JP6856444B2 - 配線基板、配線基板の製造方法 - Google Patents

配線基板、配線基板の製造方法 Download PDF

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Publication number
JP6856444B2
JP6856444B2 JP2017095240A JP2017095240A JP6856444B2 JP 6856444 B2 JP6856444 B2 JP 6856444B2 JP 2017095240 A JP2017095240 A JP 2017095240A JP 2017095240 A JP2017095240 A JP 2017095240A JP 6856444 B2 JP6856444 B2 JP 6856444B2
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Japan
Prior art keywords
layer
wiring
wiring layer
metal plate
insulating layer
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JP2017095240A
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English (en)
Japanese (ja)
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JP2018195600A (ja
JP2018195600A5 (enExample
Inventor
哲一郎 笠原
哲一郎 笠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2017095240A priority Critical patent/JP6856444B2/ja
Priority to CN201810380988.7A priority patent/CN108878373B/zh
Priority to US15/964,594 priority patent/US20180331026A1/en
Priority to TW107114766A priority patent/TWI778056B/zh
Publication of JP2018195600A publication Critical patent/JP2018195600A/ja
Publication of JP2018195600A5 publication Critical patent/JP2018195600A5/ja
Priority to US17/162,628 priority patent/US11923282B2/en
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Publication of JP6856444B2 publication Critical patent/JP6856444B2/ja
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    • H10W70/60—
    • H10W70/095—
    • H10W70/20—
    • H10W70/635—
    • H10W70/65—
    • H10W70/05—
    • H10W70/685—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2017095240A 2017-05-12 2017-05-12 配線基板、配線基板の製造方法 Active JP6856444B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017095240A JP6856444B2 (ja) 2017-05-12 2017-05-12 配線基板、配線基板の製造方法
CN201810380988.7A CN108878373B (zh) 2017-05-12 2018-04-25 布线基板、布线基板的制造方法
US15/964,594 US20180331026A1 (en) 2017-05-12 2018-04-27 Wiring substrate
TW107114766A TWI778056B (zh) 2017-05-12 2018-05-01 佈線基板和製造佈線基板的方法
US17/162,628 US11923282B2 (en) 2017-05-12 2021-01-29 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017095240A JP6856444B2 (ja) 2017-05-12 2017-05-12 配線基板、配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2018195600A JP2018195600A (ja) 2018-12-06
JP2018195600A5 JP2018195600A5 (enExample) 2020-01-23
JP6856444B2 true JP6856444B2 (ja) 2021-04-07

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Family Applications (1)

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JP2017095240A Active JP6856444B2 (ja) 2017-05-12 2017-05-12 配線基板、配線基板の製造方法

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US (2) US20180331026A1 (enExample)
JP (1) JP6856444B2 (enExample)
CN (1) CN108878373B (enExample)
TW (1) TWI778056B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7198154B2 (ja) * 2019-05-22 2022-12-28 新光電気工業株式会社 配線基板、及び配線基板の製造方法
KR102737544B1 (ko) * 2019-12-10 2024-12-03 삼성전기주식회사 패키지 기판 및 이를 포함하는 멀티 칩 패키지
CN114864524A (zh) * 2022-06-13 2022-08-05 江阴长电先进封装有限公司 一种再布线层结构以及相应的制造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11298143A (ja) 1998-04-10 1999-10-29 Mitsubishi Gas Chem Co Inc 多層プリント配線板の製造方法
EP1744609B1 (en) * 1999-06-02 2012-12-12 Ibiden Co., Ltd. Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
JP3920590B2 (ja) * 2000-06-19 2007-05-30 株式会社東芝 半導体装置の製造方法
JP3769587B2 (ja) * 2000-11-01 2006-04-26 株式会社ノース 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置
JP3961537B2 (ja) * 2004-07-07 2007-08-22 日本電気株式会社 半導体搭載用配線基板の製造方法、及び半導体パッケージの製造方法
JP5117692B2 (ja) * 2006-07-14 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR100905566B1 (ko) * 2007-04-30 2009-07-02 삼성전기주식회사 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법
JP2009194312A (ja) 2008-02-18 2009-08-27 Kyocer Slc Technologies Corp 配線基板およびその製造方法
JP5289832B2 (ja) * 2008-06-17 2013-09-11 新光電気工業株式会社 半導体装置および半導体装置の製造方法
US8188380B2 (en) 2008-12-29 2012-05-29 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
JP5010669B2 (ja) * 2009-12-07 2012-08-29 パナソニック株式会社 配線基板及びその製造方法
JP5580374B2 (ja) * 2012-08-23 2014-08-27 新光電気工業株式会社 配線基板及びその製造方法
JP5315447B2 (ja) * 2012-09-03 2013-10-16 新光電気工業株式会社 配線基板及びその製造方法
JP6453625B2 (ja) * 2014-11-27 2019-01-16 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP7508312B2 (ja) * 2020-08-27 2024-07-01 新光電気工業株式会社 ループ型ヒートパイプ

Also Published As

Publication number Publication date
CN108878373B (zh) 2023-10-17
CN108878373A (zh) 2018-11-23
TWI778056B (zh) 2022-09-21
TW201901889A (zh) 2019-01-01
JP2018195600A (ja) 2018-12-06
US11923282B2 (en) 2024-03-05
US20210151371A1 (en) 2021-05-20
US20180331026A1 (en) 2018-11-15

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