JPWO2024057847A1 - - Google Patents
Info
- Publication number
- JPWO2024057847A1 JPWO2024057847A1 JP2024546805A JP2024546805A JPWO2024057847A1 JP WO2024057847 A1 JPWO2024057847 A1 JP WO2024057847A1 JP 2024546805 A JP2024546805 A JP 2024546805A JP 2024546805 A JP2024546805 A JP 2024546805A JP WO2024057847 A1 JPWO2024057847 A1 JP WO2024057847A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022146999 | 2022-09-15 | ||
| PCT/JP2023/030264 WO2024057847A1 (ja) | 2022-09-15 | 2023-08-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024057847A1 true JPWO2024057847A1 (https=) | 2024-03-21 |
| JPWO2024057847A5 JPWO2024057847A5 (https=) | 2025-05-27 |
Family
ID=90274951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024546805A Pending JPWO2024057847A1 (https=) | 2022-09-15 | 2023-08-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024057847A1 (https=) |
| WO (1) | WO2024057847A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009293986A (ja) * | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
| US12062634B2 (en) * | 2019-06-20 | 2024-08-13 | Rohm Co., Ltd. | Semiconductor device and production method for semiconductor device |
| US20230307411A1 (en) * | 2020-10-14 | 2023-09-28 | Rohm Co., Ltd. | Semiconductor module |
-
2023
- 2023-08-23 JP JP2024546805A patent/JPWO2024057847A1/ja active Pending
- 2023-08-23 WO PCT/JP2023/030264 patent/WO2024057847A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024057847A1 (ja) | 2024-03-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250220 |