JP6983457B2 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
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Description
実施例または比較例で製造された硬化性組成物は、一般的なITOフィルム(ポリエチレンテレフタラート;PET)フィルムの一面にITO(酸化インジウムスズ)が蒸着されたフィルム)(図1の基板200)のITO層上に約10μm程度の厚さでコーティングし、約130℃程度の温度で約3分間乾燥した後、一般的なラビング配向に適用されるラビング布でラビング処理する。その後、レンズ構造物が形成された基板(図1のレンズ層300が形成された基板100)を、前記熱処理後にラビング配向処理された硬化層に付着し、メタルハライドランプで3J/cm2程度の紫外線を照射し、それら間の空間(図1の500)に液晶を注入した後、偏光顕微鏡(ニコン社、ECLIPSE E600WPOL)を使用して液晶の配向が良好に行われたか否かを確認する。液晶の配向が行われた場合にはPで評価し、行われていないか、または、配向欠陥が観察される場合にはNGで評価した。
ラビング配向性の評価時に適用されたサンプルをさらに約50℃〜100℃の温度で約10分〜1時間程度さらに熟成(aging)させた後、ラビング工程性の評価時と同一に、偏光顕微鏡(ニコン社、ECLIPSE E600WPOL)を使用して液晶の配向が良好に行われたか否かを確認する。液晶の配向が行われた場合には、Pで評価し、行われていないか、または、配向欠陥が観察される場合には、NGで評価した。
液晶配向性の評価時に適用されたサンプルを曲げてから伸ばした後に、レンズおよびITO層との硬化性組成物の層の付着程度を観察して、異常がない場合にはPで評価し、付着が脱離したり、液晶配向の不良が観察される場合はNGで評価した。
実施例または比較例で製造した硬化性組成物をITOフィルムのITO層にコーティングし、ラビング工程性および液晶配向性の評価時に適用されたものと同一に紫外線照射および熱処理(aging)し、ASTM D3359規格によりクロスカット試験を行い、硬化層が全く脱離しない場合をPで評価し、一部あるいは全部が脱離した場合にはNGで評価した。
固状エポキシ化合物として、DIC社のEpiclon 1055(ビスフェノールA型エポキシ化合物、エポキシ当量:450〜500g/eq、軟化点:64℃〜74℃)、液状エポキシ化合物として、国都化学社のYD−128(液状ビスフェノールA型エポキシ化合物、エポキシ当量:184〜190g/eq)、ビスフェノール型(メタ)アクリレートとして、サートマー社のCN110NS(ビスフェノールA型エポキシアクリレート、液状)、フェノキシ樹脂として、YP−50(ビスフェノールA型フェノキシ樹脂、分子量:60,000〜80,000g/mol)、光ラジカル開始剤として、BASF社のIrgacure 184、および光カチオン開始剤として、SAN−APRO社のCPI−101Aを、約15:10:15:58:1:1(Epiclon 1055:YD−128:CN110NS:YP−50:Irgacure 184:CPI−101A)の重量比で反応器内に投入し、メチルエチルケトンで適正に希釈した後、反応器の内部を窒素で置換し、均一化して、硬化性組成物を製造した。実施例1の硬化性組成物の場合、物性評価時の熱処理(aging)温度は、約50℃であり、時間は、約1時間程度であった。
使用された成分の種類および比率を下記表1のように変更したことを除いて、実施例1と同一に硬化性組成物を製造した。
300 レンズ構造物
400 配向層、硬化性組成物の硬化層
500 内部空間
Claims (18)
- エポキシ化合物と、前記エポキシ化合物100重量部に対して100重量部未満の比率のビスフェノール型(メタ)アクリレートと、フェノキシ樹脂とを含む硬化性組成物であって、
前記エポキシ化合物は、軟化点または融点が50℃以上であるビスフェノール型エポキシ化合物と、ASTM D2196−05規格またはKD−AS−005規格によって測定した常温での粘度が20,000cP以下であるエポキシ化合物とを含む、硬化性組成物。 - エポキシ化合物は、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、および水添ビスフェノールA型エポキシ樹脂よりなる群から選択された一つ以上である、請求項1に記載の硬化性組成物。
- エポキシ化合物は、ビスフェノール型エポキシ化合物である、請求項1に記載の硬化性組成物。
- 軟化点または融点が50℃以上であるビスフェノール型エポキシ化合物は、エポキシ当量が150g/eq以上であるビスフェノール型エポキシ樹脂を含む、請求項1に記載の硬化性組成物。
- 軟化点または融点が50℃以上であり、エポキシ当量が150g/eq以上であるビスフェノール型エポキシ樹脂は、エポキシ化合物の全体重量を100重量%とした時、10重量%以上含まれている、請求項4に記載の硬化性組成物。
