JP7051818B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
JP7051818B2
JP7051818B2 JP2019511323A JP2019511323A JP7051818B2 JP 7051818 B2 JP7051818 B2 JP 7051818B2 JP 2019511323 A JP2019511323 A JP 2019511323A JP 2019511323 A JP2019511323 A JP 2019511323A JP 7051818 B2 JP7051818 B2 JP 7051818B2
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Japan
Prior art keywords
resin composition
photosensitive resin
group
black
alkali
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JP2019511323A
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English (en)
Japanese (ja)
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JPWO2018186494A1 (ja
Inventor
健太郎 古江
由起 宮石
梓友子 中村
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Resonac Holdings Corp
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Showa Denko KK
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Priority to JP2021118321A priority Critical patent/JP7171845B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2019511323A 2017-04-07 2018-04-06 感光性樹脂組成物 Active JP7051818B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021118321A JP7171845B2 (ja) 2017-04-07 2021-07-16 樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017076592 2017-04-07
JP2017076592 2017-04-07
PCT/JP2018/014771 WO2018186494A1 (ja) 2017-04-07 2018-04-06 感光性樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021118321A Division JP7171845B2 (ja) 2017-04-07 2021-07-16 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2018186494A1 JPWO2018186494A1 (ja) 2019-11-07
JP7051818B2 true JP7051818B2 (ja) 2022-04-11

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JP2021118321A Active JP7171845B2 (ja) 2017-04-07 2021-07-16 樹脂組成物

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Country Status (6)

Country Link
US (1) US11561469B2 (https=)
JP (2) JP7051818B2 (https=)
KR (2) KR102424545B1 (https=)
CN (1) CN110352384B (https=)
TW (1) TWI683182B (https=)
WO (1) WO2018186494A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020065860A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 感光性樹脂組成物、パターン硬化膜及びその製造方法、半導体素子、並びに電子デバイス
JP6689434B1 (ja) 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子
JP7614582B2 (ja) * 2019-06-03 2025-02-10 日本ポリテック株式会社 ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁
WO2021177251A1 (ja) * 2020-03-04 2021-09-10 Ａｇｃ株式会社 ポジ型感光性樹脂組成物
TWI775465B (zh) * 2020-06-03 2022-08-21 日商昭和電工股份有限公司 正型感光性樹脂組成物，及有機ｅｌ元件隔膜
KR102618634B1 (ko) * 2020-07-17 2023-12-26 삼성에스디아이 주식회사 흑색 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 표시장치
WO2022145187A1 (ja) * 2020-12-28 2022-07-07 昭和電工株式会社 感光性樹脂組成物及び有機ｅｌ素子隔壁
JP7809652B2 (ja) * 2020-12-28 2026-02-02 日本ポリテック株式会社 感光性樹脂組成物及び有機ｅｌ素子隔壁
JPWO2022145189A1 (https=) * 2020-12-28 2022-07-07
WO2022220080A1 (ja) * 2021-04-14 2022-10-20 昭和電工株式会社 感光性樹脂組成物、及び有機ｅｌ素子隔壁
WO2022255171A1 (ja) * 2021-06-02 2022-12-08 昭和電工株式会社 ポジ型感光性樹脂組成物、及び有機ｅｌ素子隔壁
JP7703000B2 (ja) * 2022-10-25 2025-07-04 財團法人工業技術研究院 ポリマー、感光性組成物、ドライフィルムフォトレジスト、およびリソグラフィの方法
JP2024065358A (ja) * 2022-10-31 2024-05-15 日本化薬株式会社 感光性樹脂組成物及びその硬化物

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001791A1 (fr) 1996-07-10 1998-01-15 Nippon Zeon Co., Ltd. Composition de photoresine positive
JP2007206562A (ja) 2006-02-03 2007-08-16 Sekisui Chem Co Ltd ポジ型フォトレジスト及び構造体の製造方法
JP2008185692A (ja) 2007-01-29 2008-08-14 Adeka Corp ポジ型感光性樹脂組成物
JP2011514985A (ja) 2008-03-07 2011-05-12 エルジー・ケム・リミテッド ポジティブ型感光性ポリイミド組成物
JP2013533508A (ja) 2010-07-14 2013-08-22 エルジー・ケム・リミテッド ポジティブ型感光性樹脂組成物およびこれを含む有機発光素子ブラックバンク
JP2013228685A (ja) 2012-03-30 2013-11-07 Toray Ind Inc 感光性シロキサン組成物、それから形成された硬化膜、およびその硬化膜を有する素子

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Publication number Publication date
JP7171845B2 (ja) 2022-11-15
CN110352384B (zh) 2023-04-25
TWI683182B (zh) 2020-01-21
US11561469B2 (en) 2023-01-24
KR20190087606A (ko) 2019-07-24
KR20220025100A (ko) 2022-03-03
CN110352384A (zh) 2019-10-18
WO2018186494A1 (ja) 2018-10-11
US20200033726A1 (en) 2020-01-30
JPWO2018186494A1 (ja) 2019-11-07
KR102361258B1 (ko) 2022-02-10
KR102424545B1 (ko) 2022-07-25
TW201901297A (zh) 2019-01-01
JP2021170132A (ja) 2021-10-28

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