TWI693104B - 基板處理裝置及基板處理裝置之零件檢查方法 - Google Patents

基板處理裝置及基板處理裝置之零件檢查方法 Download PDF

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Publication number
TWI693104B
TWI693104B TW107120772A TW107120772A TWI693104B TW I693104 B TWI693104 B TW I693104B TW 107120772 A TW107120772 A TW 107120772A TW 107120772 A TW107120772 A TW 107120772A TW I693104 B TWI693104 B TW I693104B
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TW
Taiwan
Prior art keywords
substrate processing
liquid
processing apparatus
substrate
parts
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TW107120772A
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English (en)
Chinese (zh)
Other versions
TW201919774A (zh
Inventor
橋詰彰夫
平田大輔
Original Assignee
日商斯庫林集團股份有限公司
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Publication of TW201919774A publication Critical patent/TW201919774A/zh
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Publication of TWI693104B publication Critical patent/TWI693104B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B08B3/042—Cleaning travelling work the loose articles or bulk material travelling gradually through a drum or other container, e.g. by helix or gravity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Electrochemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW107120772A 2017-07-28 2018-06-15 基板處理裝置及基板處理裝置之零件檢查方法 TWI693104B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-146460 2017-07-28
JP2017146460A JP7040870B2 (ja) 2017-07-28 2017-07-28 基板処理装置、及び基板処理装置の部品検査方法

Publications (2)

Publication Number Publication Date
TW201919774A TW201919774A (zh) 2019-06-01
TWI693104B true TWI693104B (zh) 2020-05-11

Family

ID=65039574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120772A TWI693104B (zh) 2017-07-28 2018-06-15 基板處理裝置及基板處理裝置之零件檢查方法

Country Status (5)

Country Link
JP (1) JP7040870B2 (ko)
KR (1) KR102257429B1 (ko)
CN (1) CN110832619B (ko)
TW (1) TWI693104B (ko)
WO (1) WO2019021585A1 (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221066A (ja) * 1994-01-31 1995-08-18 Nec Corp ウェット処理装置
JPH08316182A (ja) * 1995-05-12 1996-11-29 Tokyo Electron Ltd 処理装置
JP2010074191A (ja) * 2004-09-28 2010-04-02 Ebara Corp 基板洗浄装置及び洗浄部材の交換時期判定方法
JP2010267856A (ja) * 2009-05-15 2010-11-25 Panasonic Corp 洗浄処理装置および洗浄処理方法
JP2010267181A (ja) * 2009-05-18 2010-11-25 Sumitomo Chem Eng Kk 薬剤の希釈装置
TW201528412A (zh) * 2013-12-18 2015-07-16 Screen Holdings Co Ltd 基板處理裝置，基板處理裝置之控制方法及記錄媒體
TW201722565A (zh) * 2015-11-10 2017-07-01 斯庫林集團股份有限公司 吐出判定方法及吐出裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6344158A (ja) * 1986-08-12 1988-02-25 Toyo Seikan Kaisha Ltd 金属容器及びその構成部材の樹脂被覆部における金属露出測定法及び装置
JP2517385Y2 (ja) * 1990-09-26 1996-11-20 鹿児島日本電気株式会社 半導体装置の樹脂欠け検査装置
JP3254520B2 (ja) * 1997-11-27 2002-02-12 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理システム
JP3440329B2 (ja) * 1999-08-05 2003-08-25 住友イートンノバ株式会社 コーティング膜の検出方法及びこれを用いるイオン注入装置
KR100378093B1 (ko) * 1999-09-07 2003-03-29 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 회로기판 및 이를 이용한 불량 회로기판의 감지방법
JP4774166B2 (ja) 2001-06-15 2011-09-14 ダイセル化学工業株式会社 転写シート
KR20030092343A (ko) 2002-05-29 2003-12-06 엘지.필립스디스플레이(주) 음극선관용 편향요크
JP5399191B2 (ja) * 2009-09-30 2014-01-29 大日本スクリーン製造株式会社 基板処理装置、基板処理装置のための検査装置、ならびに検査用コンピュータプログラムおよびそれを記録した記録媒体
US9000783B2 (en) * 2010-08-02 2015-04-07 Wafertech, Llc Solid state sensor for metal ion detection and trapping in solution
JP5587724B2 (ja) * 2010-10-01 2014-09-10 日本電信電話株式会社 被膜劣化評価方法
CN105278566A (zh) * 2014-07-17 2016-01-27 株式会社平间理化研究所 蚀刻液管理装置、溶解金属浓度测定装置及测定方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221066A (ja) * 1994-01-31 1995-08-18 Nec Corp ウェット処理装置
JPH08316182A (ja) * 1995-05-12 1996-11-29 Tokyo Electron Ltd 処理装置
JP2010074191A (ja) * 2004-09-28 2010-04-02 Ebara Corp 基板洗浄装置及び洗浄部材の交換時期判定方法
JP2010267856A (ja) * 2009-05-15 2010-11-25 Panasonic Corp 洗浄処理装置および洗浄処理方法
JP2010267181A (ja) * 2009-05-18 2010-11-25 Sumitomo Chem Eng Kk 薬剤の希釈装置
TW201528412A (zh) * 2013-12-18 2015-07-16 Screen Holdings Co Ltd 基板處理裝置，基板處理裝置之控制方法及記錄媒體
TW201722565A (zh) * 2015-11-10 2017-07-01 斯庫林集團股份有限公司 吐出判定方法及吐出裝置

Also Published As

Publication number Publication date
JP7040870B2 (ja) 2022-03-23
KR20200013716A (ko) 2020-02-07
WO2019021585A1 (ja) 2019-01-31
CN110832619A (zh) 2020-02-21
JP2019029471A (ja) 2019-02-21
CN110832619B (zh) 2023-12-08
TW201919774A (zh) 2019-06-01
KR102257429B1 (ko) 2021-05-27

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