JP7247046B2 - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法 Download PDF

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Publication number
JP7247046B2
JP7247046B2 JP2019139013A JP2019139013A JP7247046B2 JP 7247046 B2 JP7247046 B2 JP 7247046B2 JP 2019139013 A JP2019139013 A JP 2019139013A JP 2019139013 A JP2019139013 A JP 2019139013A JP 7247046 B2 JP7247046 B2 JP 7247046B2
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JP
Japan
Prior art keywords
layer
insulating layer
wiring
wiring board
opening
Prior art date
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Active
Application number
JP2019139013A
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English (en)
Japanese (ja)
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JP2021022674A (ja
JP2021022674A5 (https=
Inventor
康之 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2019139013A priority Critical patent/JP7247046B2/ja
Priority to US16/937,999 priority patent/US11019725B2/en
Publication of JP2021022674A publication Critical patent/JP2021022674A/ja
Publication of JP2021022674A5 publication Critical patent/JP2021022674A5/ja
Application granted granted Critical
Publication of JP7247046B2 publication Critical patent/JP7247046B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2019139013A 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法 Active JP7247046B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019139013A JP7247046B2 (ja) 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法
US16/937,999 US11019725B2 (en) 2019-07-29 2020-07-24 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019139013A JP7247046B2 (ja) 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2021022674A JP2021022674A (ja) 2021-02-18
JP2021022674A5 JP2021022674A5 (https=) 2022-03-25
JP7247046B2 true JP7247046B2 (ja) 2023-03-28

Family

ID=74258369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019139013A Active JP7247046B2 (ja) 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US11019725B2 (https=)
JP (1) JP7247046B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102393573B1 (ko) * 2020-07-06 2022-05-03 (주)와이솔 표면 탄성파 웨이퍼 레벨 패키지 및 그 제작 방법
US20220069489A1 (en) * 2020-08-28 2022-03-03 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
CN115348725A (zh) * 2021-05-13 2022-11-15 欣兴电子股份有限公司 电路板结构及其制作方法
CN115604916A (zh) * 2021-07-09 2023-01-13 欣兴电子股份有限公司（Tw） 电路板结构及其制作方法
KR20230049373A (ko) * 2021-10-06 2023-04-13 삼성전기주식회사 회로기판
FR3165545A1 (fr) * 2024-08-06 2026-02-13 Safran Electronics & Defense Circuit imprimé comprenant un composant enfoui et une couche de découplage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090057928A1 (en) 2007-09-04 2009-03-05 Jun Zhai Semiconductor Chip with Stratified Underfill
US20120228012A1 (en) 2011-03-08 2012-09-13 Ibiden Co., Ltd. Circuit board and method for manufacturing circuit board
JP2016207958A (ja) 2015-04-28 2016-12-08 新光電気工業株式会社 配線基板及び配線基板の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006043388A1 (ja) * 2004-10-21 2008-05-22 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
KR100716815B1 (ko) * 2005-02-28 2007-05-09 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조방법
KR100656751B1 (ko) * 2005-12-13 2006-12-13 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
US7682879B2 (en) * 2006-03-28 2010-03-23 Seagate Technology Llc Edge coating a microelectronic device
US7656042B2 (en) * 2006-03-29 2010-02-02 Taiwan Semiconductor Manufacturing Co., Ltd. Stratified underfill in an IC package
US8618669B2 (en) * 2008-01-09 2013-12-31 Ibiden Co., Ltd. Combination substrate
US8745860B2 (en) * 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
JP2016035987A (ja) * 2014-08-04 2016-03-17 イビデン株式会社 電子部品内蔵配線板及びその製造方法
JP2016096170A (ja) * 2014-11-12 2016-05-26 イビデン株式会社 電子部品内蔵配線板及び電子部品内蔵配線板の製造方法
KR20170037331A (ko) * 2015-09-25 2017-04-04 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090057928A1 (en) 2007-09-04 2009-03-05 Jun Zhai Semiconductor Chip with Stratified Underfill
US20120228012A1 (en) 2011-03-08 2012-09-13 Ibiden Co., Ltd. Circuit board and method for manufacturing circuit board
JP2016207958A (ja) 2015-04-28 2016-12-08 新光電気工業株式会社 配線基板及び配線基板の製造方法

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Publication number Publication date
JP2021022674A (ja) 2021-02-18
US20210037652A1 (en) 2021-02-04
US11019725B2 (en) 2021-05-25

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