JP6766758B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP6766758B2
JP6766758B2 JP2017117856A JP2017117856A JP6766758B2 JP 6766758 B2 JP6766758 B2 JP 6766758B2 JP 2017117856 A JP2017117856 A JP 2017117856A JP 2017117856 A JP2017117856 A JP 2017117856A JP 6766758 B2 JP6766758 B2 JP 6766758B2
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Prior art keywords
groove portion
substrate
back surface
surface side
semiconductor device
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JP2017117856A
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English (en)
Japanese (ja)
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JP2019004053A (ja
JP2019004053A5 (enExample
Inventor
駿太郎 山田
駿太郎 山田
明典 神田
明典 神田
テツヲ 吉岡
テツヲ 吉岡
高成 長尾
高成 長尾
耕一 宮下
耕一 宮下
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Denso Corp
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Denso Corp
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Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2017117856A priority Critical patent/JP6766758B2/ja
Priority to PCT/JP2018/020005 priority patent/WO2018230297A1/ja
Priority to CN201880037037.8A priority patent/CN110709965B/zh
Publication of JP2019004053A publication Critical patent/JP2019004053A/ja
Publication of JP2019004053A5 publication Critical patent/JP2019004053A5/ja
Priority to US16/662,329 priority patent/US11145515B2/en
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Publication of JP6766758B2 publication Critical patent/JP6766758B2/ja
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    • H—ELECTRICITY
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    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2017117856A 2017-06-15 2017-06-15 半導体装置およびその製造方法 Active JP6766758B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017117856A JP6766758B2 (ja) 2017-06-15 2017-06-15 半導体装置およびその製造方法
PCT/JP2018/020005 WO2018230297A1 (ja) 2017-06-15 2018-05-24 半導体装置およびその製造方法
CN201880037037.8A CN110709965B (zh) 2017-06-15 2018-05-24 半导体装置及其制造方法
US16/662,329 US11145515B2 (en) 2017-06-15 2019-10-24 Manufacturing method of semiconductor device with attached film

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Application Number Priority Date Filing Date Title
JP2017117856A JP6766758B2 (ja) 2017-06-15 2017-06-15 半導体装置およびその製造方法

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JP2019004053A JP2019004053A (ja) 2019-01-10
JP2019004053A5 JP2019004053A5 (enExample) 2019-09-26
JP6766758B2 true JP6766758B2 (ja) 2020-10-14

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JP (1) JP6766758B2 (enExample)
CN (1) CN110709965B (enExample)
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