JP7079799B2 - 半導体装置の評価装置 - Google Patents
半導体装置の評価装置 Download PDFInfo
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- JP7079799B2 JP7079799B2 JP2019571135A JP2019571135A JP7079799B2 JP 7079799 B2 JP7079799 B2 JP 7079799B2 JP 2019571135 A JP2019571135 A JP 2019571135A JP 2019571135 A JP2019571135 A JP 2019571135A JP 7079799 B2 JP7079799 B2 JP 7079799B2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
Claims (9)
- 電子源と、
縦方向に延在するスクライブ領域に第1の方向に沿って配置された電極パッド群及び横方向に延在するスクライブ領域に前記第1の方向に沿って配置された電極パッド群の各電極パッドに接続される複数のプローブと、を有し、
前記複数のプローブは、扇状に配列されていることを特徴とする半導体装置の評価装置。 - 請求項1に記載の半導体装置の評価装置において、
前記縦方向に延在するスクライブ領域に配置された電力パッド群、又は、前記横方向に延在するスクライブ領域に配置された電力パッド群に4本のプローブが接続されることを特徴とする半導体装置の評価装置。 - 請求項1に記載の半導体装置の評価装置において、
前記複数のプローブはタングステンプローブであることを特徴とする半導体装置の評価装置。 - 請求項1に記載の半導体装置の評価装置において、
試料ホルダを有し、
前記試料ホルダは、静電チャックで半導体ウェハを固定することを特徴とする半導体装
置の評価装置。 - 電子源と、
カンチレバーの一方の面に、一つの電極パッドに接続される第1の金属の面及び前記第1の金属の面と電気的に分離した第2の金属の面を有する突起と、前記第1の金属の面に接続されている第1の配線と、前記第2の金属の面に接続されている第2の配線と、を有し、前記カンチレバーの他方の面に、導電層を有するプローブと、を備えることを特徴とする半導体装置の評価装置。 - 請求項5に記載の半導体装置の評価装置において、
前記突起は、前記第1および第2の金属の面と電気的に分離した第3の金属の面と、前記第3の金属の面に接続されている第3の配線と、を有することを特徴とする半導体装置の評価装置。 - 請求項5に記載の半導体装置の評価装置において、
前記カンチレバーにピエゾ抵抗素子が形成されていることを特徴とする半導体装置の評価装置。 - 請求項5に記載の半導体装置の評価装置において、
前記金属はタングステンであることを特徴とする半導体装置の評価装置。 - 請求項5に記載の半導体装置の評価装置において、
試料ホルダを有し、
前記試料ホルダは、静電チャックで半導体ウェハを固定することを特徴とする半導体装
置の評価装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/003986 WO2019155518A1 (ja) | 2018-02-06 | 2018-02-06 | 半導体装置の評価装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019155518A1 JPWO2019155518A1 (ja) | 2021-01-07 |
JP7079799B2 true JP7079799B2 (ja) | 2022-06-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019571135A Active JP7079799B2 (ja) | 2018-02-06 | 2018-02-06 | 半導体装置の評価装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11709199B2 (ja) |
JP (1) | JP7079799B2 (ja) |
KR (1) | KR102401663B1 (ja) |
CN (1) | CN111566790B (ja) |
TW (1) | TWI757578B (ja) |
WO (1) | WO2019155518A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11977099B2 (en) * | 2018-02-06 | 2024-05-07 | Hitachi High-Tech Corporation | Method for manufacturing semiconductor device |
US20240168052A1 (en) * | 2021-03-26 | 2024-05-23 | Hitachi High-Tech Corporation | Scanning Probe Microscope, Sample Observation Processing System, and Electric Characteristic Evaluation Device |
US11693047B2 (en) * | 2021-07-02 | 2023-07-04 | Northrop Grumman Systems Corporation | Cryogenic wafer test system |
CN113514758B (zh) * | 2021-09-15 | 2022-02-22 | 绅克半导体科技(苏州)有限公司 | 芯片测试方法、测试机及存储介质 |
KR20230118486A (ko) | 2022-02-04 | 2023-08-11 | 주식회사 마키나락스 | 반도체 소자의 배치를 평가하는 방법 |
US11940486B2 (en) * | 2022-06-01 | 2024-03-26 | Nanya Technology Corporation | Probe station capable of maintaining stable and accurate contact to device under test |
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