JP7065124B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP7065124B2 JP7065124B2 JP2019571136A JP2019571136A JP7065124B2 JP 7065124 B2 JP7065124 B2 JP 7065124B2 JP 2019571136 A JP2019571136 A JP 2019571136A JP 2019571136 A JP2019571136 A JP 2019571136A JP 7065124 B2 JP7065124 B2 JP 7065124B2
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- Prior art keywords
- probe
- wiring
- electrode
- sample
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Description
Claims (3)
- 縦方向に延在するスクライブ領域および横方向に延在するスクライブ領域に、半導体素子の電極パッド群を同一方向に形成する工程と、
プローブ列の各プローブを、前記電極パッド群の内のそれぞれが対応する電極パッドに接触させる工程と、
前記半導体素子の電気特性を検査する工程と、を有することを特徴とする半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記半導体素子は、トランジスタであることを特徴とする半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記半導体素子は、インバータであることを特徴とする半導体装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/003987 WO2019155519A1 (ja) | 2018-02-06 | 2018-02-06 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019155519A1 JPWO2019155519A1 (ja) | 2021-01-14 |
JP7065124B2 true JP7065124B2 (ja) | 2022-05-11 |
Family
ID=67548225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019571136A Active JP7065124B2 (ja) | 2018-02-06 | 2018-02-06 | 半導体装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11977099B2 (ja) |
JP (1) | JP7065124B2 (ja) |
KR (1) | KR20200096600A (ja) |
CN (1) | CN111557041B (ja) |
TW (1) | TWI757577B (ja) |
WO (1) | WO2019155519A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021185939A1 (en) * | 2020-03-20 | 2021-09-23 | Asml Netherlands B.V. | Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer |
Citations (5)
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JP2002313864A (ja) | 2001-04-12 | 2002-10-25 | Nec Corp | 半導体装置 |
JP2004226086A (ja) | 2003-01-20 | 2004-08-12 | Yokogawa Electric Corp | コンタクトプローブ |
JP2007121317A (ja) | 2007-02-01 | 2007-05-17 | Sii Nanotechnology Inc | 微小接触式プローバー |
JP2009206272A (ja) | 2008-02-27 | 2009-09-10 | Mitsumi Electric Co Ltd | 半導体装置の検査方法及びプローバ装置 |
JP2009239101A (ja) | 2008-03-27 | 2009-10-15 | Renesas Technology Corp | 半導体装置の製造方法、半導体ウェハ、およびテスト方法 |
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JPS62290144A (ja) | 1986-06-09 | 1987-12-17 | Yokogawa Electric Corp | 半導体ウエ−ハ用プロ−ブ装置 |
JPH04100252A (ja) | 1990-08-20 | 1992-04-02 | Fujitsu Ltd | 電子ビームテスタの試料搭載機構 |
JPH05307049A (ja) * | 1992-04-30 | 1993-11-19 | Nec Kansai Ltd | 半導体ウェーハ特性測定装置 |
JPH06163655A (ja) * | 1992-11-26 | 1994-06-10 | Nec Kansai Ltd | プローブカード |
US5917197A (en) | 1997-05-21 | 1999-06-29 | Siemens Aktiengesellschaft | Integrated multi-layer test pads |
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JP4526626B2 (ja) | 1999-12-20 | 2010-08-18 | 独立行政法人科学技術振興機構 | 電気特性評価装置 |
JP2002082130A (ja) * | 2000-09-06 | 2002-03-22 | Hitachi Ltd | 半導体素子検査装置及びその製造方法 |
JP2002217258A (ja) | 2001-01-22 | 2002-08-02 | Hitachi Ltd | 半導体装置およびその測定方法、ならびに半導体装置の製造方法 |
KR100451627B1 (ko) * | 2001-04-18 | 2004-10-08 | 주식회사 아이씨멤즈 | 반도체 소자 테스트용 프로브 구조물 및 그 제조방법 |
TW565529B (en) | 2002-01-24 | 2003-12-11 | Scs Hightech Inc | Probe card and method for testing the proceed function or speed of electronic devices |
KR100466984B1 (ko) | 2002-05-15 | 2005-01-24 | 삼성전자주식회사 | 테스트 소자 그룹 회로를 포함하는 집적 회로 칩 및 그것의 테스트 방법 |
JP2004228314A (ja) | 2003-01-22 | 2004-08-12 | Renesas Technology Corp | パッドを有する半導体装置 |
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JP4675615B2 (ja) | 2003-12-05 | 2011-04-27 | 株式会社日立ハイテクノロジーズ | 不良検査装置並びにプローブ位置決め方法およびプローブ移動方法 |
JP4377300B2 (ja) * | 2004-06-22 | 2009-12-02 | Necエレクトロニクス株式会社 | 半導体ウエハおよび半導体装置の製造方法 |
KR100624434B1 (ko) | 2004-09-07 | 2006-09-19 | 삼성전자주식회사 | 저항성 팁을 구비한 반도체 탐침 및 그 제조방법 |
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-
2018
- 2018-02-06 KR KR1020207019435A patent/KR20200096600A/ko not_active Application Discontinuation
- 2018-02-06 JP JP2019571136A patent/JP7065124B2/ja active Active
- 2018-02-06 US US16/967,246 patent/US11977099B2/en active Active
- 2018-02-06 CN CN201880085517.1A patent/CN111557041B/zh active Active
- 2018-02-06 WO PCT/JP2018/003987 patent/WO2019155519A1/ja active Application Filing
-
2019
- 2019-01-25 TW TW108102860A patent/TWI757577B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002313864A (ja) | 2001-04-12 | 2002-10-25 | Nec Corp | 半導体装置 |
JP2004226086A (ja) | 2003-01-20 | 2004-08-12 | Yokogawa Electric Corp | コンタクトプローブ |
JP2007121317A (ja) | 2007-02-01 | 2007-05-17 | Sii Nanotechnology Inc | 微小接触式プローバー |
JP2009206272A (ja) | 2008-02-27 | 2009-09-10 | Mitsumi Electric Co Ltd | 半導体装置の検査方法及びプローバ装置 |
JP2009239101A (ja) | 2008-03-27 | 2009-10-15 | Renesas Technology Corp | 半導体装置の製造方法、半導体ウェハ、およびテスト方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201935015A (zh) | 2019-09-01 |
CN111557041B (zh) | 2023-12-26 |
US11977099B2 (en) | 2024-05-07 |
WO2019155519A1 (ja) | 2019-08-15 |
KR20200096600A (ko) | 2020-08-12 |
CN111557041A (zh) | 2020-08-18 |
JPWO2019155519A1 (ja) | 2021-01-14 |
US20210048450A1 (en) | 2021-02-18 |
TWI757577B (zh) | 2022-03-11 |
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