JP7040870B2 - 基板処理装置、及び基板処理装置の部品検査方法 - Google Patents

基板処理装置、及び基板処理装置の部品検査方法 Download PDF

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Publication number
JP7040870B2
JP7040870B2 JP2017146460A JP2017146460A JP7040870B2 JP 7040870 B2 JP7040870 B2 JP 7040870B2 JP 2017146460 A JP2017146460 A JP 2017146460A JP 2017146460 A JP2017146460 A JP 2017146460A JP 7040870 B2 JP7040870 B2 JP 7040870B2
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Japan
Prior art keywords
substrate processing
processing apparatus
liquid
substrate
component
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Active
Application number
JP2017146460A
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English (en)
Japanese (ja)
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JP2019029471A (ja
Inventor
彰夫 橋詰
大輔 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017146460A priority Critical patent/JP7040870B2/ja
Priority to PCT/JP2018/018813 priority patent/WO2019021585A1/ja
Priority to KR1020197038602A priority patent/KR102257429B1/ko
Priority to CN201880043588.5A priority patent/CN110832619B/zh
Priority to TW107120772A priority patent/TWI693104B/zh
Publication of JP2019029471A publication Critical patent/JP2019029471A/ja
Application granted granted Critical
Publication of JP7040870B2 publication Critical patent/JP7040870B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B08B3/042—Cleaning travelling work the loose articles or bulk material travelling gradually through a drum or other container, e.g. by helix or gravity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electrochemistry (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2017146460A 2017-07-28 2017-07-28 基板処理装置、及び基板処理装置の部品検査方法 Active JP7040870B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017146460A JP7040870B2 (ja) 2017-07-28 2017-07-28 基板処理装置、及び基板処理装置の部品検査方法
PCT/JP2018/018813 WO2019021585A1 (ja) 2017-07-28 2018-05-15 基板処理装置、及び基板処理装置の部品検査方法
KR1020197038602A KR102257429B1 (ko) 2017-07-28 2018-05-15 기판 처리 장치 및 기판 처리 장치의 부품 검사 방법
CN201880043588.5A CN110832619B (zh) 2017-07-28 2018-05-15 基板处理装置及基板处理装置的部件检查方法
TW107120772A TWI693104B (zh) 2017-07-28 2018-06-15 基板處理裝置及基板處理裝置之零件檢查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017146460A JP7040870B2 (ja) 2017-07-28 2017-07-28 基板処理装置、及び基板処理装置の部品検査方法

Publications (2)

Publication Number Publication Date
JP2019029471A JP2019029471A (ja) 2019-02-21
JP7040870B2 true JP7040870B2 (ja) 2022-03-23

Family

ID=65039574

Family Applications (1)

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JP2017146460A Active JP7040870B2 (ja) 2017-07-28 2017-07-28 基板処理装置、及び基板処理装置の部品検査方法

Country Status (5)

Country Link
JP (1) JP7040870B2 (ko)
KR (1) KR102257429B1 (ko)
CN (1) CN110832619B (ko)
TW (1) TWI693104B (ko)
WO (1) WO2019021585A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010074191A (ja) 2004-09-28 2010-04-02 Ebara Corp 基板洗浄装置及び洗浄部材の交換時期判定方法
JP2010267856A (ja) 2009-05-15 2010-11-25 Panasonic Corp 洗浄処理装置および洗浄処理方法
JP2010267181A (ja) 2009-05-18 2010-11-25 Sumitomo Chem Eng Kk 薬剤の希釈装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6344158A (ja) * 1986-08-12 1988-02-25 Toyo Seikan Kaisha Ltd 金属容器及びその構成部材の樹脂被覆部における金属露出測定法及び装置
JP2517385Y2 (ja) * 1990-09-26 1996-11-20 鹿児島日本電気株式会社 半導体装置の樹脂欠け検査装置
JP3158840B2 (ja) * 1994-01-31 2001-04-23 日本電気株式会社 ウェット処理装置
JP3177729B2 (ja) * 1995-05-12 2001-06-18 東京エレクトロン株式会社 処理装置
JP3254520B2 (ja) * 1997-11-27 2002-02-12 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理システム
JP3440329B2 (ja) * 1999-08-05 2003-08-25 住友イートンノバ株式会社 コーティング膜の検出方法及びこれを用いるイオン注入装置
KR100378093B1 (ko) * 1999-09-07 2003-03-29 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 회로기판 및 이를 이용한 불량 회로기판의 감지방법
JP4774166B2 (ja) 2001-06-15 2011-09-14 ダイセル化学工業株式会社 転写シート
KR20030092343A (ko) 2002-05-29 2003-12-06 엘지.필립스디스플레이(주) 음극선관용 편향요크
JP5399191B2 (ja) * 2009-09-30 2014-01-29 大日本スクリーン製造株式会社 基板処理装置、基板処理装置のための検査装置、ならびに検査用コンピュータプログラムおよびそれを記録した記録媒体
US9000783B2 (en) * 2010-08-02 2015-04-07 Wafertech, Llc Solid state sensor for metal ion detection and trapping in solution
JP5587724B2 (ja) * 2010-10-01 2014-09-10 日本電信電話株式会社 被膜劣化評価方法
JP6268469B2 (ja) * 2013-12-18 2018-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理装置の制御方法、および記録媒体
CN105278566A (zh) * 2014-07-17 2016-01-27 株式会社平间理化研究所 蚀刻液管理装置、溶解金属浓度测定装置及测定方法
JP6553487B2 (ja) * 2015-11-10 2019-07-31 株式会社Ｓｃｒｅｅｎホールディングス 吐出判定方法および吐出装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010074191A (ja) 2004-09-28 2010-04-02 Ebara Corp 基板洗浄装置及び洗浄部材の交換時期判定方法
JP2010267856A (ja) 2009-05-15 2010-11-25 Panasonic Corp 洗浄処理装置および洗浄処理方法
JP2010267181A (ja) 2009-05-18 2010-11-25 Sumitomo Chem Eng Kk 薬剤の希釈装置

Also Published As

Publication number Publication date
CN110832619B (zh) 2023-12-08
KR20200013716A (ko) 2020-02-07
JP2019029471A (ja) 2019-02-21
KR102257429B1 (ko) 2021-05-27
WO2019021585A1 (ja) 2019-01-31
CN110832619A (zh) 2020-02-21
TW201919774A (zh) 2019-06-01
TWI693104B (zh) 2020-05-11

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