JP6938084B2 - ブレード保持具 - Google Patents

ブレード保持具 Download PDF

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Publication number
JP6938084B2
JP6938084B2 JP2017144434A JP2017144434A JP6938084B2 JP 6938084 B2 JP6938084 B2 JP 6938084B2 JP 2017144434 A JP2017144434 A JP 2017144434A JP 2017144434 A JP2017144434 A JP 2017144434A JP 6938084 B2 JP6938084 B2 JP 6938084B2
Authority
JP
Japan
Prior art keywords
cutting blade
holding
blade
blade holder
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017144434A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019025556A (ja
Inventor
横山　太郎
太郎 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017144434A priority Critical patent/JP6938084B2/ja
Priority to KR1020180078595A priority patent/KR102586320B1/ko
Priority to TW107125400A priority patent/TWI757525B/zh
Priority to CN201810810709.6A priority patent/CN109304817B/zh
Publication of JP2019025556A publication Critical patent/JP2019025556A/ja
Application granted granted Critical
Publication of JP6938084B2 publication Critical patent/JP6938084B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)
JP2017144434A 2017-07-26 2017-07-26 ブレード保持具 Active JP6938084B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017144434A JP6938084B2 (ja) 2017-07-26 2017-07-26 ブレード保持具
KR1020180078595A KR102586320B1 (ko) 2017-07-26 2018-07-06 블레이드 유지구
TW107125400A TWI757525B (zh) 2017-07-26 2018-07-23 刀片保持器具
CN201810810709.6A CN109304817B (zh) 2017-07-26 2018-07-23 刀具保持器具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017144434A JP6938084B2 (ja) 2017-07-26 2017-07-26 ブレード保持具

Publications (2)

Publication Number Publication Date
JP2019025556A JP2019025556A (ja) 2019-02-21
JP6938084B2 true JP6938084B2 (ja) 2021-09-22

Family

ID=65225789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017144434A Active JP6938084B2 (ja) 2017-07-26 2017-07-26 ブレード保持具

Country Status (4)

Country Link
JP (1) JP6938084B2 (ko)
KR (1) KR102586320B1 (ko)
CN (1) CN109304817B (ko)
TW (1) TWI757525B (ko)

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430856A1 (de) * 1984-08-22 1986-03-06 Bayerische Motoren Werke AG, 8000 München Anlage zum automatischen schleifen von gewoelbten flaechen
JP2823493B2 (ja) * 1993-01-18 1998-11-11 トーヨーエイテック株式会社 スライシング装置のブレード撓み検出方法及び装置並びにブレード撓み制御装置
EP0868976A3 (en) * 1997-03-06 2000-08-23 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
CA2233127C (en) * 1997-03-27 2004-07-06 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US5974689A (en) * 1997-09-23 1999-11-02 Gary W. Farrell Chemical drying and cleaning system
DE29924404U1 (de) * 1999-11-10 2003-02-06 Graf & Co Ag Sägezahndraht
US20020076905A1 (en) * 2000-12-15 2002-06-20 Yuan-Fu Lin Method of eliminating silicon residual from wafer after dicing saw process
JP2002261058A (ja) * 2001-03-06 2002-09-13 Sumitomo Electric Ind Ltd 化合物半導体ウエハの製造方法
JP4141788B2 (ja) * 2002-10-09 2008-08-27 日立ビアエンジニアリング株式会社 保護プレート
US20050195728A1 (en) * 2004-03-02 2005-09-08 Fdd Technologies Sa/Ag/Ltd Optical storage media having limited useful life
JP4431016B2 (ja) 2004-09-14 2010-03-10 株式会社ディスコ ブレードケース
JP5020963B2 (ja) * 2006-10-17 2012-09-05 一正 大西 円盤状の切削工具及び切削装置
JP5058085B2 (ja) * 2008-07-02 2012-10-24 東京エレクトロン株式会社 基板洗浄装置
JP5926501B2 (ja) * 2011-06-15 2016-05-25 東京応化工業株式会社 保持装置および保持方法
JP2014104522A (ja) * 2012-11-26 2014-06-09 Sumitomo Metal Mining Co Ltd ウェハーの片面加工方法、ウェハーの製造方法
CN103084919B (zh) * 2013-02-07 2016-08-03 浙江工业大学 切削液气雾微量润滑方法和装置
JP6189135B2 (ja) * 2013-08-19 2017-08-30 株式会社ディスコ ブレード着脱具及びブレードケース
JP6156509B2 (ja) * 2013-10-15 2017-07-05 三菱電機株式会社 半導体素子の製造方法
JP6242162B2 (ja) * 2013-11-05 2017-12-06 株式会社ディスコ 切削装置及び切削方法
JP6307753B2 (ja) * 2014-05-13 2018-04-11 株式会社岡本工作機械製作所 半導体基板の平坦化加工方法
WO2015189600A2 (en) * 2014-06-09 2015-12-17 Ex Scintilla Ltd Material processing methods and related apparatus
CN104760277B (zh) * 2015-03-17 2017-02-01 中国航空工业集团公司航空动力控制系统研究所 电子行业用pcb与导热板的粘结工艺
US20160311127A1 (en) * 2015-04-24 2016-10-27 Disco Corporation Cutting apparatus and cutting method
JP6489963B2 (ja) * 2015-07-09 2019-03-27 株式会社ディスコ ブレード挟持治具
CN105537066B (zh) * 2016-02-29 2018-06-05 京东方科技集团股份有限公司 一种用于涂胶刀头的调节垫片、涂胶刀头及涂胶机
CN205888598U (zh) * 2016-08-10 2017-01-18 淮安优博特健康科技有限公司 一种管件锯切定位装置
CN206286660U (zh) * 2016-11-30 2017-06-30 江西洪都航空工业集团有限责任公司 一种用于热成形复杂曲面零件水刀精确切割夹具

Also Published As

Publication number Publication date
KR20190012102A (ko) 2019-02-08
CN109304817B (zh) 2021-11-30
TW201910045A (zh) 2019-03-16
TWI757525B (zh) 2022-03-11
CN109304817A (zh) 2019-02-05
JP2019025556A (ja) 2019-02-21
KR102586320B1 (ko) 2023-10-06

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