CN108878373B - 布线基板、布线基板的制造方法 - Google Patents

布线基板、布线基板的制造方法 Download PDF

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Publication number
CN108878373B
CN108878373B CN201810380988.7A CN201810380988A CN108878373B CN 108878373 B CN108878373 B CN 108878373B CN 201810380988 A CN201810380988 A CN 201810380988A CN 108878373 B CN108878373 B CN 108878373B
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China
Prior art keywords
layer
wiring
metal plate
insulating layer
wiring layer
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CN201810380988.7A
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Chinese (zh)
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CN108878373A (zh
Inventor
笠原哲一郎
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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    • H10W70/60—
    • H10W70/095—
    • H10W70/20—
    • H10W70/635—
    • H10W70/65—
    • H10W70/05—
    • H10W70/685—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201810380988.7A 2017-05-12 2018-04-25 布线基板、布线基板的制造方法 Active CN108878373B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-095240 2017-05-12
JP2017095240A JP6856444B2 (ja) 2017-05-12 2017-05-12 配線基板、配線基板の製造方法

Publications (2)

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CN108878373A CN108878373A (zh) 2018-11-23
CN108878373B true CN108878373B (zh) 2023-10-17

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CN201810380988.7A Active CN108878373B (zh) 2017-05-12 2018-04-25 布线基板、布线基板的制造方法

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US (2) US20180331026A1 (enExample)
JP (1) JP6856444B2 (enExample)
CN (1) CN108878373B (enExample)
TW (1) TWI778056B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7198154B2 (ja) * 2019-05-22 2022-12-28 新光電気工業株式会社 配線基板、及び配線基板の製造方法
KR102737544B1 (ko) * 2019-12-10 2024-12-03 삼성전기주식회사 패키지 기판 및 이를 포함하는 멀티 칩 패키지
CN114864524A (zh) * 2022-06-13 2022-08-05 江阴长电先进封装有限公司 一种再布线层结构以及相应的制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141629A (ja) * 2000-11-01 2002-05-17 North:Kk 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置
JP2009302476A (ja) * 2008-06-17 2009-12-24 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
JP2012235166A (ja) * 2012-08-23 2012-11-29 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2012248891A (ja) * 2012-09-03 2012-12-13 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2013062546A (ja) * 2007-04-30 2013-04-04 Samsung Electro-Mechanics Co Ltd 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11298143A (ja) 1998-04-10 1999-10-29 Mitsubishi Gas Chem Co Inc 多層プリント配線板の製造方法
EP1744609B1 (en) * 1999-06-02 2012-12-12 Ibiden Co., Ltd. Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
JP3920590B2 (ja) * 2000-06-19 2007-05-30 株式会社東芝 半導体装置の製造方法
JP3961537B2 (ja) * 2004-07-07 2007-08-22 日本電気株式会社 半導体搭載用配線基板の製造方法、及び半導体パッケージの製造方法
JP5117692B2 (ja) * 2006-07-14 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2009194312A (ja) 2008-02-18 2009-08-27 Kyocer Slc Technologies Corp 配線基板およびその製造方法
US8188380B2 (en) 2008-12-29 2012-05-29 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
JP5010669B2 (ja) * 2009-12-07 2012-08-29 パナソニック株式会社 配線基板及びその製造方法
JP6453625B2 (ja) * 2014-11-27 2019-01-16 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP7508312B2 (ja) * 2020-08-27 2024-07-01 新光電気工業株式会社 ループ型ヒートパイプ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141629A (ja) * 2000-11-01 2002-05-17 North:Kk 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置
JP2013062546A (ja) * 2007-04-30 2013-04-04 Samsung Electro-Mechanics Co Ltd 回路転写用キャリア部材、これを用いたコアレスプリント基板、及びその製造方法
JP2009302476A (ja) * 2008-06-17 2009-12-24 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
JP2012235166A (ja) * 2012-08-23 2012-11-29 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2012248891A (ja) * 2012-09-03 2012-12-13 Shinko Electric Ind Co Ltd 配線基板及びその製造方法

Also Published As

Publication number Publication date
JP6856444B2 (ja) 2021-04-07
CN108878373A (zh) 2018-11-23
TWI778056B (zh) 2022-09-21
TW201901889A (zh) 2019-01-01
JP2018195600A (ja) 2018-12-06
US11923282B2 (en) 2024-03-05
US20210151371A1 (en) 2021-05-20
US20180331026A1 (en) 2018-11-15

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