JP5014892B2 - ブレード交換工具 - Google Patents
ブレード交換工具 Download PDFInfo
- Publication number
- JP5014892B2 JP5014892B2 JP2007166313A JP2007166313A JP5014892B2 JP 5014892 B2 JP5014892 B2 JP 5014892B2 JP 2007166313 A JP2007166313 A JP 2007166313A JP 2007166313 A JP2007166313 A JP 2007166313A JP 5014892 B2 JP5014892 B2 JP 5014892B2
- Authority
- JP
- Japan
- Prior art keywords
- blade
- finger
- cutting
- cylindrical body
- replacement tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 claims description 93
- 210000003811 finger Anatomy 0.000 claims description 49
- 210000003813 thumb Anatomy 0.000 claims description 22
- 239000013013 elastic material Substances 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 36
- 238000003384 imaging method Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B9/00—Hand-held gripping tools other than those covered by group B25B7/00
- B25B9/02—Hand-held gripping tools other than those covered by group B25B7/00 without sliding or pivotal connections, e.g. tweezers, onepiece tongs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B9/00—Hand-held gripping tools other than those covered by group B25B7/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53909—Means comprising hand manipulatable tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53909—Means comprising hand manipulatable tool
- Y10T29/53943—Hand gripper for direct push or pull
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
26 スピンドル
28 切削ブレード
30 ブレードマウント
34 円形基台
36 円形ハブ
40 切刃
42 ナット
44,44A,44B ブレード交換工具
46 円筒本体
46a 切欠部
48 親指係止部
50 3指係止部
54 第1ストッパ
62 第2ストッパ
64 第二3指係止部
82,86 フランジ
84 リング状ブレード
Claims (6)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードを回転可能に支持するブレードマウントを有する切削手段とを備えた切削装置におけるブレード交換工具であって、
前記切削ブレードは、前記ブレードマウントの中心部に形成された装着凸部に挿入する挿入口を有する円形基台と、該円形基台の一方の側面に該円形基台と一体的に形成された円形ハブと、該円形基台の外周から突出した切刃部とから構成され、
前記ブレード交換工具は、弾性部材で形成されるとともに円筒体の一部を切り欠いた切欠部を有しC形状を呈した円筒本体と、
該円筒本体の一方の端部の内側に形成され前記切削ブレードの円形ハブを包囲するように適合した係合溝と、
該円筒本体の内周が前記切削ブレードの円形ハブを包囲する状態から把持する状態に位置づける握り部と、
を具備したことを特徴とするブレード交換工具。 - 前記円筒本体は、ゴム、合成樹脂等の弾性材料から形成されている請求項1記載のブレード交換工具。
- 前記握り部は親指が係止する親指係止部と、前記切欠部に対して該親指係止部と反対側に形成され人差し指、中指、薬指が係止する3指係止部とから構成される請求項1又は2記載のブレード交換工具。
- 前記親指係止部は、前記円筒本体の外周に形成され前記握り部を把持する親指が当接する第1円弧状凹部と、該第1円弧状凹部と対応した位置の前記円筒本体の前記一方の端部の外周から半径方向外側に突出するように該円筒本体と一体的に形成された第1ストッパ部とから構成され、
前記3指係止部は、前記円筒本体の外周に形成され前記握り部を把持する人指し指、中指、薬指がそれぞれ当接する第2,第3,第4円弧状凹部と、該第2,第3,第4円弧状凹部に対応する位置の前記円筒本体の前記一方の端部の外周から半径方向外側に突出するように該円筒本体と一体的に形成された第2ストッパ部とから構成される請求項3記載のブレード交換工具。 - 前記握り部は人指し指、中指、薬指が係止する第一3指係止部と、前記切欠部に対して該第一3指係止部と対称に形成され、人指し指、中指、薬指が係止する第二3指係止部とから構成される請求項1又は2記載のブレード交換工具。
- 前記円筒本体の外径は、前記切削ブレードの前記円形ハブの外径より大きく、前記円形基台の外径よりも小さく形成されている請求項1〜5のいずれかに記載のブレード交換工具。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007166313A JP5014892B2 (ja) | 2007-06-25 | 2007-06-25 | ブレード交換工具 |
TW097115016A TWI408039B (zh) | 2007-06-25 | 2008-04-24 | Blade exchange tool |
KR1020080052077A KR101344650B1 (ko) | 2007-06-25 | 2008-06-03 | 블레이드 교환 공구 |
US12/135,730 US7661183B2 (en) | 2007-06-25 | 2008-06-09 | Blade changing tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007166313A JP5014892B2 (ja) | 2007-06-25 | 2007-06-25 | ブレード交換工具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009000798A JP2009000798A (ja) | 2009-01-08 |
JP5014892B2 true JP5014892B2 (ja) | 2012-08-29 |
Family
ID=40134999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007166313A Active JP5014892B2 (ja) | 2007-06-25 | 2007-06-25 | ブレード交換工具 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7661183B2 (ja) |
JP (1) | JP5014892B2 (ja) |
KR (1) | KR101344650B1 (ja) |
