JP7134166B2 - 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品およびプリント配線板 - Google Patents

硬化性樹脂組成物、ドライフィルム、硬化物、電子部品およびプリント配線板 Download PDF

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JP7134166B2
JP7134166B2 JP2019510177A JP2019510177A JP7134166B2 JP 7134166 B2 JP7134166 B2 JP 7134166B2 JP 2019510177 A JP2019510177 A JP 2019510177A JP 2019510177 A JP2019510177 A JP 2019510177A JP 7134166 B2 JP7134166 B2 JP 7134166B2
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resin
composition
curable resin
mass
resin composition
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JPWO2018181802A1 (ja
Inventor
夏芽 大川
俊明 増田
振興 張
滋 宇敷
崇夫 三輪
匠 松野
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/02—Cellulose; Modified cellulose
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2019510177A 2017-03-31 2018-03-29 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品およびプリント配線板 Active JP7134166B2 (ja)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP2017073113 2017-03-31
JP2017073115 2017-03-31
JP2017073114 2017-03-31
JP2017073113 2017-03-31
JP2017073116 2017-03-31
JP2017073116 2017-03-31
JP2017073114 2017-03-31
JP2017073115 2017-03-31
JP2017112092 2017-06-06
JP2017112091 2017-06-06
JP2017112091 2017-06-06
JP2017112092 2017-06-06
JP2017222261 2017-11-17
JP2017222261 2017-11-17
PCT/JP2018/013413 WO2018181802A1 (ja) 2017-03-31 2018-03-29 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品およびプリント配線板

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JPWO2018181802A1 JPWO2018181802A1 (ja) 2020-02-13
JP7134166B2 true JP7134166B2 (ja) 2022-09-09

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JP (1) JP7134166B2 (ko)
KR (1) KR102511228B1 (ko)
CN (1) CN110520475B (ko)
TW (1) TWI768021B (ko)
WO (1) WO2018181802A1 (ko)

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JP7169154B2 (ja) * 2018-10-18 2022-11-10 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品
EP3892434A4 (en) * 2018-12-05 2022-08-03 Furukawa Electric Co., Ltd. CELLULOSIC FIBER DISPERSIVE RESIN COMPOSITE, MOLDING AND COMPOSITE
US11680923B2 (en) 2019-03-05 2023-06-20 Abb Schweiz Ag Technologies using surface-modified pseudo-graphite
US11585776B2 (en) 2019-03-05 2023-02-21 Abb Schweiz Ag Chlorine species sensing using pseudo-graphite
US20200284749A1 (en) * 2019-03-05 2020-09-10 Abb Schweiz Ag Technologies Using Pseudo-Graphite Composites
KR20220004960A (ko) 2019-04-25 2022-01-12 도레이 카부시키가이샤 에폭시 수지 조성물, 중간 기재 및 섬유 강화 복합 재료
JP7251449B2 (ja) * 2019-11-08 2023-04-04 Dic株式会社 エポキシ（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物及び物品
CN111393681B (zh) * 2020-04-17 2021-02-19 华南理工大学 一种动态共价交联的木塑复合材料及其制备方法与应用
US20220010915A1 (en) * 2020-07-13 2022-01-13 Nanotech, Inc. Hybrid insulating compound for use in systems requiring high power of thermal insulation
WO2022014688A1 (ja) * 2020-07-15 2022-01-20 株式会社Adeka 添加剤組成物、これを含有する樹脂組成物およびその成形品
JPWO2022045237A1 (ko) * 2020-08-31 2022-03-03
KR102276413B1 (ko) * 2020-12-22 2021-07-12 주식회사 에디스플레이 탄소섬유 복합수지를 포함하는 모바일 표시장치 브라켓용 수지 조성물 및 이를 이용한 모바일용 표시장치
IT202200009200A1 (it) * 2022-05-05 2023-11-05 Giuseppe Vitiello Rivestimento protettivo a base di resina epossidica resistente alla fiamma, fotoluminescente, idrofobico
CN115073793B (zh) * 2022-08-05 2023-07-18 常州富烯科技股份有限公司 一种石墨烯导热膜及其制备方法和导热垫片
CN116867174A (zh) * 2023-07-06 2023-10-10 宁波科浩达电子有限公司 一种pcb印制线路板的制作方法及pcb印制线路板
CN116870595B (zh) * 2023-09-05 2023-11-17 智奇铁路设备有限公司 一种用于喷漆车间的废气净化装置

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JP2012211269A (ja) 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 予備硬化物、粗化予備硬化物及び積層体
US20140080940A1 (en) 2012-09-19 2014-03-20 Samsung Electro-Mechanics Co., Ltd. Resin composition for insulation, insulating film, prepreg, and printed circuit board.
JP2014220345A (ja) 2013-05-07 2014-11-20 太陽ホールディングス株式会社 プリント配線板材料およびそれを用いたプリント配線板
JP2015093887A (ja) 2013-11-08 2015-05-18 アセック株式会社 エポキシ樹脂組成物および硬化物
JP2016021033A (ja) 2014-07-16 2016-02-04 ナミックス株式会社 カメラモジュール用接着剤
JP2016157821A (ja) 2015-02-24 2016-09-01 味の素株式会社 回路基板及びその製造方法
JP2017019970A (ja) 2015-07-14 2017-01-26 味の素株式会社 樹脂組成物
JP2018024878A (ja) 2016-08-09 2018-02-15 太陽ホールディングス株式会社 プリント配線板用硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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KR20120088678A (ko) 2003-07-31 2012-08-08 고쿠리츠 다이가쿠 호진 교토 다이가쿠 섬유 강화 복합 재료, 그 제조 방법 및 그 이용
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TWI662867B (zh) * 2013-04-23 2019-06-11 日商太陽控股股份有限公司 Printed wiring board material and printed wiring board using the same
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012211269A (ja) 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 予備硬化物、粗化予備硬化物及び積層体
US20140080940A1 (en) 2012-09-19 2014-03-20 Samsung Electro-Mechanics Co., Ltd. Resin composition for insulation, insulating film, prepreg, and printed circuit board.
JP2014220345A (ja) 2013-05-07 2014-11-20 太陽ホールディングス株式会社 プリント配線板材料およびそれを用いたプリント配線板
JP2015093887A (ja) 2013-11-08 2015-05-18 アセック株式会社 エポキシ樹脂組成物および硬化物
JP2016021033A (ja) 2014-07-16 2016-02-04 ナミックス株式会社 カメラモジュール用接着剤
JP2016157821A (ja) 2015-02-24 2016-09-01 味の素株式会社 回路基板及びその製造方法
JP2017019970A (ja) 2015-07-14 2017-01-26 味の素株式会社 樹脂組成物
JP2018024878A (ja) 2016-08-09 2018-02-15 太陽ホールディングス株式会社 プリント配線板用硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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Publication number Publication date
KR102511228B1 (ko) 2023-03-17
TWI768021B (zh) 2022-06-21
WO2018181802A1 (ja) 2018-10-04
KR20190127942A (ko) 2019-11-13
TW201903039A (zh) 2019-01-16
JPWO2018181802A1 (ja) 2020-02-13
CN110520475A (zh) 2019-11-29
CN110520475B (zh) 2023-02-28

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