TWI802648B - 半導體裝置之製造方法 - Google Patents

半導體裝置之製造方法 Download PDF

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Publication number
TWI802648B
TWI802648B TW108104296A TW108104296A TWI802648B TW I802648 B TWI802648 B TW I802648B TW 108104296 A TW108104296 A TW 108104296A TW 108104296 A TW108104296 A TW 108104296A TW I802648 B TWI802648 B TW I802648B
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Taiwan
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layer
support substrate
semiconductor device
manufacturing
substrate
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TW108104296A
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English (en)
Chinese (zh)
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TW201935576A (zh
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河野一郎
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日商青井電子股份有限公司
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Bipolar Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
TW108104296A 2018-02-06 2019-02-01 半導體裝置之製造方法 TWI802648B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018-019434 2018-02-06
JPJP2018-019434 2018-02-06
JP2018019434A JP6816046B2 (ja) 2018-02-06 2018-02-06 半導体装置の製造方法
WOPCT/JP2019/003169 2019-01-30
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