JP7100524B2 - ホイールマウント - Google Patents

ホイールマウント Download PDF

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Publication number
JP7100524B2
JP7100524B2 JP2018145817A JP2018145817A JP7100524B2 JP 7100524 B2 JP7100524 B2 JP 7100524B2 JP 2018145817 A JP2018145817 A JP 2018145817A JP 2018145817 A JP2018145817 A JP 2018145817A JP 7100524 B2 JP7100524 B2 JP 7100524B2
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JP
Japan
Prior art keywords
grinding
wheel
grinding water
mounting surface
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018145817A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020019111A (ja
Inventor
裕樹 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018145817A priority Critical patent/JP7100524B2/ja
Priority to KR1020190087082A priority patent/KR20200015378A/ko
Priority to CN201910648587.XA priority patent/CN110788686B/zh
Priority to TW108127137A priority patent/TWI811412B/zh
Publication of JP2020019111A publication Critical patent/JP2020019111A/ja
Application granted granted Critical
Publication of JP7100524B2 publication Critical patent/JP7100524B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/003—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Toilet Supplies (AREA)
  • Mechanical Operated Clutches (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
JP2018145817A 2018-08-02 2018-08-02 ホイールマウント Active JP7100524B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018145817A JP7100524B2 (ja) 2018-08-02 2018-08-02 ホイールマウント
KR1020190087082A KR20200015378A (ko) 2018-08-02 2019-07-18 휠 마운트
CN201910648587.XA CN110788686B (zh) 2018-08-02 2019-07-18 轮安装座
TW108127137A TWI811412B (zh) 2018-08-02 2019-07-31 輪座

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018145817A JP7100524B2 (ja) 2018-08-02 2018-08-02 ホイールマウント

Publications (2)

Publication Number Publication Date
JP2020019111A JP2020019111A (ja) 2020-02-06
JP7100524B2 true JP7100524B2 (ja) 2022-07-13

Family

ID=69427397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018145817A Active JP7100524B2 (ja) 2018-08-02 2018-08-02 ホイールマウント

Country Status (4)

Country Link
JP (1) JP7100524B2 (zh)
KR (1) KR20200015378A (zh)
CN (1) CN110788686B (zh)
TW (1) TWI811412B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005075324A1 (ja) * 2004-02-06 2005-08-18 Mayekawa Mfg.Co.,Ltd. 伸縮式搬送装置及びこれを備えた食品搬送システム

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3900876B1 (de) * 2020-04-23 2024-05-01 Siltronic AG Verfahren zum schleifen einer halbleiterscheibe

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217143A (ja) 2001-01-18 2002-08-02 Fujitsu Ltd 研磨方法及び研磨装置
JP2004025344A (ja) 2002-06-25 2004-01-29 Mito Kogyo Kk 回転カッタ
JP2009279709A (ja) 2008-05-23 2009-12-03 Asahi-Seiki Mfg Co Ltd コイルばねの両端研削機
JP2011143495A (ja) 2010-01-13 2011-07-28 Disco Abrasive Syst Ltd 研削装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6434651A (en) * 1987-07-29 1989-02-06 Disco Abrasive Systems Ltd Grinding stone device and grinding machine with said device
JPH0326462U (zh) * 1989-07-20 1991-03-18
JPH0516138U (ja) * 1991-08-14 1993-03-02 三菱重工業株式会社 組立式ｃｂｎ砥石
JPH07223152A (ja) 1994-02-10 1995-08-22 Disco Abrasive Syst Ltd 平面研削盤
JP3289183B2 (ja) * 1997-05-30 2002-06-04 株式会社亀井 ダイヤモンドフルバック
JP2000094342A (ja) * 1998-09-25 2000-04-04 Okamoto Machine Tool Works Ltd カップホイ−ル型砥石およびそれを具備した平面研削装置
JP2010052076A (ja) * 2008-08-27 2010-03-11 Disco Abrasive Syst Ltd 研削ホイール
JP5284209B2 (ja) * 2009-07-17 2013-09-11 本田技研工業株式会社 工具ホルダ
JP6117030B2 (ja) * 2013-07-08 2017-04-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 飛散板、研削ホイール、および、研削装置
JP6335592B2 (ja) 2014-04-02 2018-05-30 株式会社ディスコ 研削方法
JP6707278B2 (ja) * 2015-09-04 2020-06-10 株式会社ディスコ 研削ホイール及び被加工物の研削方法
ITUA20164592A1 (it) * 2016-06-22 2017-12-22 Biesse Spa Metodo e sistema per l'adduzione di fluido refrigerante durante la lavorazione di un pezzo mediante una mola a tazza, e mola a tazza in essi utilizzata

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217143A (ja) 2001-01-18 2002-08-02 Fujitsu Ltd 研磨方法及び研磨装置
JP2004025344A (ja) 2002-06-25 2004-01-29 Mito Kogyo Kk 回転カッタ
JP2009279709A (ja) 2008-05-23 2009-12-03 Asahi-Seiki Mfg Co Ltd コイルばねの両端研削機
JP2011143495A (ja) 2010-01-13 2011-07-28 Disco Abrasive Syst Ltd 研削装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005075324A1 (ja) * 2004-02-06 2005-08-18 Mayekawa Mfg.Co.,Ltd. 伸縮式搬送装置及びこれを備えた食品搬送システム

Also Published As

Publication number Publication date
TWI811412B (zh) 2023-08-11
KR20200015378A (ko) 2020-02-12
CN110788686A (zh) 2020-02-14
JP2020019111A (ja) 2020-02-06
TW202007473A (zh) 2020-02-16
CN110788686B (zh) 2023-04-07

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