KR102192732B1 - 수지 밀봉 장치 및 수지 밀봉 방법 - Google Patents

수지 밀봉 장치 및 수지 밀봉 방법 Download PDF

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Publication number
KR102192732B1
KR102192732B1 KR1020187016324A KR20187016324A KR102192732B1 KR 102192732 B1 KR102192732 B1 KR 102192732B1 KR 1020187016324 A KR1020187016324 A KR 1020187016324A KR 20187016324 A KR20187016324 A KR 20187016324A KR 102192732 B1 KR102192732 B1 KR 102192732B1
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KR
South Korea
Prior art keywords
resin
substrate
molding
die
resin sealing
Prior art date
Application number
KR1020187016324A
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English (en)
Korean (ko)
Other versions
KR20180081791A (ko
Inventor
신지 타카세
타카시 타무라
Original Assignee
토와 가부시기가이샤
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Publication of KR20180081791A publication Critical patent/KR20180081791A/ko
Application granted granted Critical
Publication of KR102192732B1 publication Critical patent/KR102192732B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020187016324A 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법 KR102192732B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015219978A JP6506680B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法
JPJP-P-2015-219978 2015-11-09
PCT/JP2016/069186 WO2017081883A1 (ja) 2015-11-09 2016-06-28 樹脂封止装置及び樹脂封止方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207023465A Division KR102228644B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법

Publications (2)

Publication Number Publication Date
KR20180081791A KR20180081791A (ko) 2018-07-17
KR102192732B1 true KR102192732B1 (ko) 2020-12-17

Family

ID=58695967

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187016324A KR102192732B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법
KR1020207023465A KR102228644B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207023465A KR102228644B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법

Country Status (5)

Country Link
JP (1) JP6506680B2 (zh)
KR (2) KR102192732B1 (zh)
CN (3) CN108025466B (zh)
TW (1) TWI617419B (zh)
WO (1) WO2017081883A1 (zh)

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JP6861609B2 (ja) * 2017-10-30 2021-04-21 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6541746B2 (ja) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6876637B2 (ja) * 2018-01-22 2021-05-26 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP6998252B2 (ja) * 2018-03-28 2022-01-18 株式会社Ｇｓユアサ インフラシステムズ スイッチング電源装置
JP7065677B2 (ja) * 2018-04-03 2022-05-12 三菱電機株式会社 パワーモジュール製造装置およびパワーモジュールの製造方法
JP7084247B2 (ja) * 2018-08-02 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置、成形型、及び樹脂成形品の製造方法
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
CN112873810A (zh) * 2019-11-29 2021-06-01 复盛应用科技股份有限公司 高尔夫球杆头盖片制造方法及模具
CN111029265B (zh) * 2019-12-26 2021-11-23 珠海格力电器股份有限公司 一种防止qfn模封框架翘曲的塑封模具及方法
JP2021163960A (ja) 2020-03-30 2021-10-11 日東電工株式会社 デバイス封止方法、デバイス封止装置、および半導体製品の製造方法
JP2021163959A (ja) 2020-03-30 2021-10-11 日東電工株式会社 デバイス封止方法、デバイス封止装置、および半導体製品の製造方法
JP2022132971A (ja) 2021-03-01 2022-09-13 日東電工株式会社 ワークとシート材の一体化方法、ワークとシート材の一体化装置、および半導体製品の製造方法
JP2023031537A (ja) 2021-08-25 2023-03-09 日東電工株式会社 半導体装置の製造方法、ワーク一体化装置、およびフィルム積層体
JP2023035608A (ja) * 2021-09-01 2023-03-13 キオクシア株式会社 半導体装置の製造方法
JP2023083988A (ja) * 2021-12-06 2023-06-16 アピックヤマダ株式会社 樹脂封止装置及び封止金型
CN116646264B (zh) * 2023-06-08 2024-01-30 乐安博特半导体有限公司 集成电路封装方法

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JP2012146770A (ja) 2011-01-11 2012-08-02 Apic Yamada Corp 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP2012256803A (ja) 2011-06-10 2012-12-27 Mitsubishi Electric Corp パワーモジュールとその製造方法

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JP6438794B2 (ja) * 2015-02-17 2018-12-19 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法

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JP2008114418A (ja) 2006-11-01 2008-05-22 Towa Corp 電子部品の樹脂封止金型
JP2012146770A (ja) 2011-01-11 2012-08-02 Apic Yamada Corp 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP2012256803A (ja) 2011-06-10 2012-12-27 Mitsubishi Electric Corp パワーモジュールとその製造方法

Also Published As

Publication number Publication date
TWI617419B (zh) 2018-03-11
KR102228644B1 (ko) 2021-03-15
CN116435200A (zh) 2023-07-14
TW201722681A (zh) 2017-07-01
WO2017081883A1 (ja) 2017-05-18
CN108025466A (zh) 2018-05-11
CN111403303A (zh) 2020-07-10
KR20180081791A (ko) 2018-07-17
CN108025466B (zh) 2020-03-27
JP6506680B2 (ja) 2019-04-24
KR20200098738A (ko) 2020-08-20
JP2017087551A (ja) 2017-05-25
CN111403303B (zh) 2023-09-01

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