- ASTM D2196−05規格またはKD−AS−005規格によって測定した常温での粘度が20,000cP以下であるエポキシ化合物は、エポキシ当量が300g/eq以下であるビスフェノール型エポキシ化合物を含む、請求項1に記載の硬化性組成物。
- ASTM D2196−05規格またはKD−AS−005規格により測定した常温での粘度が20,000cP以下であり、エポキシ当量が300g/eq以下であるビスフェノール型エポキシ化合物は、軟化点または融点が50℃以上であり、エポキシ当量が150g/eq以上であるビスフェノール型エポキシ樹脂100重量部に対して10〜200重量部の比率で含まれる、請求項6に記載の硬化性組成物。
- ビスフェノール型(メタ)アクリレートは、少なくとも1個の(メタ)アクリル系官能基が連結されたビスフェノール骨格を有する化合物である、請求項1に記載の硬化性組成物。
- ビスフェノール型(メタ)アクリレートが下記化学式1で表される、請求項1に記載の硬化性組成物:
- フェノキシ樹脂は、ビスフェノール型フェノキシ樹脂である、請求項1に記載の硬化性組成物。
- フェノキシ樹脂は、重量平均分子量が30,000〜150,000g/molの範囲内である、請求項1に記載の硬化性組成物。
- カチオン開始剤をさらに含む、請求項1に記載の硬化性組成物。
- ラジカル開始剤をさらに含む、請求項1に記載の硬化性組成物。
- 請求項1に記載の硬化性組成物の層に配向処理を行う段階と、配向処理が行われた前記硬化性組成物の層を硬化させる段階と、硬化処理後に前記硬化性組成物の層を熱処理する段階と、を含む液晶配向性接着剤層の製造方法。
- 熱処理は、50℃〜100℃の範囲内の温度で行う、請求項14に記載の液晶配向性接着剤層の製造方法。
- 熱処理は、10分〜60分間行う、請求項14に記載の液晶配向性接着剤層の製造方法。
- 対向配置されている第1および第2基板と、前記第1および第2基板の間に存在する液晶層と、前記第1および第2基板のうちいずれか一つの基板の前記液晶層に向かう表面に存在する請求項1に記載の硬化性組成物の硬化層と、を含む光学デバイス。
- 第1および第2基板のうちいずれか一つの基板の液晶層に向かう表面には、レンズ層が存在し、前記レンズ層と他の基板が硬化性組成物の硬化層により付着している、請求項17に記載の光学デバイス。
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Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5086086A (en) | 1987-08-28 | 1992-02-04 | Minnesota Mining And Manufacturing Company | Energy-induced curable compositions |
JP3197907B2 (ja) | 1991-02-15 | 2001-08-13 | 旭電化工業株式会社 | エネルギー線を用いた注型成型方法 |
US5252694A (en) | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
JPH08328026A (ja) * | 1995-06-01 | 1996-12-13 | Sumitomo Bakelite Co Ltd | 液晶表示素子用シール材組成物、液晶表示素子の製造方法及び液晶表示素子 |
WO1997000923A1 (en) | 1995-06-21 | 1997-01-09 | Minnesota Mining And Manufacturing Company | Adhesive compositions, bonding films made therefrom and processes for making bonding films |
US5897727A (en) | 1996-09-20 | 1999-04-27 | Minnesota Mining And Manufacturing Company | Method for assembling layers with a transfer process using a crosslinkable adhesive layer |
US6180200B1 (en) | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
JP2002338900A (ja) | 2001-05-11 | 2002-11-27 | Shin Etsu Polymer Co Ltd | 紫外線硬化型接着剤、接着方法及びそれから製造される成形品 |
JP4522662B2 (ja) * | 2003-03-31 | 2010-08-11 | 香港科技大学 | 液晶配向膜用組成物、液晶配向膜、液晶配向膜の製造方法、及びマレイミド化合物 |
