EP0868976A3 - Lapping apparatus and method for high speed lapping with a rotatable abrasive platen - Google Patents

Lapping apparatus and method for high speed lapping with a rotatable abrasive platen Download PDF

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Publication number
EP0868976A3
EP0868976A3 EP98301690A EP98301690A EP0868976A3 EP 0868976 A3 EP0868976 A3 EP 0868976A3 EP 98301690 A EP98301690 A EP 98301690A EP 98301690 A EP98301690 A EP 98301690A EP 0868976 A3 EP0868976 A3 EP 0868976A3
Authority
EP
European Patent Office
Prior art keywords
lapping
platen
lapped
sheet
high speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98301690A
Other languages
German (de)
French (fr)
Other versions
EP0868976A2 (en
Inventor
Wayne O. Duescher
Gary A. Staus
Mark J. Luedtke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keltech Engineering Inc
Original Assignee
Keltech Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keltech Engineering Inc filed Critical Keltech Engineering Inc
Publication of EP0868976A2 publication Critical patent/EP0868976A2/en
Publication of EP0868976A3 publication Critical patent/EP0868976A3/en
Withdrawn legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A process for lapping a surface comprising:
  • a) providing a workpiece to be lapped, having at least one surface to be lapped,
  • b) providing a rotating platen having i) a back surface and ii) a flat surface which can be adjusted to a position parallel to said at least one surface of said workpiece,
  • c) providing a sheet of abrasive material having an abrasive face and a back side, said back side being on said flat surface of said platen with the abrasive face of said sheet facing at least one surface to be lapped,
  • d) securing said sheet of abrasive material to said flat surface of said platen, and
  • 1. rotating said platen at a rotational speed of at least 500 revolutions per minute, and a surface speed at an outside edge of said sheet of abrasive material of at least 1500 surface feet per minute, and
  • 2. contacting said abrasive face and said at least one surface of said workpiece to be lapped.
  • Figure 00000001
    EP98301690A 1997-03-06 1998-03-06 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen Withdrawn EP0868976A3 (en)

    Applications Claiming Priority (2)

    Application Number Priority Date Filing Date Title
    US81274897A 1997-03-06 1997-03-06
    US812748 1997-03-06

    Publications (2)

    Publication Number Publication Date
    EP0868976A2 EP0868976A2 (en) 1998-10-07
    EP0868976A3 true EP0868976A3 (en) 2000-08-23

    Family

    ID=25210509

    Family Applications (1)

    Application Number Title Priority Date Filing Date
    EP98301690A Withdrawn EP0868976A3 (en) 1997-03-06 1998-03-06 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen

    Country Status (1)

    Country Link
    EP (1) EP0868976A3 (en)

    Families Citing this family (22)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
    US7367872B2 (en) 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
    US8123593B2 (en) 2008-05-07 2012-02-28 Zygo Corporation Configuring of lapping and polishing machines
    US9352442B2 (en) 2013-07-02 2016-05-31 Seagate Technology Llc Lapping carrier
    CN106475914B (en) * 2016-10-31 2018-05-25 南京航空航天大学 A kind of titanium alloy surface amino film plastics abrasive air Jet Polishing method
    DE102016125670A1 (en) 2016-12-23 2018-06-28 Scanlab Gmbh Scanning mirror with balancing body and method for balancing a scanning mirror
    JP6938084B2 (en) * 2017-07-26 2021-09-22 株式会社ディスコ Blade holder
    CN110000685B (en) * 2019-05-07 2024-06-18 福州凌扬机电技术有限公司 Efficient polishing device for hardware machining
    CN111403885B (en) * 2020-03-31 2021-11-16 重庆思睿创瓷电科技有限公司 Alignment and pressing process and tool for filter
    CN112197754B (en) * 2020-09-17 2022-03-15 浙江海致建设有限公司 Tripod for architectural survey
    CN112911850A (en) * 2020-12-30 2021-06-04 西安熊福芳电子科技有限公司 Intelligent monitoring equipment control operation panel convenient to remove
    CN112935963B (en) * 2021-02-05 2022-12-02 许昌学院 Decorative board grinding device for furniture design
    CN113267425A (en) * 2021-06-25 2021-08-17 郑州磨料磨具磨削研究所有限公司 Device and method for testing hardness of semi-solid extrusion abrasive material flow
    CN113916747B (en) * 2021-10-14 2023-09-15 重庆科技学院 Revision method applied to viscoelastic fluid test starting pressure gradient
    CN114932501B (en) * 2022-06-02 2023-12-26 中国船舶集团有限公司第七一六研究所 Optical fiber ferrule grinding and clamping mechanism
    CN114952441B (en) * 2022-06-15 2023-10-13 无锡市明鑫数控磨床有限公司 Vertical grinding processing technology for wind power TRB bearing
    CN114952554B (en) * 2022-06-20 2023-07-21 武汉船用机械有限责任公司 Automatic polishing device
    CN115401534B (en) * 2022-08-30 2023-08-01 大连理工大学 Microarray die conformal polishing method
    CN115847225B (en) * 2023-03-02 2023-04-28 成都裕鸢航空智能制造股份有限公司 Metal plate surface polishing device and polishing method
    CN116484667B (en) * 2023-03-13 2024-04-19 北京交通大学 Topology optimization and stability assessment method for support connector structure
    CN116923719A (en) * 2023-09-18 2023-10-24 成都庆龙航空科技有限公司 Universal unmanned aerial vehicle profiling bracket
    CN117047609A (en) * 2023-10-10 2023-11-14 玛格瑞斯(盐城)新型建材有限公司 Edging device is used in wood-based plate production and processing

    Citations (3)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    EP0257013A2 (en) * 1986-08-19 1988-02-24 Léon Biebuyck Method and apparatus for mechanically grinding and polishing a surface of a mineral material, especially glass
    JPH07283178A (en) * 1994-02-21 1995-10-27 Toshiba Corp Method and apparatus for manufacturing semiconductor device
    JPH07283177A (en) * 1994-02-21 1995-10-27 Toshiba Corp Method and device of manufacturing semiconductor device

    Patent Citations (3)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    EP0257013A2 (en) * 1986-08-19 1988-02-24 Léon Biebuyck Method and apparatus for mechanically grinding and polishing a surface of a mineral material, especially glass
    JPH07283178A (en) * 1994-02-21 1995-10-27 Toshiba Corp Method and apparatus for manufacturing semiconductor device
    JPH07283177A (en) * 1994-02-21 1995-10-27 Toshiba Corp Method and device of manufacturing semiconductor device

    Also Published As

    Publication number Publication date
    EP0868976A2 (en) 1998-10-07

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