JP6816046B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP6816046B2
JP6816046B2 JP2018019434A JP2018019434A JP6816046B2 JP 6816046 B2 JP6816046 B2 JP 6816046B2 JP 2018019434 A JP2018019434 A JP 2018019434A JP 2018019434 A JP2018019434 A JP 2018019434A JP 6816046 B2 JP6816046 B2 JP 6816046B2
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Prior art keywords
support substrate
manufacturing
semiconductor device
layer
peripheral portion
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Japanese (ja)
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JP2019140150A5 (enExample
JP2019140150A (ja
Inventor
河野　一郎
一郎 河野
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Aoi Electronics Co Ltd
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Aoi Electronics Co Ltd
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Priority to JP2018019434A priority Critical patent/JP6816046B2/ja
Application filed by Aoi Electronics Co Ltd filed Critical Aoi Electronics Co Ltd
Priority to CN201980011621.0A priority patent/CN111684585A/zh
Priority to KR1020207019198A priority patent/KR102407800B1/ko
Priority to US16/967,480 priority patent/US11521948B2/en
Priority to PCT/JP2019/003169 priority patent/WO2019155959A1/ja
Priority to TW108104296A priority patent/TWI802648B/zh
Publication of JP2019140150A publication Critical patent/JP2019140150A/ja
Publication of JP2019140150A5 publication Critical patent/JP2019140150A5/ja
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  • Engineering & Computer Science (AREA)
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