JP6081875B2 - 配線基板の製造方法 - Google Patents
配線基板の製造方法 Download PDFInfo
- Publication number
- JP6081875B2 JP6081875B2 JP2013135870A JP2013135870A JP6081875B2 JP 6081875 B2 JP6081875 B2 JP 6081875B2 JP 2013135870 A JP2013135870 A JP 2013135870A JP 2013135870 A JP2013135870 A JP 2013135870A JP 6081875 B2 JP6081875 B2 JP 6081875B2
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- strip
- semiconductor element
- solder resist
- resist layer
- wiring conductor
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000004020 conductor Substances 0.000 claims description 89
- 229910000679 solder Inorganic materials 0.000 claims description 70
- 239000004065 semiconductor Substances 0.000 claims description 58
- 229920005989 resin Polymers 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 41
- 239000000945 filler Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000012777 electrically insulating material Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0594—Insulating resist or coating with special shaped edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Description
1a,1b 絶縁層
2 配線導体
3,3a,3b ソルダーレジスト層
6 帯状配線導体
7 半導体素子接続パッド
9 ソルダーレジスト層の開口
S 半導体素子
F 絶縁フィラー
T 半導体素子の電極端子
Claims (3)
- 絶縁層と配線導体層とを交互に積層するとともに、最外層の前記絶縁層上に、半導体素子の電極端子がフリップチップ接続される半導体素子接続パッドを一部に有する複数の帯状配線導体を、互いに隣接する前記帯状配線導体の前記半導体素子接続パッド同士が互いに横に並ばない状態で並設する工程と、前記最外層の絶縁層上および前記帯状配線導体上の全面に、絶縁フィラーを含有するソルダーレジスト用の感光性樹脂ペーストを塗布する工程と、前記感光性樹脂ペースト中の前記絶縁フィラーを前記帯状配線導体の上面よりも下側に沈降させる工程と、前記感光性樹脂層を乾燥させるとともに露光および現像処理を行って、前記半導体素子接続パッドを個別に露出させる開口を、該半導体素子接続パッドに隣接する前記帯状配線導体との間に該開口の開口縁が位置するように有するソルダーレジスト層を形成する工程と、を行うことを特徴とする配線基板の製造方法。
- 前記ソルダーレジスト層が前記開口内の前記絶縁層上を覆うとともに前記開口内に前記半導体素子接続パッドの上面よりも低い位置まで凹んで残るように前記現像処理を行うことを特徴とする請求項1記載の配線基板の製造方法。
- 前記ソルダーレジスト層の前記開口内の断面形状が前記開口縁側と前記半導体素子接続パッド側とに丸みを有して凹むように前記現像処理を行うことを特徴とする請求項2記載の配線基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013135870A JP6081875B2 (ja) | 2013-04-28 | 2013-06-28 | 配線基板の製造方法 |
TW103121148A TWI627877B (zh) | 2013-06-28 | 2014-06-19 | 配線基板及其製造方法 |
CN201410283057.7A CN104254193B (zh) | 2013-06-28 | 2014-06-23 | 布线基板及其制造方法 |
US14/311,451 US9565760B2 (en) | 2013-06-28 | 2014-06-23 | Wiring board and method of manufacturing the same |
KR20140078278A KR20150002506A (ko) | 2013-06-28 | 2014-06-25 | 배선 기판 및 그 제조 방법 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094845 | 2013-04-28 | ||
JP2013094845 | 2013-04-28 | ||
JP2013135870A JP6081875B2 (ja) | 2013-04-28 | 2013-06-28 | 配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014232857A JP2014232857A (ja) | 2014-12-11 |
JP6081875B2 true JP6081875B2 (ja) | 2017-02-15 |
Family
ID=52114499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013135870A Active JP6081875B2 (ja) | 2013-04-28 | 2013-06-28 | 配線基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9565760B2 (ja) |
JP (1) | JP6081875B2 (ja) |
KR (1) | KR20150002506A (ja) |
CN (1) | CN104254193B (ja) |
TW (1) | TWI627877B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10089513B2 (en) * | 2016-05-30 | 2018-10-02 | Kyocera Corporation | Wiring board for fingerprint sensor |
KR20170140530A (ko) | 2016-06-13 | 2017-12-21 | 주식회사 엘지화학 | 전기변색소자 |
KR20210154454A (ko) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
CN112770525A (zh) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | 一种印制电路板的制作方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0414892A (ja) * | 1990-05-08 | 1992-01-20 | Seiko Epson Corp | プリント配線基板のハンダレジスト開口部の構造 |
JPH08139438A (ja) | 1994-11-14 | 1996-05-31 | Sony Corp | はんだコート方法 |
JP3346263B2 (ja) * | 1997-04-11 | 2002-11-18 | イビデン株式会社 | プリント配線板及びその製造方法 |
JP4066522B2 (ja) * | 1998-07-22 | 2008-03-26 | イビデン株式会社 | プリント配線板 |
KR100850243B1 (ko) * | 2007-07-26 | 2008-08-04 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2009117721A (ja) * | 2007-11-08 | 2009-05-28 | Mitsui Mining & Smelting Co Ltd | 配線基板、回路基板、これらの製造方法 |
JP2009212160A (ja) * | 2008-02-29 | 2009-09-17 | Kyocer Slc Technologies Corp | 配線基板およびその製造方法 |
JP5020123B2 (ja) * | 2008-03-03 | 2012-09-05 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP5121574B2 (ja) * | 2008-05-28 | 2013-01-16 | 新光電気工業株式会社 | 配線基板及び半導体パッケージ |
JP5422427B2 (ja) * | 2010-02-08 | 2014-02-19 | 太陽ホールディングス株式会社 | 積層構造体及びそれに用いる感光性ドライフィルム |
JP5427632B2 (ja) * | 2010-02-08 | 2014-02-26 | 太陽ホールディングス株式会社 | 積層構造体及びそれに用いる感光性ドライフィルム |
JP5444050B2 (ja) * | 2010-03-12 | 2014-03-19 | 三菱製紙株式会社 | ソルダーレジストパターンの形成方法 |
CN103109588B (zh) * | 2010-09-28 | 2016-09-07 | 三菱制纸株式会社 | 阻焊图案的形成方法 |
JP5680401B2 (ja) * | 2010-12-22 | 2015-03-04 | 新光電気工業株式会社 | 配線基板及び半導体パッケージ |
-
2013
- 2013-06-28 JP JP2013135870A patent/JP6081875B2/ja active Active
-
2014
- 2014-06-19 TW TW103121148A patent/TWI627877B/zh not_active IP Right Cessation
- 2014-06-23 CN CN201410283057.7A patent/CN104254193B/zh not_active Expired - Fee Related
- 2014-06-23 US US14/311,451 patent/US9565760B2/en not_active Expired - Fee Related
- 2014-06-25 KR KR20140078278A patent/KR20150002506A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CN104254193B (zh) | 2018-06-01 |
JP2014232857A (ja) | 2014-12-11 |
TWI627877B (zh) | 2018-06-21 |
US20150000968A1 (en) | 2015-01-01 |
KR20150002506A (ko) | 2015-01-07 |
US9565760B2 (en) | 2017-02-07 |
CN104254193A (zh) | 2014-12-31 |
TW201513739A (zh) | 2015-04-01 |
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