JP6556735B2 - 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物 - Google Patents

反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物 Download PDF

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JP6556735B2
JP6556735B2 JP2016545456A JP2016545456A JP6556735B2 JP 6556735 B2 JP6556735 B2 JP 6556735B2 JP 2016545456 A JP2016545456 A JP 2016545456A JP 2016545456 A JP2016545456 A JP 2016545456A JP 6556735 B2 JP6556735 B2 JP 6556735B2
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resin composition
compound
active energy
energy ray
reactive
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JPWO2016031643A1 (ja
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山本 和義
和義 山本
大地 土方
大地 土方
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
JP2016545456A 2014-08-26 2015-08-19 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物 Active JP6556735B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014171375 2014-08-26
JP2014171375 2014-08-26
PCT/JP2015/073218 WO2016031643A1 (ja) 2014-08-26 2015-08-19 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物

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JPWO2016031643A1 JPWO2016031643A1 (ja) 2017-06-08
JP6556735B2 true JP6556735B2 (ja) 2019-08-07

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JP2016545456A Active JP6556735B2 (ja) 2014-08-26 2015-08-19 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物

Country Status (5)

Country Link
JP (1) JP6556735B2 (ko)
KR (1) KR102228850B1 (ko)
CN (1) CN106604947B (ko)
TW (1) TWI662054B (ko)
WO (1) WO2016031643A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022009948A1 (ja) * 2020-07-08 2022-01-13 三菱瓦斯化学株式会社 リソグラフィー膜形成用組成物、レジストパターン形成方法、及び回路パターン形成方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026439A (ja) * 2016-12-22 2020-02-20 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物および硬化物
US10487077B1 (en) 2018-06-14 2019-11-26 Sabic Global Technologies B.V. Bis(benzoxazinyl)phthalimidine and associated curable composition and composite
CN110951047B (zh) * 2019-11-22 2022-06-10 张家港康得新光电材料有限公司 改性环氧丙烯酸酯树脂及其制备方法

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CH496021A (de) * 1966-03-10 1970-09-15 Ciba Geigy Verfahren zur Herstellung von neuen Polyglycidyläthern
JPS4512131B1 (ko) * 1967-03-10 1970-05-02
JPS5640329A (en) 1979-09-12 1981-04-16 Sharp Corp Control unit
JPS5745795A (en) 1980-09-01 1982-03-15 Fujitsu Ltd Scanning device
JP2575572Y2 (ja) 1992-08-27 1998-07-02 株式会社ミツバ ワイパ装置
JPH11140144A (ja) 1997-11-04 1999-05-25 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP5273762B2 (ja) * 2007-01-26 2013-08-28 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
KR101482028B1 (ko) * 2007-08-21 2015-01-13 니폰 가야꾸 가부시끼가이샤 반응성 카르복실레이트 화합물, 이를 이용한 활성 에너지선 경화형 수지 조성물 및 그 용도
JPWO2011114687A1 (ja) * 2010-03-15 2013-06-27 住友ベークライト株式会社 半導体封止用樹脂組成物およびこれを用いた半導体装置
JPWO2011142466A1 (ja) * 2010-05-14 2013-08-29 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
KR101323562B1 (ko) * 2011-03-10 2013-10-29 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물, 이를 이용한 저유전율 차광층 및 액정 디스플레이 장치
KR101349622B1 (ko) * 2011-08-26 2014-01-10 롬엔드하스전자재료코리아유한회사 광중합성 불포화 수지, 이를 포함하는 감광성 수지 조성물 및 이로부터 형성되는 차광성 스페이서와 액정 디스플레이 장치
WO2013183736A1 (ja) * 2012-06-07 2013-12-12 日本化薬株式会社 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物
CN104470965B9 (zh) 2012-06-07 2019-01-01 日本化药株式会社 环氧树脂、环氧树脂组合物及固化物
CN103497287A (zh) * 2013-09-09 2014-01-08 华东理工大学华昌聚合物有限公司 一种smc/bmc用环氧乙烯基酯树脂的合成工艺
KR20160053907A (ko) * 2013-09-10 2016-05-13 닛뽄 가야쿠 가부시키가이샤 에폭시 수지 혼합물, 에폭시 수지 조성물, 경화물 및 반도체 장치
CN103616798B (zh) * 2013-11-20 2016-03-30 盐城艾肯科技有限公司 一种具有阻燃性能的感光树脂及其在生产感光油墨的应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022009948A1 (ja) * 2020-07-08 2022-01-13 三菱瓦斯化学株式会社 リソグラフィー膜形成用組成物、レジストパターン形成方法、及び回路パターン形成方法

Also Published As

Publication number Publication date
TWI662054B (zh) 2019-06-11
CN106604947B (zh) 2019-08-06
JPWO2016031643A1 (ja) 2017-06-08
CN106604947A (zh) 2017-04-26
TW201609850A (zh) 2016-03-16
KR102228850B1 (ko) 2021-03-17
KR20170046126A (ko) 2017-04-28
WO2016031643A1 (ja) 2016-03-03

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