JP5882154B2 - 弾性波デバイスの製造方法 - Google Patents
弾性波デバイスの製造方法 Download PDFInfo
- Publication number
- JP5882154B2 JP5882154B2 JP2012160358A JP2012160358A JP5882154B2 JP 5882154 B2 JP5882154 B2 JP 5882154B2 JP 2012160358 A JP2012160358 A JP 2012160358A JP 2012160358 A JP2012160358 A JP 2012160358A JP 5882154 B2 JP5882154 B2 JP 5882154B2
- Authority
- JP
- Japan
- Prior art keywords
- distance
- modified
- interface
- support substrate
- piezoelectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 86
- 238000005520 cutting process Methods 0.000 claims description 18
- 229910052594 sapphire Inorganic materials 0.000 claims description 6
- 239000010980 sapphire Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005336 cracking Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 2
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
Description
12 圧電基板
13 界面
14 IDT
16 端子
30、30a 改質層
32、32a、32b、32c 改質領域
34 端部
Claims (3)
- サファイアにより形成された支持基板と、IDTが形成されるタンタル酸リチウムにより形成された圧電基板とを接合する工程と、
レーザー光を照射することにより、前記支持基板と前記圧電基板とのうち前記支持基板のみに前記支持基板の厚さ方向に沿って複数の改質領域を形成する工程と、
前記改質領域において、前記支持基板と前記圧電基板とを切断する工程と、を有し、
前記支持基板と前記圧電基板との界面と、前記複数の改質領域のうち前記界面に最も近い改質領域の前記界面側の端部との距離は20μm以上、69μm未満であることを特徴とする弾性波デバイスの製造方法。 - 前記改質領域を形成する工程は、前記レーザー光の出力が高いほど前記界面から遠い位置に前記レーザー光を照射することにより、前記改質領域を形成する工程であることを特徴とする請求項1記載の弾性波デバイスの製造方法。
- 前記界面と前記界面に最も近い改質領域の端部との距離は、28μm以上、60μm以下であることを特徴とする請求項1または2記載の弾性波デバイスの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012160358A JP5882154B2 (ja) | 2012-07-19 | 2012-07-19 | 弾性波デバイスの製造方法 |
US13/942,951 US9590170B2 (en) | 2012-07-19 | 2013-07-16 | Method of fabricating acoustic wave device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012160358A JP5882154B2 (ja) | 2012-07-19 | 2012-07-19 | 弾性波デバイスの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014022966A JP2014022966A (ja) | 2014-02-03 |
JP5882154B2 true JP5882154B2 (ja) | 2016-03-09 |
Family
ID=49945550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012160358A Active JP5882154B2 (ja) | 2012-07-19 | 2012-07-19 | 弾性波デバイスの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9590170B2 (ja) |
JP (1) | JP5882154B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6336817B2 (ja) * | 2014-05-12 | 2018-06-06 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
JP2016100729A (ja) * | 2014-11-20 | 2016-05-30 | 太陽誘電株式会社 | 弾性波デバイスの製造方法 |
JP6625926B2 (ja) * | 2016-04-13 | 2019-12-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP2018042208A (ja) * | 2016-09-09 | 2018-03-15 | 株式会社ディスコ | 表面弾性波デバイスチップの製造方法 |
US10938372B2 (en) | 2018-05-17 | 2021-03-02 | Taiyo Yuden Co., Ltd. | Acoustic wave resonator, acoustic wave device, and filter |
CN110138356B (zh) * | 2019-06-28 | 2020-11-06 | 中国科学院上海微系统与信息技术研究所 | 一种高频声表面波谐振器及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002009583A (ja) * | 2000-06-26 | 2002-01-11 | Matsushita Electric Ind Co Ltd | 圧電デバイス及びその製造方法 |
JP4050534B2 (ja) * | 2002-03-12 | 2008-02-20 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP2004336503A (ja) * | 2003-05-09 | 2004-11-25 | Fujitsu Media Device Kk | 弾性表面波素子及びその製造方法 |
JP2007130768A (ja) * | 2005-11-08 | 2007-05-31 | Seiko Epson Corp | 水晶基板の切断方法 |
JP2007281598A (ja) * | 2006-04-03 | 2007-10-25 | Epson Toyocom Corp | 圧電デバイスの製造方法 |
JP5232375B2 (ja) * | 2006-10-13 | 2013-07-10 | アイシン精機株式会社 | 半導体発光素子の分離方法 |
JP2010183138A (ja) * | 2009-02-03 | 2010-08-19 | Seiko Epson Corp | 音叉型水晶振動片の製造方法 |
BR122019015544B1 (pt) * | 2009-02-25 | 2020-12-22 | Nichia Corporation | método para fabricar um elemento semicondutor, e, elemento semicondutor |
JP2010212832A (ja) | 2009-03-09 | 2010-09-24 | Panasonic Corp | 弾性表面波デバイスの製造方法 |
JP5338396B2 (ja) * | 2009-03-12 | 2013-11-13 | パナソニック株式会社 | 弾性表面波デバイスの製造方法 |
JP5707889B2 (ja) * | 2010-11-16 | 2015-04-30 | 株式会社東京精密 | 半導体基板の切断方法及び半導体基板の切断装置 |
-
2012
- 2012-07-19 JP JP2012160358A patent/JP5882154B2/ja active Active
-
2013
- 2013-07-16 US US13/942,951 patent/US9590170B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014022966A (ja) | 2014-02-03 |
US20140020822A1 (en) | 2014-01-23 |
US9590170B2 (en) | 2017-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5882154B2 (ja) | 弾性波デバイスの製造方法 | |
JP6336817B2 (ja) | 弾性波デバイス及びその製造方法 | |
WO2006051861A1 (ja) | レーザ加工方法 | |
US9099546B2 (en) | Workpiece dividing method including two laser beam application steps | |
US8329561B2 (en) | Method of producing semiconductor device | |
JP2008147412A (ja) | 半導体ウェハ,半導体装置及び半導体ウェハの製造方法ならびに半導体装置の製造方法 | |
JP2004336503A (ja) | 弾性表面波素子及びその製造方法 | |
JP2010016361A (ja) | 半導体チップの製造方法および半導体装置 | |
JP6810599B2 (ja) | 電子部品およびその製造方法 | |
JP2016100729A (ja) | 弾性波デバイスの製造方法 | |
US10291196B2 (en) | Method for manufacturing an acoustic wave device | |
JP5882053B2 (ja) | 弾性波デバイスの製造方法 | |
WO2014167745A1 (ja) | 半導体装置、半導体装置の製造方法 | |
KR102586503B1 (ko) | 레이저 가공 방법 및 레이저 가공 장치 | |
US20230225215A1 (en) | Acoustic wave device | |
WO2018230297A1 (ja) | 半導体装置およびその製造方法 | |
WO2010050085A1 (ja) | 半導体ウェハ及びその分割方法 | |
JP2010212832A (ja) | 弾性表面波デバイスの製造方法 | |
JP4553878B2 (ja) | 半導体装置の製造方法 | |
JP7042195B2 (ja) | 電子部品及び電子部品の製造方法 | |
CN113634878A (zh) | 用于激光切割多层材料的光学系统和方法 | |
JP7382707B2 (ja) | 弾性波デバイスの製造方法 | |
JP7476991B2 (ja) | 半導体装置と半導体装置の製造方法 | |
JP2009208136A (ja) | 半導体チップの製造方法 | |
TW201923860A (zh) | 層疊型元件的製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141125 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151113 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151224 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160126 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160203 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5882154 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |