JP2021022674A5 - - Google Patents

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Publication number
JP2021022674A5
JP2021022674A5 JP2019139013A JP2019139013A JP2021022674A5 JP 2021022674 A5 JP2021022674 A5 JP 2021022674A5 JP 2019139013 A JP2019139013 A JP 2019139013A JP 2019139013 A JP2019139013 A JP 2019139013A JP 2021022674 A5 JP2021022674 A5 JP 2021022674A5
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JP
Japan
Prior art keywords
insulating layer
layer
electronic component
adhesive layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019139013A
Other languages
English (en)
Japanese (ja)
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JP2021022674A (ja
JP7247046B2 (ja
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Priority to JP2019139013A priority Critical patent/JP7247046B2/ja
Priority claimed from JP2019139013A external-priority patent/JP7247046B2/ja
Priority to US16/937,999 priority patent/US11019725B2/en
Publication of JP2021022674A publication Critical patent/JP2021022674A/ja
Publication of JP2021022674A5 publication Critical patent/JP2021022674A5/ja
Application granted granted Critical
Publication of JP7247046B2 publication Critical patent/JP7247046B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019139013A 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法 Active JP7247046B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019139013A JP7247046B2 (ja) 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法
US16/937,999 US11019725B2 (en) 2019-07-29 2020-07-24 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019139013A JP7247046B2 (ja) 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2021022674A JP2021022674A (ja) 2021-02-18
JP2021022674A5 true JP2021022674A5 (https=) 2022-03-25
JP7247046B2 JP7247046B2 (ja) 2023-03-28

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ID=74258369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019139013A Active JP7247046B2 (ja) 2019-07-29 2019-07-29 配線基板及び配線基板の製造方法

Country Status (2)

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US (1) US11019725B2 (https=)
JP (1) JP7247046B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102393573B1 (ko) * 2020-07-06 2022-05-03 (주)와이솔 표면 탄성파 웨이퍼 레벨 패키지 및 그 제작 방법
US20220069489A1 (en) * 2020-08-28 2022-03-03 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
CN115348725A (zh) * 2021-05-13 2022-11-15 欣兴电子股份有限公司 电路板结构及其制作方法
CN115604916A (zh) * 2021-07-09 2023-01-13 欣兴电子股份有限公司（Tw） 电路板结构及其制作方法
KR20230049373A (ko) * 2021-10-06 2023-04-13 삼성전기주식회사 회로기판
FR3165545A1 (fr) * 2024-08-06 2026-02-13 Safran Electronics & Defense Circuit imprimé comprenant un composant enfoui et une couche de découplage

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006043388A1 (ja) * 2004-10-21 2008-05-22 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
KR100716815B1 (ko) * 2005-02-28 2007-05-09 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조방법
KR100656751B1 (ko) * 2005-12-13 2006-12-13 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
US7682879B2 (en) * 2006-03-28 2010-03-23 Seagate Technology Llc Edge coating a microelectronic device
US7656042B2 (en) * 2006-03-29 2010-02-02 Taiwan Semiconductor Manufacturing Co., Ltd. Stratified underfill in an IC package
US7745264B2 (en) 2007-09-04 2010-06-29 Advanced Micro Devices, Inc. Semiconductor chip with stratified underfill
US8618669B2 (en) * 2008-01-09 2013-12-31 Ibiden Co., Ltd. Combination substrate
US8923008B2 (en) 2011-03-08 2014-12-30 Ibiden Co., Ltd. Circuit board and method for manufacturing circuit board
US8745860B2 (en) * 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
JP2016035987A (ja) * 2014-08-04 2016-03-17 イビデン株式会社 電子部品内蔵配線板及びその製造方法
JP2016096170A (ja) * 2014-11-12 2016-05-26 イビデン株式会社 電子部品内蔵配線板及び電子部品内蔵配線板の製造方法
JP6752553B2 (ja) * 2015-04-28 2020-09-09 新光電気工業株式会社 配線基板
KR20170037331A (ko) * 2015-09-25 2017-04-04 삼성전기주식회사 인쇄회로기판 및 그 제조방법

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