TW (1) | TWI408039B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016060003A (ja) * | 2014-09-18 | 2016-04-25 | 株式会社ディスコ | ブレード用治具 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5014892B2 (ja) * | 2007-06-25 | 2012-08-29 | 株式会社ディスコ | ブレード交換工具 |
JP5179233B2 (ja) * | 2008-03-25 | 2013-04-10 | 株式会社ディスコ | ブレード交換方法 |
JP2009241177A (ja) * | 2008-03-28 | 2009-10-22 | Disco Abrasive Syst Ltd | ブレード交換工具 |
JP6081868B2 (ja) * | 2013-06-18 | 2017-02-15 | 株式会社ディスコ | 切削装置 |
JP6189135B2 (ja) * | 2013-08-19 | 2017-08-30 | 株式会社ディスコ | ブレード着脱具及びブレードケース |
JP6355441B2 (ja) * | 2014-06-09 | 2018-07-11 | 株式会社ディスコ | ハブブレード用治具及びハブブレードの取り付け方法 |
JP2016020016A (ja) * | 2014-07-14 | 2016-02-04 | 株式会社ディスコ | 工具着脱治具 |
JP6421658B2 (ja) * | 2015-03-13 | 2018-11-14 | 株式会社東京精密 | ブレード自動交換装置及びブレード自動交換方法 |
JP6489963B2 (ja) * | 2015-07-09 | 2019-03-27 | 株式会社ディスコ | ブレード挟持治具 |
JP6560714B2 (ja) * | 2017-06-26 | 2019-08-14 | Towa株式会社 | ブレード交換機構、切断装置およびブレード交換方法 |
JP6934334B2 (ja) * | 2017-06-30 | 2021-09-15 | 株式会社ディスコ | 切削ブレードの装着方法 |
JP6998159B2 (ja) * | 2017-09-07 | 2022-01-18 | 株式会社ディスコ | 切削ブレード供給装置 |
JP7045178B2 (ja) * | 2017-12-13 | 2022-03-31 | 株式会社ディスコ | 切削装置 |
JP7126749B2 (ja) * | 2018-03-19 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
JP7165510B2 (ja) * | 2018-05-25 | 2022-11-04 | 株式会社ディスコ | 搬送用治具及び交換方法 |
JP6657553B2 (ja) * | 2018-10-17 | 2020-03-04 | 株式会社東京精密 | ブレード着脱装置及びブレード着脱方法 |
JP7098581B2 (ja) * | 2019-07-29 | 2022-07-11 | Towa株式会社 | ブレード交換機構、切断装置、及び切断品の製造方法 |
JP7465078B2 (ja) * | 2019-11-27 | 2024-04-10 | 株式会社ディスコ | ブレード把持具 |
JP7504539B2 (ja) * | 2020-05-22 | 2024-06-24 | 株式会社ディスコ | ドレッシング部材 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2355582A (en) * | 1943-03-17 | 1944-08-08 | Edward A Zempel | Counterbore and spot-facer tool |
JPS58154070U (ja) * | 1982-04-09 | 1983-10-14 | 宇部日東化成株式会社 | 引抜き治具 |
JPH0322810U (ja) * | 1989-07-10 | 1991-03-11 | ||
JPH0321855U (ja) * | 1989-07-12 | 1991-03-05 | ||
US5005279A (en) * | 1990-05-18 | 1991-04-09 | Turning, Inc. | Collet insertion and removal device and method |
JPH073952A (ja) | 1993-06-18 | 1995-01-06 | Mino Kagaku Kogyo Kk | 板状屋根葺材の取付工法及び取付構造 |
JP2596633Y2 (ja) * | 1993-06-25 | 1999-06-21 | 株式会社ディスコ | ブレード着脱用治具 |
GB9518674D0 (en) * | 1995-09-13 | 1995-11-15 | Liversidge Barry P | Wire stripper |
US6148493A (en) * | 1998-05-15 | 2000-11-21 | Pixley; Harvey | Pop rivet core punch |
US6415492B1 (en) * | 1999-12-21 | 2002-07-09 | Robert W. Jamison | Truck bushing tool |
JP2004213850A (ja) * | 2002-05-13 | 2004-07-29 | Fuji Photo Film Co Ltd | 磁気ディスクカートリッジ |
US6742421B1 (en) * | 2002-12-11 | 2004-06-01 | Jui-Tung Chen | Screwdriver |
JP4485751B2 (ja) * | 2003-03-14 | 2010-06-23 | 株式会社ディスコ | ブレード着脱補助装置 |
JP4837973B2 (ja) * | 2005-10-13 | 2011-12-14 | 株式会社ディスコ | 切削ブレードの交換装置 |
US7337515B2 (en) * | 2006-01-25 | 2008-03-04 | Breaching Technologies, Inc. | Hybrid breaching bar |
JP5014892B2 (ja) * | 2007-06-25 | 2012-08-29 | 株式会社ディスコ | ブレード交換工具 |
-
2007
- 2007-06-25 JP JP2007166313A patent/JP5014892B2/ja active Active
-
2008
- 2008-04-24 TW TW097115016A patent/TWI408039B/zh active
- 2008-06-03 KR KR1020080052077A patent/KR101344650B1/ko active IP Right Grant
- 2008-06-09 US US12/135,730 patent/US7661183B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016060003A (ja) * | 2014-09-18 | 2016-04-25 | 株式会社ディスコ | ブレード用治具 |
Also Published As
Publication number | Publication date |
---|---|
TWI408039B (zh) | 2013-09-11 |
US20080313875A1 (en) | 2008-12-25 |
JP2009000798A (ja) | 2009-01-08 |
KR20080114511A (ko) | 2008-12-31 |
US7661183B2 (en) | 2010-02-16 |
KR101344650B1 (ko) | 2013-12-26 |
TW200900215A (en) | 2009-01-01 |
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