CN110709965B - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN110709965B
CN110709965B CN201880037037.8A CN201880037037A CN110709965B CN 110709965 B CN110709965 B CN 110709965B CN 201880037037 A CN201880037037 A CN 201880037037A CN 110709965 B CN110709965 B CN 110709965B
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substrate
side groove
groove
semiconductor device
forming
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Chinese (zh)
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CN110709965A (zh
Inventor
山田骏太郎
神田明典
吉冈彻雄
长尾高成
宫下耕一
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Die Bonding (AREA)
CN201880037037.8A 2017-06-15 2018-05-24 半导体装置及其制造方法 Active CN110709965B (zh)

Applications Claiming Priority (3)

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JP2017-117856 2017-06-15
JP2017117856A JP6766758B2 (ja) 2017-06-15 2017-06-15 半導体装置およびその製造方法
PCT/JP2018/020005 WO2018230297A1 (ja) 2017-06-15 2018-05-24 半導体装置およびその製造方法

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CN110709965B true CN110709965B (zh) 2023-05-02

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Publication number Priority date Publication date Assignee Title
JP7306859B2 (ja) * 2019-04-09 2023-07-11 株式会社ディスコ 透明板の加工方法
JP7339819B2 (ja) * 2019-09-04 2023-09-06 株式会社東芝 半導体装置の製造方法および半導体装置
JP7497989B2 (ja) * 2020-02-14 2024-06-11 株式会社ディスコ 半導体チップの製造方法、及び、半導体チップ
JP7696225B2 (ja) * 2021-04-07 2025-06-20 株式会社ディスコ 加工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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