JP2005222037A (ja) * | 2004-01-07 | 2005-08-18 | Shin Etsu Chem Co Ltd | 液晶表示素子用シール剤組成物 |
TW200613422A (en) * | 2004-07-22 | 2006-05-01 | Three Bond Co Ltd | Curable composition |
JP4802461B2 (ja) | 2004-07-22 | 2011-10-26 | 株式会社スリーボンド | 光重合開始剤及びそれを用いた光硬化性材料 |
WO2007026784A1 (ja) | 2005-09-02 | 2007-03-08 | Dainippon Ink And Chemicals, Inc. | シール剤用光硬化性組成物、液晶シール剤、及び液晶パネル |
JP5597338B2 (ja) * | 2005-12-27 | 2014-10-01 | 三井化学株式会社 | 液晶表示パネルの製造方法およびそのシール剤 |
JP5070959B2 (ja) * | 2006-10-06 | 2012-11-14 | 日立化成工業株式会社 | 液晶シール材の硬化方法 |
KR20090021797A (ko) | 2007-08-28 | 2009-03-04 | 주식회사 동진쎄미켐 | 표면처리된 무기물을 포함하는 액정 디스플레이 패널용밀봉제 조성물 |
KR20090076754A (ko) * | 2008-01-08 | 2009-07-13 | 주식회사 엘지화학 | 광학 필름, 위상차 필름, 보호 필름 및 이들을 포함하는액정 표시 장치 |
WO2009145167A1 (ja) * | 2008-05-30 | 2009-12-03 | シーメット株式会社 | 光学的立体造形用樹脂組成物 |
EP2417210B1 (en) | 2009-04-10 | 2013-03-06 | Pixeloptics Inc. | Curable adhesive compositions |
JP2011219682A (ja) * | 2010-04-13 | 2011-11-04 | Adeka Corp | 硬化性樹脂組成物 |
WO2013035685A1 (ja) * | 2011-09-05 | 2013-03-14 | ナミックス株式会社 | 導電性樹脂組成物及びそれを使用した硬化体 |
CN103958628B (zh) | 2011-11-14 | 2016-02-17 | 汉高知识产权控股有限责任公司 | 粘合剂组合物 |
WO2014204228A1 (ko) * | 2013-06-19 | 2014-12-24 | 코오롱인더스트리 주식회사 | 입체영상 표시장치용 2d/3d 스위칭 렌즈 |
KR20140147923A (ko) * | 2013-06-19 | 2014-12-31 | 코오롱인더스트리 주식회사 | 입체영상 표시장치용 2d/3d 스위칭 렌티큘라 렌즈 |
KR101739299B1 (ko) | 2013-09-24 | 2017-06-08 | 삼성에스디아이 주식회사 | 2차전지용 바인더 조성물, 이를 채용한 양극과 리튬전지 |
KR101462845B1 (ko) | 2014-08-21 | 2014-11-19 | 주식회사 이녹스 | 유연성이 향상된 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름 |
KR101867647B1 (ko) | 2014-08-26 | 2018-06-15 | 주식회사 엘지화학 | 액정 실링 필름 형성용 조성물, 액정 실링 필름, 액정 배향능을 갖는 액정 실링 필름을 제조하는 방법 및 액정을 배향 및 실링하는 방법 |
KR101648119B1 (ko) | 2014-10-29 | 2016-08-16 | 에스케이씨하스디스플레이필름(유) | 무안경 입체 영상 표시 장치용 필름 |
JP6701661B2 (ja) * | 2014-12-25 | 2020-05-27 | Jsr株式会社 | 液晶配向剤、液晶素子の製造方法、液晶配向膜及び液晶素子 |
JP6491490B2 (ja) * | 2015-02-06 | 2019-03-27 | 株式会社Adeka | 液晶滴下工法用シール剤 |
KR101843900B1 (ko) * | 2015-04-29 | 2018-03-30 | 주식회사 엘지화학 | 반도체 접착용 수지 조성물 및 반도체용 접착 필름 및 다이싱 다이본딩 필름 |
CN109689825B (zh) * | 2016-11-25 | 2021-06-22 | 株式会社Lg化学 | 可固化组合物 |
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