JP6506680B2 - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

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Publication number
JP6506680B2
JP6506680B2 JP2015219978A JP2015219978A JP6506680B2 JP 6506680 B2 JP6506680 B2 JP 6506680B2 JP 2015219978 A JP2015219978 A JP 2015219978A JP 2015219978 A JP2015219978 A JP 2015219978A JP 6506680 B2 JP6506680 B2 JP 6506680B2
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Japan
Prior art keywords
substrate
resin
resin sealing
molding
mold
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Active
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JP2015219978A
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English (en)
Japanese (ja)
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JP2017087551A (ja
Inventor
高瀬　慎二
慎二 高瀬
田村　孝司
孝司 田村
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Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2015219978A priority Critical patent/JP6506680B2/ja
Application filed by Towa Corp filed Critical Towa Corp
Priority to CN201680053681.5A priority patent/CN108025466B/zh
Priority to CN202310498021.XA priority patent/CN116435200A/zh
Priority to KR1020207023465A priority patent/KR102228644B1/ko
Priority to CN202010234428.8A priority patent/CN111403303B/zh
Priority to KR1020187016324A priority patent/KR102192732B1/ko
Priority to PCT/JP2016/069186 priority patent/WO2017081883A1/ja
Priority to TW105130449A priority patent/TWI617419B/zh
Publication of JP2017087551A publication Critical patent/JP2017087551A/ja
Application granted granted Critical
Publication of JP6506680B2 publication Critical patent/JP6506680B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2015219978A 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法 Active JP6506680B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2015219978A JP6506680B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法
CN202310498021.XA CN116435200A (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法
KR1020207023465A KR102228644B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법
CN202010234428.8A CN111403303B (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法
CN201680053681.5A CN108025466B (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法
KR1020187016324A KR102192732B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법
PCT/JP2016/069186 WO2017081883A1 (ja) 2015-11-09 2016-06-28 樹脂封止装置及び樹脂封止方法
TW105130449A TWI617419B (zh) 2015-11-09 2016-09-21 Resin packaging device and resin packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015219978A JP6506680B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
JP2017087551A JP2017087551A (ja) 2017-05-25
JP6506680B2 true JP6506680B2 (ja) 2019-04-24

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JP2015219978A Active JP6506680B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法

Country Status (5)

Country Link
JP (1) JP6506680B2 (zh)
KR (2) KR102192732B1 (zh)
CN (3) CN108025466B (zh)
TW (1) TWI617419B (zh)
WO (1) WO2017081883A1 (zh)

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JP6541746B2 (ja) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6861609B2 (ja) * 2017-10-30 2021-04-21 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6876637B2 (ja) * 2018-01-22 2021-05-26 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP6998252B2 (ja) * 2018-03-28 2022-01-18 株式会社Ｇｓユアサ インフラシステムズ スイッチング電源装置
JP7065677B2 (ja) * 2018-04-03 2022-05-12 三菱電機株式会社 パワーモジュール製造装置およびパワーモジュールの製造方法
JP7084247B2 (ja) * 2018-08-02 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置、成形型、及び樹脂成形品の製造方法
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
CN112873810A (zh) * 2019-11-29 2021-06-01 复盛应用科技股份有限公司 高尔夫球杆头盖片制造方法及模具
CN111029265B (zh) * 2019-12-26 2021-11-23 珠海格力电器股份有限公司 一种防止qfn模封框架翘曲的塑封模具及方法
JP2021163960A (ja) 2020-03-30 2021-10-11 日東電工株式会社 デバイス封止方法、デバイス封止装置、および半導体製品の製造方法
JP2021163959A (ja) 2020-03-30 2021-10-11 日東電工株式会社 デバイス封止方法、デバイス封止装置、および半導体製品の製造方法
JP2022132971A (ja) 2021-03-01 2022-09-13 日東電工株式会社 ワークとシート材の一体化方法、ワークとシート材の一体化装置、および半導体製品の製造方法
JP2023031537A (ja) 2021-08-25 2023-03-09 日東電工株式会社 半導体装置の製造方法、ワーク一体化装置、およびフィルム積層体
JP2023035608A (ja) * 2021-09-01 2023-03-13 キオクシア株式会社 半導体装置の製造方法
JP2023083988A (ja) * 2021-12-06 2023-06-16 アピックヤマダ株式会社 樹脂封止装置及び封止金型
CN116646264B (zh) * 2023-06-08 2024-01-30 乐安博特半导体有限公司 集成电路封装方法

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WO2014192456A1 (ja) * 2013-05-29 2014-12-04 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
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JP6438794B2 (ja) * 2015-02-17 2018-12-19 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法

Also Published As

Publication number Publication date
KR102228644B1 (ko) 2021-03-15
KR102192732B1 (ko) 2020-12-17
JP2017087551A (ja) 2017-05-25
CN111403303B (zh) 2023-09-01
CN111403303A (zh) 2020-07-10
WO2017081883A1 (ja) 2017-05-18
CN116435200A (zh) 2023-07-14
TWI617419B (zh) 2018-03-11
KR20180081791A (ko) 2018-07-17
TW201722681A (zh) 2017-07-01
KR20200098738A (ko) 2020-08-20
CN108025466A (zh) 2018-05-11
CN108025466B (zh) 2020-03-27

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