パワーモジュール
JP5287919B2 (ja) 2011-04-01 2013-09-11 トヨタ自動車株式会社 ヒートシンク、およびヒートシンク付き電子部品
CN102201396A (zh) * 2011-05-31 2011-09-28 常州瑞华电力电子器件有限公司 一种大规格igbt模块及其封装方法
JP5602095B2 (ja) 2011-06-09 2014-10-08 三菱電機株式会社 半導体装置
JP5642022B2 (ja) 2011-06-17 2014-12-17 カルソニックカンセイ株式会社 半導体装置および半導体装置の製造方法
JP2013183023A (ja) 2012-03-01 2013-09-12 Toyota Industries Corp 電力変換装置
JP2013258387A (ja) * 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
JP5924164B2 (ja) 2012-07-06 2016-05-25 株式会社豊田自動織機 半導体装置
DE112013003161T5 (de) 2012-07-19 2015-03-12 Mitsubishi Electric Corporation Leistungs-Halbleitermodul
WO2014046058A1 (ja) 2012-09-20 2014-03-27 ローム株式会社 パワーモジュール半導体装置およびインバータ装置、およびパワーモジュール半導体装置の製造方法、および金型
JP2012248907A (ja) 2012-09-21 2012-12-13 Mitsubishi Electric Corp 電力半導体装置
JP6075380B2 (ja) * 2012-10-15 2017-02-08 富士電機株式会社 半導体装置
JP6016611B2 (ja) 2012-12-20 2016-10-26 三菱電機株式会社 半導体モジュール、その製造方法およびその接続方法
JP6195767B2 (ja) * 2013-09-09 2017-09-13 新電元工業株式会社 半導体装置の端子案内部材、半導体装置及び半導体装置の製造方法
CN105794094B (zh) 2013-12-04 2018-09-28 三菱电机株式会社 半导体装置
JP2014135527A (ja) 2014-04-30 2014-07-24 Rohm Co Ltd 半導体パワーモジュールおよびその製造方法
JP6300633B2 (ja) * 2014-05-20 2018-03-28 三菱電機株式会社 パワーモジュール
JP2016039202A (ja) 2014-08-06 2016-03-22 スズキ株式会社 インバータ装置
WO2016152258A1 (ja) 2015-03-23 2016-09-29 株式会社日立製作所 半導体装置
US11011443B2 (en) * 2016-01-05 2021-05-18 Hitachi Automotive Systems, Ltd. Power semiconductor device including a spacer
JP6920790B2 (ja) 2016-05-24 2021-08-18 ローム株式会社 インテリジェントパワーモジュール、電気自動車またはハイブリッドカー、およびインテリジェントパワーモジュールの組み立て方法
JP6584679B2 (ja) 2016-09-07 2019-10-02 三菱電機株式会社 電力用半導体装置
JP6834462B2 (ja) 2016-12-22 2021-02-24 住友金属鉱山株式会社 放熱基板
EP3613077B1 (en) 2017-05-02 2020-10-07 ABB Power Grids Switzerland AG Half-bridge module with coaxial arrangement of the dc terminals
US10074590B1 (en) 2017-07-02 2018-09-11 Infineon Technologies Ag Molded package with chip carrier comprising brazed electrically conductive layers
JP6717270B2 (ja) 2017-07-27 2020-07-01 株式会社デンソー 半導体モジュール
DE212018000087U1 (de) * 2017-11-20 2019-05-10 Rohm Co., Ltd. Halbleitervorrichtung
JP6836201B2 (ja) * 2017-12-19 2021-02-24 株式会社デンソー 電力変換装置
JPWO2019187700A1 (ja) * 2018-03-26 2021-02-12 パナソニックＩｐマネジメント株式会社 半導体モジュール
WO2019235146A1 (ja) * 2018-06-08 2019-12-12 ローム株式会社 半導体モジュール
WO2020044668A1 (ja) * 2018-08-31 2020-03-05 ローム株式会社 半導体装置
WO2020072106A1 (en) * 2018-10-01 2020-04-09 John Mezzalingua Associates, Llc D/B/A Jma Wireless Turbo decoder with reduced processing and minimal re-transmission
CN118213346A (zh) 2018-10-24 2024-06-18 罗姆股份有限公司 半导体装置
CN113169144B (zh) 2018-12-03 2023-11-10 罗姆股份有限公司 半导体装置
JP2020092108A (ja) 2018-12-03 2020-06-11 ローム株式会社 半導体装置
CN116034473A (zh) 2020-10-14 2023-04-28 罗姆股份有限公司 半导体模块

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185834A (ja) 2014-03-26 2015-10-22 株式会社デンソー 半導体装置
JP2020072106A (ja) 2018-10-29 2020-05-07 ローム株式会社 半導体装置

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