JP7166858B2 - 半導体プロセスモジュールのためのインサイチュ装置 - Google Patents
半導体プロセスモジュールのためのインサイチュ装置 Download PDFInfo
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Description
本開示の態様は、一般に、半導体プロセスで用いられるような処理チャンバ内でのエッジリングの交換のための装置及び方法に関する。
処理チャンバ(例えば、エッチングチャンバ)では、基板は静電的に定位置にクランプされている間にエッチングされる。典型的には、エッジリングと呼ばれる円形部品が基板の外径のすぐ外側に配置され、静電チャックの上面がエッチャントケミストリによりエッチングされることを防止する。エッジリングは幾つかの異なる材料から作られ、様々な形状を有することができ、両方ともエッジリングの近傍でのプロセスの均一性に影響する。処理中に、エッジリングは経時的にエッチングされ、その結果、形状の変化及び処理の均一性の変化が生じる。
Claims (20)
- エッジリングを支持するためのキャリアであって、
周縁部を有するプレートであって、周縁部は、
複数の湾曲したエッジと、
複数の平行なエッジとを含んでいる、プレートと、
プレートに配置された複数のリセプタクルであって、
複数のリセプタクルの各リセプタクルは軟質ポリマー材料で形成され、
複数のリセプタクルの各々は支持構造と係合するように構成されている、リセプタクルと、
複数の湾曲したエッジに結合された複数の弧状支持構造であって、
各弧状支持構造はプレートの上面の平面の上方に延在し、
複数の弧状支持構造の各弧状支持構造は、
各弧状支持構造の半径方向外側のエッジに形成され、プレートの上面の平面の上方に配置された段差であって、各弧状支持構造の段差は、
プレートの上面に平行な支持面と、
各弧状支持構造の支持面の半径方向内側に位置決めされ、プレートの上面に垂直に向けられた弧状壁であって、各弧状支持構造の支持面に対して垂直に延在する各弧状支持構造の弧状壁とを含んでいる、段差とを備えている、弧状支持構造と、
弧状壁の半径方向内側に位置決めされ、プレート内に延在する雄型延長部とを備えるキャリア。 - 複数の弧状支持構造の各弧状支持構造の弧状壁は、エッジリングの内側半径よりも小さい曲率半径を有している、請求項1に記載のキャリア。
- 複数の弧状支持構造の各弧状支持構造の弧状壁は、エッジリングの内側半径以下である、請求項2に記載のキャリア。
- プレートは半円形プレートである、請求項1に記載のキャリア。
- 複数のリセプタクルの少なくともいくつかは、複数の弧状支持構造の半径方向内側に位置決めされている、請求項1に記載のキャリア。
- 複数のリセプタクルの各リセプタクルは、プレートに形成された開口部に配置された本体を備えている、請求項1に記載のキャリア。
- 複数のリセプタクルの各リセプタクルの本体は、本体の円筒形部分よりも大きい外径を有するフレア部を備えている、請求項6に記載のキャリア。
- 複数のリセプタクルの各リセプタクルの本体は、本体を貫通して形成されたボアをさらに備えている、請求項7に記載のキャリア。
- プレートは、その中に形成された1つ以上の開口部を備えている、請求項1に記載のキャリア。
- 1つ以上の開口部は複数の開口部を含み、
複数のリセプタクルの少なくとも1つは、複数の開口部のうちの2つの間に位置決めされている、請求項9に記載のキャリア。 - エッジリングを支持するためのキャリアであって、
周縁部を有するプレートであって、周縁部は、
複数の湾曲したエッジと、
複数の平行なエッジとを含んでいる、プレートと、
プレートに配置された複数のリセプタクルであって、
複数のリセプタクルの各リセプタクルは軟質ポリマー材料で形成され、
複数のリセプタクルの各々は支持構造と係合するように構成されている、リセプタクルと、
複数の湾曲したエッジに結合された複数の弧状支持構造であって、複数の弧状支持構造の各弧状支持構造は、
各弧状支持構造の半径方向外側のエッジに形成された段差であって、各弧状支持構造の段差は、
支持面と、
各弧状支持構造の支持面の半径方向内側に位置決めされ、各弧状支持構造の支持面に垂直に延在する弧状壁とを含んでいる、段差とを備えている、弧状支持構造とを備えるキャリア。 - 複数の弧状支持構造の各弧状支持構造の弧状壁は、エッジリングの内側半径よりも小さい曲率半径を有している、請求項11に記載のキャリア。
- 複数の弧状支持構造の各弧状支持構造の弧状壁は、前記半径はエッジリングの内側半径以下である、請求項12に記載のキャリア。
- プレートは半円形プレートである、請求項11に記載のキャリア。
- 複数のリセプタクルの各リセプタクルは、プレートに形成された開口部に配置された本体を備え、
複数のリセプタクルの各リセプタクルの本体は、本体の円筒形部分よりも大きい外径を有するフレア部を備えている、請求項11に記載のキャリア。 - 複数のリセプタクルの各リセプタクルの本体は、本体を貫通して形成されたボアをさらに備えている、請求項15に記載のキャリア。
- エッジリングを移送する方法であって、
スリットバルブドアを介してチャンバ内にロボットブレードを挿入する工程であって、ロボットブレードは、その上にキャリアと、キャリア上に支持されたエッジリングとを有しており、キャリアは、
周縁部を有するプレートであって、周縁部は複数の湾曲したエッジと、複数の平行なエッジとを含んでいるプレートと、
プレートに配置された複数のリセプタクルであって、複数のリセプタクルの各リセプタクルは軟質ポリマー材料で形成され、複数のリセプタクルの各々は支持構造と係合するように構成されている、リセプタクルと、
複数の湾曲したエッジに結合された複数の弧状支持構造であって、複数の弧状支持構造の各弧状支持構造は、各弧状支持構造の半径方向外側のエッジに形成された段差であって、各弧状支持構造の段差は、支持面と、各弧状支持構造の支持面の半径方向内側に位置決めされ、各弧状支持構造の支持面に垂直に延在する弧状壁とを含んでいる、段差とを備えている、弧状支持構造とを備える工程と、
キャリア及びその上のエッジリングを基板支持体の上に位置決めする工程と、
基板リフトピンを駆動し、エッジリングをキャリアから持ち上げる工程と、
ロボットブレード及びキャリアをチャンバから引き出す工程とを含む方法。 - エッジリングを下降させ、基板支持体と接触させる工程をさらに含む、請求項17に記載の方法。
- エッジリングを下降させ、基板支持体と接触させる工程は、エッジリングを基板支持体の上面に対して非平行な形態に位置決めし、処理中にプラズマシースの位置を調節する工程を含んでいる、請求項18に記載の方法。
- チャンバ内にロボットブレードを挿入する工程及びロボットブレード及びキャリアをチャンバから引き出す工程の間、キャリアの複数のリセプタクルがロボットブレードと係合し、
複数のリセプタクルの各リセプタクルは軟質ポリマー材料で形成されている、請求項17に記載の方法。
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