CN111684585A - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN111684585A
CN111684585A CN201980011621.0A CN201980011621A CN111684585A CN 111684585 A CN111684585 A CN 111684585A CN 201980011621 A CN201980011621 A CN 201980011621A CN 111684585 A CN111684585 A CN 111684585A
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layer
support substrate
semiconductor device
manufacturing
substrate
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CN201980011621.0A
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Chinese (zh)
Inventor
河野一郎
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Aoi Electronics Co Ltd
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Aoi Electronics Co Ltd
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Bipolar Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
CN201980011621.0A 2018-02-06 2019-01-30 半导体装置的制造方法 Withdrawn CN111684585A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018019434A JP6816046B2 (ja) 2018-02-06 2018-02-06 半導体装置の製造方法
JP2018-019434 2018-02-06
PCT/JP2019/003169 WO2019155959A1 (ja) 2018-02-06 2019-01-30 半導体装置の製造方法

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