JP4755068B2 - 電子部品の樹脂封止金型 - Google Patents
電子部品の樹脂封止金型 Download PDFInfo
- Publication number
- JP4755068B2 JP4755068B2 JP2006298031A JP2006298031A JP4755068B2 JP 4755068 B2 JP4755068 B2 JP 4755068B2 JP 2006298031 A JP2006298031 A JP 2006298031A JP 2006298031 A JP2006298031 A JP 2006298031A JP 4755068 B2 JP4755068 B2 JP 4755068B2
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- JP
- Japan
- Prior art keywords
- mold
- resin
- molds
- chromium carbide
- carbide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
2 可動下型
3 上キャビティ
4 下キャビティ
5 電子部品
6 基板
7 セット用凹所
8 ポット
9 プランジャ
10 樹脂通路
11 加熱手段
12 加熱手段
13 樹脂成形体(成形品)
14 エジェクターピン
15 エジェクターピン
16 嵌合孔
17 嵌合孔
18 エアベント
19 カル
20 ランナ・ゲート
A 炭化クロム薄膜層
R 樹脂材料(成形材料)
Claims (4)
- 電子部品を樹脂材料にて封止成形する電子部品の樹脂封止金型であって、
前記金型の表面における所要個所に、炭化クロム膜を真空成膜法により成膜するように構成したことを特徴とする樹脂材料の離型性に優れた電子部品の樹脂封止金型。 - 前記樹脂材料としてエポキシ樹脂を用いる請求項1に記載の電子部品の樹脂封止金型。
- 前記樹脂材料としてノンハロゲン系材料を用いる請求項1に記載の電子部品の樹脂封止金型。
- 前記炭化クロム膜は、CrxC1-xにより組成されると共に、前記xの組成量は、0.3以上0.5以下となるように構成したものである請求項1〜3のいずれかに記載の電子部品の樹脂封止金型。
Priority Applications (1)
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JP2006298031A JP4755068B2 (ja) | 2006-11-01 | 2006-11-01 | 電子部品の樹脂封止金型 |
Applications Claiming Priority (1)
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JP2006298031A JP4755068B2 (ja) | 2006-11-01 | 2006-11-01 | 電子部品の樹脂封止金型 |
Publications (2)
Publication Number | Publication Date |
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JP2008114418A JP2008114418A (ja) | 2008-05-22 |
JP4755068B2 true JP4755068B2 (ja) | 2011-08-24 |
Family
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JP2006298031A Active JP4755068B2 (ja) | 2006-11-01 | 2006-11-01 | 電子部品の樹脂封止金型 |
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JP (1) | JP4755068B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108028235A (zh) * | 2015-11-09 | 2018-05-11 | 东和株式会社 | 树脂封装装置以及树脂封装方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6081580B2 (ja) * | 2013-04-22 | 2017-02-15 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
JP6506680B2 (ja) * | 2015-11-09 | 2019-04-24 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
CN107377977A (zh) * | 2017-07-18 | 2017-11-24 | 东莞华晶粉末冶金有限公司 | 一种mim工艺制作手机卡托的方法和设备 |
GB2570104B (en) * | 2017-12-18 | 2021-12-29 | Composite Integration Ltd | Improved system and method for resin transfer moulding |
Citations (10)
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JPH1158404A (ja) * | 1997-08-28 | 1999-03-02 | Sony Corp | 半導体装置製造用金型 |
JP2000254922A (ja) * | 1999-03-08 | 2000-09-19 | Citizen Watch Co Ltd | 樹脂成形用金型および樹脂成形用金型への硬質被膜形成方法 |
JP2001098306A (ja) * | 1999-09-24 | 2001-04-10 | Honda Motor Co Ltd | 複合材製金型 |
JP2001196402A (ja) * | 1996-01-31 | 2001-07-19 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
JP2001515791A (ja) * | 1997-09-10 | 2001-09-25 | ヴェファ・ヴェルクツォイクファブリック・ジンゲン・ゲー・エム・ベー・ハー | 押出し金型とその製造法 |
JP2002018879A (ja) * | 2000-07-07 | 2002-01-22 | Ishikawajima Harima Heavy Ind Co Ltd | カレンダーロール及び該カレンダーロールの表面処理方法 |
JP2002167659A (ja) * | 2000-11-30 | 2002-06-11 | Shinko Seiki Co Ltd | 炭化クロム薄膜の成膜方法および成膜装置 |
JP2002307501A (ja) * | 2001-04-06 | 2002-10-23 | Sekisui Chem Co Ltd | 射出成形装置 |
JP2003146690A (ja) * | 2001-11-07 | 2003-05-21 | Matsushita Electric Ind Co Ltd | ガラス基板成形用金型、その製造方法およびガラス基板成形方法 |
JP2005041107A (ja) * | 2003-07-22 | 2005-02-17 | Olympus Corp | プレス成形金型用複合材料の製造方法及びプレス成形金型用複合材料並びにプレス成形金型 |
-
2006
- 2006-11-01 JP JP2006298031A patent/JP4755068B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196402A (ja) * | 1996-01-31 | 2001-07-19 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
JPH1158404A (ja) * | 1997-08-28 | 1999-03-02 | Sony Corp | 半導体装置製造用金型 |
JP2001515791A (ja) * | 1997-09-10 | 2001-09-25 | ヴェファ・ヴェルクツォイクファブリック・ジンゲン・ゲー・エム・ベー・ハー | 押出し金型とその製造法 |
JP2000254922A (ja) * | 1999-03-08 | 2000-09-19 | Citizen Watch Co Ltd | 樹脂成形用金型および樹脂成形用金型への硬質被膜形成方法 |
JP2001098306A (ja) * | 1999-09-24 | 2001-04-10 | Honda Motor Co Ltd | 複合材製金型 |
JP2002018879A (ja) * | 2000-07-07 | 2002-01-22 | Ishikawajima Harima Heavy Ind Co Ltd | カレンダーロール及び該カレンダーロールの表面処理方法 |
JP2002167659A (ja) * | 2000-11-30 | 2002-06-11 | Shinko Seiki Co Ltd | 炭化クロム薄膜の成膜方法および成膜装置 |
JP2002307501A (ja) * | 2001-04-06 | 2002-10-23 | Sekisui Chem Co Ltd | 射出成形装置 |
JP2003146690A (ja) * | 2001-11-07 | 2003-05-21 | Matsushita Electric Ind Co Ltd | ガラス基板成形用金型、その製造方法およびガラス基板成形方法 |
JP2005041107A (ja) * | 2003-07-22 | 2005-02-17 | Olympus Corp | プレス成形金型用複合材料の製造方法及びプレス成形金型用複合材料並びにプレス成形金型 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108028235A (zh) * | 2015-11-09 | 2018-05-11 | 东和株式会社 | 树脂封装装置以及树脂封装方法 |
CN108028235B (zh) * | 2015-11-09 | 2021-02-12 | 东和株式会社 | 树脂封装装置以及树脂封装方法 |
Also Published As
Publication number | Publication date |
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JP2008114418A (ja) | 2008-05-22 |
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