JP6704083B1 - 銅粉体とその製造方法 - Google Patents
銅粉体とその製造方法 Download PDFInfo
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- JP6704083B1 JP6704083B1 JP2019211359A JP2019211359A JP6704083B1 JP 6704083 B1 JP6704083 B1 JP 6704083B1 JP 2019211359 A JP2019211359 A JP 2019211359A JP 2019211359 A JP2019211359 A JP 2019211359A JP 6704083 B1 JP6704083 B1 JP 6704083B1
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- Prior art keywords
- copper
- copper powder
- gas
- powder
- temperature
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 175
- 238000004519 manufacturing process Methods 0.000 title abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 67
- 238000005245 sintering Methods 0.000 claims abstract description 51
- 238000007872 degassing Methods 0.000 claims abstract description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 22
- 238000010586 diagram Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 60
- 229910052802 copper Inorganic materials 0.000 description 60
- 239000007789 gas Substances 0.000 description 56
- 238000000034 method Methods 0.000 description 41
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 21
- 239000000843 powder Substances 0.000 description 20
- 239000010408 film Substances 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 10
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 10
- 239000000460 chlorine Substances 0.000 description 10
- 229910052801 chlorine Inorganic materials 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 238000006722 reduction reaction Methods 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 229910052726 zirconium Inorganic materials 0.000 description 7
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000012756 surface treatment agent Substances 0.000 description 6
- 238000001947 vapour-phase growth Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000001569 carbon dioxide Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005660 chlorination reaction Methods 0.000 description 4
- 238000003795 desorption Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- -1 nitrogen-containing heteroaromatic compound Chemical class 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000011668 ascorbic acid Substances 0.000 description 3
- 229960005070 ascorbic acid Drugs 0.000 description 3
- 235000010323 ascorbic acid Nutrition 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007873 sieving Methods 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910001868 water Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010332 dry classification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000010333 wet classification Methods 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004868 gas analysis Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019211359A JP6704083B1 (ja) | 2019-11-22 | 2019-11-22 | 銅粉体とその製造方法 |
KR1020227013850A KR20220070003A (ko) | 2019-11-22 | 2020-11-12 | 구리 분체 및 그 제조 방법 |
CN202080073528.5A CN114786839B (zh) | 2019-11-22 | 2020-11-12 | 铜粉体及其制造方法 |
PCT/JP2020/042217 WO2021100595A1 (ja) | 2019-11-22 | 2020-11-12 | 銅粉体とその製造方法 |
TW109140799A TWI763135B (zh) | 2019-11-22 | 2020-11-20 | 銅粉體 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019211359A JP6704083B1 (ja) | 2019-11-22 | 2019-11-22 | 銅粉体とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6704083B1 true JP6704083B1 (ja) | 2020-06-03 |
JP2021080549A JP2021080549A (ja) | 2021-05-27 |
Family
ID=70858249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019211359A Active JP6704083B1 (ja) | 2019-11-22 | 2019-11-22 | 銅粉体とその製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6704083B1 (zh) |
