TWI778056B - 佈線基板和製造佈線基板的方法 - Google Patents

佈線基板和製造佈線基板的方法 Download PDF

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Publication number
TWI778056B
TWI778056B TW107114766A TW107114766A TWI778056B TW I778056 B TWI778056 B TW I778056B TW 107114766 A TW107114766 A TW 107114766A TW 107114766 A TW107114766 A TW 107114766A TW I778056 B TWI778056 B TW I778056B
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TW
Taiwan
Prior art keywords
layer
wiring
insulating layer
hole
metal plate
Prior art date
Application number
TW107114766A
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English (en)
Chinese (zh)
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TW201901889A (zh
Inventor
笠原哲一郎
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日商新光電氣工業股份有限公司
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Publication of TW201901889A publication Critical patent/TW201901889A/zh
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Publication of TWI778056B publication Critical patent/TWI778056B/zh

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    • H10W70/60—
    • H10W70/095—
    • H10W70/20—
    • H10W70/635—
    • H10W70/65—
    • H10W70/05—
    • H10W70/685—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW107114766A 2017-05-12 2018-05-01 佈線基板和製造佈線基板的方法 TWI778056B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-095240 2017-05-12
JP2017095240A JP6856444B2 (ja) 2017-05-12 2017-05-12 配線基板、配線基板の製造方法

Publications (2)

Publication Number Publication Date
TW201901889A TW201901889A (zh) 2019-01-01
TWI778056B true TWI778056B (zh) 2022-09-21

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TW107114766A TWI778056B (zh) 2017-05-12 2018-05-01 佈線基板和製造佈線基板的方法

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US (2) US20180331026A1 (enExample)
JP (1) JP6856444B2 (enExample)
CN (1) CN108878373B (enExample)
TW (1) TWI778056B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7198154B2 (ja) * 2019-05-22 2022-12-28 新光電気工業株式会社 配線基板、及び配線基板の製造方法
KR102737544B1 (ko) * 2019-12-10 2024-12-03 삼성전기주식회사 패키지 기판 및 이를 포함하는 멀티 칩 패키지
CN114864524A (zh) * 2022-06-13 2022-08-05 江阴长电先进封装有限公司 一种再布线层结构以及相应的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828510B1 (en) * 1999-06-02 2004-12-07 Ibiden Co., Ltd. Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
TW200625559A (en) * 2004-07-07 2006-07-16 Nec Corp Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
US20090309231A1 (en) * 2008-06-17 2009-12-17 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing the same
TW201631715A (zh) * 2014-11-27 2016-09-01 新光電氣工業股份有限公司 佈線基板、製造佈線基板之方法及電子組件裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11298143A (ja) 1998-04-10 1999-10-29 Mitsubishi Gas Chem Co Inc 多層プリント配線板の製造方法
JP3920590B2 (ja) * 2000-06-19 2007-05-30 株式会社東芝 半導体装置の製造方法
JP3769587B2 (ja) * 2000-11-01 2006-04-26 株式会社ノース 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置
JP5117692B2 (ja) * 2006-07-14 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR100905566B1 (ko) * 2007-04-30 2009-07-02 삼성전기주식회사 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법
JP2009194312A (ja) 2008-02-18 2009-08-27 Kyocer Slc Technologies Corp 配線基板およびその製造方法
US8188380B2 (en) 2008-12-29 2012-05-29 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
JP5010669B2 (ja) * 2009-12-07 2012-08-29 パナソニック株式会社 配線基板及びその製造方法
JP5580374B2 (ja) * 2012-08-23 2014-08-27 新光電気工業株式会社 配線基板及びその製造方法
JP5315447B2 (ja) * 2012-09-03 2013-10-16 新光電気工業株式会社 配線基板及びその製造方法
JP7508312B2 (ja) * 2020-08-27 2024-07-01 新光電気工業株式会社 ループ型ヒートパイプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828510B1 (en) * 1999-06-02 2004-12-07 Ibiden Co., Ltd. Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
TW200625559A (en) * 2004-07-07 2006-07-16 Nec Corp Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
US20090309231A1 (en) * 2008-06-17 2009-12-17 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing the same
TW201631715A (zh) * 2014-11-27 2016-09-01 新光電氣工業股份有限公司 佈線基板、製造佈線基板之方法及電子組件裝置

Also Published As

Publication number Publication date
JP6856444B2 (ja) 2021-04-07
CN108878373B (zh) 2023-10-17
CN108878373A (zh) 2018-11-23
TW201901889A (zh) 2019-01-01
JP2018195600A (ja) 2018-12-06
US11923282B2 (en) 2024-03-05
US20210151371A1 (en) 2021-05-20
US20180331026A1 (en) 2018-11-15

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