JPWO2024029274A1 - - Google Patents
Info
- Publication number
- JPWO2024029274A1 JPWO2024029274A1 JP2024538883A JP2024538883A JPWO2024029274A1 JP WO2024029274 A1 JPWO2024029274 A1 JP WO2024029274A1 JP 2024538883 A JP2024538883 A JP 2024538883A JP 2024538883 A JP2024538883 A JP 2024538883A JP WO2024029274 A1 JPWO2024029274 A1 JP WO2024029274A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022125360 | 2022-08-05 | ||
| PCT/JP2023/025299 WO2024029274A1 (ja) | 2022-08-05 | 2023-07-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029274A1 true JPWO2024029274A1 (https=) | 2024-02-08 |
| JPWO2024029274A5 JPWO2024029274A5 (https=) | 2025-04-14 |
Family
ID=89849226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538883A Pending JPWO2024029274A1 (https=) | 2022-08-05 | 2023-07-07 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024029274A1 (https=) |
| WO (1) | WO2024029274A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026042534A1 (ja) * | 2024-08-20 | 2026-02-26 | ローム株式会社 | 半導体モジュール |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016100442A (ja) * | 2014-11-20 | 2016-05-30 | 日産自動車株式会社 | 半導体モジュール及び半導体装置 |
| EP3246945B1 (en) * | 2016-05-19 | 2018-10-03 | ABB Schweiz AG | Power module with low stray inductance |
| CN114846600A (zh) * | 2019-12-28 | 2022-08-02 | 丹佛斯硅动力有限责任公司 | 具有改进的电气特性和热特性的功率模块 |
| JP7428019B2 (ja) * | 2020-03-06 | 2024-02-06 | 富士電機株式会社 | 半導体モジュール |
| WO2022080122A1 (ja) * | 2020-10-14 | 2022-04-21 | ローム株式会社 | 半導体モジュール |
-
2023
- 2023-07-07 JP JP2024538883A patent/JPWO2024029274A1/ja active Pending
- 2023-07-07 WO PCT/JP2023/025299 patent/WO2024029274A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024029274A1 (ja) | 2024-02-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250116 |