KR (1) | KR20220070003A (zh) |
CN (1) | CN114786839B (zh) |
TW (1) | TWI763135B (zh) |
WO (1) | WO2021100595A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7498604B2 (ja) | 2020-06-26 | 2024-06-12 | 東邦チタニウム株式会社 | 銅粉の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023074827A1 (ja) * | 2021-10-28 | 2023-05-04 | 三井金属鉱業株式会社 | 銅粒子及びその製造方法 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01162701A (ja) * | 1987-12-18 | 1989-06-27 | Kawasaki Steel Corp | 銅超微粉の精製方法 |
JPH07112562B2 (ja) * | 1991-02-26 | 1995-12-06 | 川崎製鉄株式会社 | 縞鋼板の形状改善方法 |
JP3102574B2 (ja) * | 1991-03-04 | 2000-10-23 | 川崎製鉄株式会社 | 金属超微粉および微粉の精製方法 |
JP3130676B2 (ja) * | 1992-09-03 | 2001-01-31 | 三井金属鉱業株式会社 | バイヤホール充填用銅微粉末 |
JP3492672B1 (ja) * | 2002-05-29 | 2004-02-03 | 東邦チタニウム株式会社 | 金属粉末の製造方法及び製造装置 |
JP2004124257A (ja) * | 2002-09-11 | 2004-04-22 | Sumitomo Metal Mining Co Ltd | 金属銅微粒子及びその製造方法 |
JP4204849B2 (ja) | 2002-11-12 | 2009-01-07 | Dowaエレクトロニクス株式会社 | 微粒子銅粉の製法 |
JP4894266B2 (ja) * | 2006-01-06 | 2012-03-14 | 住友金属鉱山株式会社 | 導電粉の表面処理方法と導電粉及び導電性ペースト |
JP5392884B2 (ja) * | 2007-09-21 | 2014-01-22 | 三井金属鉱業株式会社 | 銅粉の製造方法 |
JP2014034697A (ja) * | 2012-08-08 | 2014-02-24 | Furukawa Co Ltd | 銅微粒子の製造方法、導電性ペーストおよび導電性ペーストの製造方法 |
EP2923781A4 (en) * | 2012-11-26 | 2016-07-13 | Mitsui Mining & Smelting Co | COPPER POWDER AND PROCESS FOR PRODUCING THE SAME |
JP5986046B2 (ja) | 2013-08-13 | 2016-09-06 | Jx金属株式会社 | 表面処理された金属粉、及びその製造方法 |
CN105705276B (zh) * | 2014-02-14 | 2018-01-19 | 三井金属矿业株式会社 | 铜粉 |
JP5941082B2 (ja) * | 2014-03-10 | 2016-06-29 | 三井金属鉱業株式会社 | 銅粉 |
KR101628872B1 (ko) | 2014-05-28 | 2016-06-09 | 주식회사 레고켐 바이오사이언스 | 자가-희생 기를 포함하는 화합물 |
JP2016108649A (ja) | 2014-11-26 | 2016-06-20 | 住友金属鉱山株式会社 | 銀コート銅粉及びその製造方法 |
JP6539085B2 (ja) * | 2015-03-31 | 2019-07-03 | Dowaエレクトロニクス株式会社 | 銅粉およびその製造法 |
JP2017039990A (ja) * | 2015-08-21 | 2017-02-23 | 住友金属鉱山株式会社 | 銅粉とその製造方法、及びそれを用いた導電性ペースト |
FR3045731B1 (fr) * | 2015-12-17 | 2018-02-02 | Safran Nacelles | Tuyere variable semi fluidique |
JP6762718B2 (ja) * | 2016-01-05 | 2020-09-30 | Dowaエレクトロニクス株式会社 | 表面処理銅粉およびその製造方法 |
JP2017137530A (ja) * | 2016-02-03 | 2017-08-10 | 住友金属鉱山株式会社 | 銅粉及びその製造方法 |
JP6842836B2 (ja) * | 2016-02-29 | 2021-03-17 | 三井金属鉱業株式会社 | 銅ペースト及び銅の焼結体の製造方法 |
JP6631352B2 (ja) * | 2016-03-23 | 2020-01-15 | 東洋インキScホールディングス株式会社 | 反応物、導電性組成物、および、表面処理銅粉の製造方法 |
JP6967839B2 (ja) * | 2016-03-23 | 2021-11-17 | 日東電工株式会社 | 加熱接合用シート、ダイシングテープ付き加熱接合用シート、及び、接合体の製造方法、パワー半導体装置 |
JP6630208B2 (ja) * | 2016-03-28 | 2020-01-15 | Jxtgエネルギー株式会社 | 金属粉ペーストの製造方法、金属粉ペーストのスクリーン印刷方法、電極の製造方法、チップ積層セラミックコンデンサーの製造方法および金属粉ペースト |
JP6857453B2 (ja) * | 2016-05-20 | 2021-04-14 | 京セラ株式会社 | 銅微粒子の製造方法、銅微粒子、ペースト組成物、半導体装置及び電気・電子部品 |
JP7039126B2 (ja) * | 2016-12-28 | 2022-03-22 | Dowaエレクトロニクス株式会社 | 銅粉およびその製造方法 |
KR102403998B1 (ko) * | 2017-03-31 | 2022-05-31 | 미쓰이금속광업주식회사 | 구리 입자 및 그 제조 방법 |
KR20200026274A (ko) * | 2017-07-04 | 2020-03-10 | 가부시키가이샤 야쿠르트 혼샤 | 갈락토올리고당의 제조 방법 |
CN110799285B (zh) * | 2017-07-05 | 2022-04-29 | 东邦钛株式会社 | 金属粉末及其制造方法 |
JP7035455B2 (ja) * | 2017-10-31 | 2022-03-15 | 株式会社豊田自動織機 | 車載電気機器用のカバー及びその製造方法 |
JP6541764B2 (ja) | 2017-12-27 | 2019-07-10 | Dowaエレクトロニクス株式会社 | 銀被覆銅粉および導電ペースト、並びにそれらの製造方法 |
KR102445498B1 (ko) * | 2018-03-30 | 2022-09-21 | 도호 티타늄 가부시키가이샤 | 금속 염화물 생성 장치 및 금속 분체의 제조 방법 |
JP7029341B2 (ja) * | 2018-04-13 | 2022-03-03 | Jx金属株式会社 | 銅粉 |
JP6787364B2 (ja) * | 2018-05-16 | 2020-11-18 | 株式会社村田製作所 | 導電性ペースト |
JP7131099B2 (ja) * | 2018-06-06 | 2022-09-06 | 株式会社デンソー | 光学的測距装置およびその方法 |
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JP7498604B2 (ja) | 2020-06-26 | 2024-06-12 | 東邦チタニウム株式会社 | 銅粉の製造方法 |
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